Patents by Inventor Yukio Okoshi

Yukio Okoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5133989
    Abstract: The present invention provides a process for producing a metal-polyimide composite material such as a wiring board. In production thereof, deterioration of polyamide film due to oxidation during imidization of a polyimide precursor in contact with metal such as copper or silver can be prevented. The present invention is characterized by using a polyimide precursor having an acidic functional group which is masked. Examples of the polyamide precursor are polyamic acid epoxy adducts, amido polyamic acids, silylated polyamic acids, etc.
    Type: Grant
    Filed: September 27, 1989
    Date of Patent: July 28, 1992
    Assignee: Hitachi, Ltd.
    Inventors: Shunichi Numata, Takao Miwa, Takayoshi Ikeda, Koji Fujisaki, Hisae Shimanoki, Kunio Miyazaki, Osamu Miura, Ryuji Watanabe, Toshio Miyamoto, Yukio Okoshi
  • Patent number: 4690793
    Abstract: The nuclear fusion reactor of the present invention presents a new vacuum vessel for enclosing plasma particles where a reactor wall exposed to the above plasma particles has a piled structure. A plurality of heat-resisting ceramic tiles are metallurgically bonded to a metal-base body having a cooling means through a brazing material. The ceramic tiles are preferably composed of sintered silicon carbide of high density and containing a little beryllium oxide between the boundaries of crystal grains.
    Type: Grant
    Filed: February 17, 1984
    Date of Patent: September 1, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Hisanori Okamura, Kunio Miyazaki, Hirosi Akiyama, Shinichi Itoh, Tomio Yasuda, Kousuke Nakamura, Yukio Okoshi, Mutuo Kamoshita, Akio Chiba