Patents by Inventor Yukio Saigo

Yukio Saigo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of producing the same
    Patent number: 6191494
    Abstract: A semiconductor device and a method of producing the same are provided. The semiconductor device includes: a semiconductor chip; a resin package which seals the semiconductor chip; signal passages which guide the signal terminals of the semiconductor chip outward from the resin package; a grounding metal film in contact with the bottom surface of the semiconductor chip; and a grounding passage which is connected to the grounding metal film and guided outward from the resin package.
    Type: Grant
    Filed: June 29, 1999
    Date of Patent: February 20, 2001
    Assignee: Fujitsu Limited
    Inventors: Nobuo Ooyama, Shinichiro Maki, Fumitoshi Fujisaki, Syunichi Kuramoto, Yukio Saigo, Yasuo Yatsuda, Youichi Matae, Atsushi Yano, Kazuto Tsuji, Masafumi Tetaka
  • Process for manufacturing a packaged semiconductor having a divided leadframe stage
    Patent number: 5804468
    Abstract: A process for manufacturing semiconductor device having a package in which a semiconductor device is sealed includes a base, and a metallic film is formed on a surface of the base. The semiconductor chip is formed on the metallic film. A pad formed on the semiconductor chip is connected to the metallic film by a wire. A sealing layer is formed on the metallic film. Leads are formed on the glass layer. A connecting layer is formed on the metallic film and contains electrically conductive particles. The connecting layer is in contact with a lead for a power supply system and connecting the metallic film to the lead.
    Type: Grant
    Filed: November 21, 1995
    Date of Patent: September 8, 1998
    Assignees: Fujitsu Limited, Kyushu Fujitsu Electronics Limited
    Inventors: Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Michio Sono, Ichiro Yamaguchi, Toshio Hamano, Yoshihiro Kubota, Michio Hayakawa, Yoshihiko Ikemoto, Yukio Saigo, Naomi Miyaji
  • Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device
    Patent number: 5750421
    Abstract: A semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.
    Type: Grant
    Filed: January 27, 1997
    Date of Patent: May 12, 1998
    Assignees: Fujitsu Limited, Kyushu Fujitsu Electronics Limited, Fujitsu Automation Limited
    Inventors: Junichi Kasai, Kazuto Tsuji, Norio Taniguchi, Takashi Mashiko, Masao Sakuma, Yukio Saigo, Yoshiyuki Yoneda, Masashi Takenaka
  • Process for manufacturing a semiconductor device having a stepped encapsulated package
    Patent number: 5736428
    Abstract: A process for manufacturing semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.
    Type: Grant
    Filed: January 27, 1997
    Date of Patent: April 7, 1998
    Assignees: Fujitsu Limited, Kyushu Fujitsu Electronics Limited, Fujitsu Automation Limited
    Inventors: Junichi Kasai, Kazuto Tsuji, Norio Taniguchi, Takashi Mashiko, Masao Sakuma, Yukio Saigo, Yoshiyuki Yoneda, Masashi Takenaka
  • Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device
    Patent number: 5666064
    Abstract: A semiconductor device comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads of the leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.
    Type: Grant
    Filed: May 15, 1995
    Date of Patent: September 9, 1997
    Assignees: Fujitsu Limited, Kyushu Fujitsu Elecronics Limited, Fujitsu Automation Limited
    Inventors: Junichi Kasai, Kazuto Tsuji, Norio Taniguchi, Takashi Mashiko, Masao Sakuma, Yukio Saigo, Yoshiyuki Yoneda, Masashi Takenaka
  • Semiconductor device and lead frame therefore
    Patent number: 5497032
    Abstract: A semiconductor device having a package in which a semiconductor device is sealed includes a base, and a metallic film is formed on a surface of the base. The semiconductor chip is formed on the metallic film. A pad formed on the semiconductor chip is connected to the metallic film by a wire. A sealing layer is formed on the metallic film. Leads are formed on the glass layer. A connecting layer is formed on the metallic film and contains electrically conductive particles. The connecting layer is in contact with a lead for a power supply system and connecting the metallic film to the lead.
    Type: Grant
    Filed: March 16, 1994
    Date of Patent: March 5, 1996
    Assignees: Fujitsu Limited, Kyushu Fujitsu Electronics Limited
    Inventors: Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Michio Sono, Ichiro Yamaguchi, Toshio Hamano, Yoshihiro Kubota, Michio Hayakawa, Yoshihiko Ikemoto, Yukio Saigo, Naomi Miyaji
  • Semiconductor device and carrier for carrying semiconductor device
    Patent number: 5475259
    Abstract: A semiconductor device comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads of the leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.
    Type: Grant
    Filed: October 16, 1992
    Date of Patent: December 12, 1995
    Assignees: Fujitsu Limited, Kyushu Fujitsu Electronics Limited, Fujitsu Automation Limited
    Inventors: Junichi Kasai, Kazuto Tsuji, Norio Taniguchi, Takashi Mashiko, Masao Sakuma, Yukio Saigo, Yoshiyuki Yoneda, Masashi Takenaka