Patents by Inventor Yukio Ochitani

Yukio Ochitani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11932785
    Abstract: The present invention provides an epoxy adhesive composition capable of reducing re-aggregation of an adhesive layer modifier, maintaining favorable viscosity for a long period of time, exhibiting high adhesiveness, and reducing process failures during application of the adhesive. Provided is an epoxy adhesive composition containing: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; an adhesive layer modifier; and an epoxy resin, the epoxy adhesive composition having a ratio of an acid-modified group equivalent of the modified polyvinyl acetal resin to an epoxy equivalent of the epoxy resin (acid-modified group equivalent/epoxy equivalent) of 5.0 to 150.0, the epoxy adhesive composition having a number ratio of the acid-modified group to an epoxy group (acid-modified group number/epoxy group number) of 0.0005 to 0.5.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: March 19, 2024
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Tasuku Yamada, Shiori Tateno, Yousuke Chiba, Takayuki Maeda, Yukio Ochitani, Hideaki Tanaka
  • Publication number: 20210002528
    Abstract: The present invention provides an epoxy adhesive composition capable of reducing re-aggregation of an adhesive layer modifier, maintaining favorable viscosity for a long period of time, exhibiting high adhesiveness, and reducing process failures during application of the adhesive. Provided is an epoxy adhesive composition containing: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; an adhesive layer modifier; and an epoxy resin, the epoxy adhesive composition having a ratio of an acid-modified group equivalent of the modified polyvinyl acetal resin to an epoxy equivalent of the epoxy resin (acid-modified group equivalent/epoxy equivalent) of 5.0 to 150.0, the epoxy adhesive composition having a number ratio of the acid-modified group to an epoxy group (acid-modified group number/epoxy group number) of 0.0005 to 0.5.
    Type: Application
    Filed: March 11, 2019
    Publication date: January 7, 2021
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Tasuku YAMADA, Shiori TATENO, Yousuke CHIBA, Takayuki MAEDA, Yukio OCHITANI, Hideaki TANAKA
  • Patent number: 7569166
    Abstract: It is the object of the present invention to provide a binder resin for coating paste, comprising a polyvinyl acetal type resin, having an excellent dispersibility of inorganic powder such as conductive powder, ceramic powder and glass powder and being capable of exerting an extremely excellent coating property, particularly a printing property, when dispersing the inorganic powder to form paste, conductive paste, ceramic paste and glass paste. in the formulas, R1 represents a straight chain or branched alkyl group having 1 to 20 carbon atoms, and R2 represents hydrogen, a straight chain, branched or cyclic alkyl group having 1 to 20 carbon atoms, or an aryl group; and n represents an integer of 1 to 8; and further in the modified polyvinyl acetal resin, a content of the structural unit represented by the general formula (3) is 1 to 20 mol % and a content of the structural unit represented by the general formula (4) is 30 to 78 mol %.
    Type: Grant
    Filed: June 28, 2004
    Date of Patent: August 4, 2009
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Motokuni Ichitani, Daizo Ii, Yukio Ochitani, Hideyuki Takahashi, Katsuaki Sakashita
  • Publication number: 20060192180
    Abstract: It is the object of the present invention to provide a binder resin for coating paste, comprising a polyvinyl acetal type resin, having an excellent dispersibility of inorganic powder such as conductive powder, ceramic powder and glass powder and being capable of exerting an extremely excellent coating property, particularly a printing property, when dispersing the inorganic powder to form paste, conductive paste, ceramic paste and glass paste. The present invention is a binder resin for coating paste for forming a film or a film pattern comprising inorganic powder by coating, which comprises a modified polyvinyl acetal resin comprising structural units represented by the following general formulas (1), (2), (3) and (4): [Chem.
    Type: Application
    Filed: June 28, 2004
    Publication date: August 31, 2006
    Inventors: Motokuni Ichitani, Daizo Ii, Yukio Ochitani, Hideyuki Takahashi, Katsuaki Sakashita