Patents by Inventor Yukio Sanada
Yukio Sanada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20160255725Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.Type: ApplicationFiled: May 11, 2016Publication date: September 1, 2016Inventors: Yasuhiro NISHISAKA, Yukio SANADA, Koji SATO, Seiichi MATSUMOTO
-
Patent number: 9378874Abstract: A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end portion of a first major surface in the longitudinal direction. The second external electrode is disposed at a second end portion of the first major surface in the longitudinal direction. A portion of each of the first and second external electrodes is opposed in the thickness direction to a region where the first and second internal electrodes are opposed to each other in the thickness direction. A condition ( 1/10)t0?t1 ?(?)t0 is satisfied, where to is the thickness of each of the first and second external electrodes and t1 is the thickness of a portion in which each of the first and second external electrodes is embedded in the first major surface.Type: GrantFiled: July 1, 2014Date of Patent: June 28, 2016Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Koji Sato, Yukio Sanada, Yasuhiro Nishisaka, Masaki Hirota
-
Patent number: 9363896Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.Type: GrantFiled: January 14, 2014Date of Patent: June 7, 2016Assignee: Murata Manufacturing Co., Ltd.Inventors: Yasuhiro Nishisaka, Yukio Sanada, Koji Sato, Seiichi Matsumoto
-
Publication number: 20160133398Abstract: A ceramic electronic component includes a ceramic body, a glass coating layer, and an electrode terminal. The ceramic body includes a plurality of internal electrodes whose ends are exposed on the surface of the ceramic body. The glass coating layer covers a portion of the ceramic body on which the internal electrodes are exposed. The electrode terminal is provided directly on the glass coating layer. The electrode terminal includes a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The metal powder particles define conduction paths that electrically connect the internal electrodes with the electrode terminal.Type: ApplicationFiled: January 20, 2016Publication date: May 12, 2016Inventors: Yasuhiro NISHISAKA, Yukio SANADA, Tetsuya KISUMI, Toshiki NAGAMOTO, Masato KIMURA, Seiji KOGA
-
Patent number: 9275804Abstract: A ceramic electronic component includes a ceramic body, a glass coating layer, and an electrode terminal. The ceramic body includes a plurality of internal electrodes whose ends are exposed on the surface of the ceramic body. The glass coating layer covers a portion of the ceramic body on which the internal electrodes are exposed. The electrode terminal is provided directly on the glass coating layer. The electrode terminal includes a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The metal powder particles define conduction paths that electrically connect the internal electrodes with the electrode terminal.Type: GrantFiled: January 31, 2013Date of Patent: March 1, 2016Assignee: Murata Manufacturing Co., Ltd.Inventors: Yasuhiro Nishisaka, Yukio Sanada, Tetsuya Kisumi, Toshiki Nagamoto, Masato Kimura, Seiji Koga
-
Patent number: 9232673Abstract: A ceramic electronic component includes a ceramic body; a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a coating layer covering a surface portion of the ceramic body on which the internal electrodes are exposed, the coating layer being made of a glass or resin medium in which metal powder particles are dispersed; and an electrode terminal provided directly on the coating layer and including a plating film. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal and have an elongated shape in cross section along a thickness direction of the coating layer. The metal powder particles defining the conduction paths have a maximum diameter not smaller than the thickness of the coating layer.Type: GrantFiled: January 31, 2013Date of Patent: January 5, 2016Assignee: Murata Manufacturing Co., Ltd.Inventors: Yasuhiro Nishisaka, Yukio Sanada, Tetsuya Kisumi, Toshiki Nagamoto
-
Patent number: 9224543Abstract: A ceramic electronic component includes a ceramic body, a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a glass coating layer covering a portion of the surface of the ceramic body on which the internal electrodes are exposed; and an electrode terminal provided directly on the glass coating layer and including a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The internal electrodes project from the surface of the ceramic body into the glass coating layer without passing through the glass coating layer. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal.Type: GrantFiled: January 31, 2013Date of Patent: December 29, 2015Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yasuhiro Nishisaka, Yukio Sanada, Tetsuya Kisumi, Akira Ishizuka
-
Method of manufacturing ceramic electronic component, ceramic electronic component, and wiring board
Patent number: 9007161Abstract: A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.Type: GrantFiled: July 24, 2014Date of Patent: April 14, 2015Assignee: Murata Manufacturing Co. Ltd.Inventors: Koji Sato, Yukio Sanada, Yasuhiro Nishisaka -
