Patents by Inventor Yukio Ohota

Yukio Ohota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5624506
    Abstract: A copper alloy for use in an electrical and electronic parts contains Fe of 1.8-2.0 weight %, P of 0.025-0.040 weight %, Zn of 1.7-1.9 weight %, Sn of 0.40-1.0 weight %, and Ca of 0.0001-0.01 weight %, the balance being Cu and inevitable impurities. Further the copper alloy may contain one kind or two kinds of the elements selected from the group of Cr of 0.001-0.01 weight % and Mg of 0.001-0.01 weight %, by 0.001-0.01 weight % at a total amount. This copper alloy for use in electrical and electronic parts can dissolve the prior problem that cracking is apt to occur on the ingot during heating on the hot working process or during hot working, and can prevent a short-circuit due to the migration phenomenon of copper which is apt to occur with the high density integration of the electrical and electronic parts made of copper alloy, and further can improve the tool service life (wear resistance) of the die and can decrease the producing cost thereof.
    Type: Grant
    Filed: August 9, 1995
    Date of Patent: April 29, 1997
    Assignees: Kabushiki Kaisha Kobe Seiko Sho, Yazaki Corporation
    Inventors: Yoshinobu Tsuzaki, Tetsuo Kato, Yukio Ohota, Naoki Kakuta