Patent number: 8891225Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.Type: GrantFiled: November 5, 2013Date of Patent: November 18, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Yasuhiro Nishisaka, Yukio Sanada, Koji Sato, Seiichi Matsumoto
-
METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT, CERAMIC ELECTRONIC COMPONENT, AND WIRING BOARD
Publication number: 20140332260Abstract: A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.Type: ApplicationFiled: July 24, 2014Publication date: November 13, 2014Inventors: Koji SATO, Yukio SANADA, Yasuhiro NISHISAKA -
Publication number: 20140312743Abstract: A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end portion of a first major surface in the longitudinal direction. The second external electrode is disposed at a second end portion of the first major surface in the longitudinal direction. A portion of each of the first and second external electrodes is opposed in the thickness direction to a region where the first and second internal electrodes are opposed to each other in the thickness direction. A condition ( 1/10)t0?t1 ?(?)t0 is satisfied, where to is the thickness of each of the first and second external electrodes and t1 is the thickness of a portion in which each of the first and second external electrodes is embedded in the first major surface.Type: ApplicationFiled: July 1, 2014Publication date: October 23, 2014Inventors: Koji SATO, Yukio SANADA, Yasuhiro NISHISAKA, Masaki HIROTA
-
Patent number: 8819932Abstract: A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.Type: GrantFiled: July 18, 2011Date of Patent: September 2, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Koji Sato, Yukio Sanada, Yasuhiro Nishisaka
-
Patent number: 8804302Abstract: A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end portion of a first major surface in the longitudinal direction. The second external electrode is disposed at a second end portion of the first major surface in the longitudinal direction. A portion of each of the first and second external electrodes is opposed in the thickness direction to a region where the first and second internal electrodes are opposed to each other in the thickness direction. A condition ( 1/10)t0?t1?(?)t0 is satisfied, where t0 is the thickness of each of the first and second external electrodes and t1 is the thickness of a portion in which each of the first and second external electrodes is embedded in the first major surface.Type: GrantFiled: July 21, 2011Date of Patent: August 12, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Koji Sato, Yukio Sanada, Yasuhiro Nishisaka, Masaki Hirota
-
Patent number: 8754335Abstract: A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external electrodes are provided on a first principal surface. Portions of the first and second external electrodes project further than the other portions in a thickness direction. A projecting portion of the first external electrode is provided at one end of the first external electrode in a length direction and a second projecting portion of the second external electrode is provided at another end of the second external electrode in the length direction. Thus, a concave portion is provided between the projecting portions, and a portion of the first principal surface provided between the first and second external electrodes is exposed.Type: GrantFiled: July 8, 2011Date of Patent: June 17, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Koji Sato, Yukio Sanada, Yasuhiro Nishisaka
-
Patent number: 8721820Abstract: A method for manufacturing a multilayer ceramic electronic component significantly reduces and prevents swelling or distortion when a conductive paste is applied to a green ceramic element body. A ceramic green sheet used in the method satisfies 180.56?A/B wherein A is a polymerization degree of an organic binder contained in the ceramic green sheet, and B is a volume content of a plasticizer contained in the ceramic green sheet.Type: GrantFiled: September 4, 2012Date of Patent: May 13, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Koji Sato, Yukio Sanada, Yasuhiro Nishisaka
-
Publication number: 20140127493Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.Type: ApplicationFiled: January 14, 2014Publication date: May 8, 2014Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Yasuhiro NISHISAKA, Yukio SANADA, Koji SATO, Seiichi MATSUMOTO
-
Publication number: 20140049873Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.Type: ApplicationFiled: November 5, 2013Publication date: February 20, 2014Applicant: Murata Manufacturing Co., Ltd.Inventors: Yasuhiro NISHISAKA, Yukio SANADA, Koji SATO, Seiichi MATSUMOTO
-
Patent number: 8587925Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.Type: GrantFiled: June 21, 2013Date of Patent: November 19, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Yasuhiro Nishisaka, Yukio Sanada, Koji Sato, Seiichi Matsumoto
-
Publication number: 20130279073Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.Type: ApplicationFiled: June 21, 2013Publication date: October 24, 2013Inventors: Yasuhiro NISHISAKA, Yukio SANADA, Koji SATO, Seiichi MATSUMOTO
-
Patent number: 8564931Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.Type: GrantFiled: May 25, 2011Date of Patent: October 22, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Yasuhiro Nishisaka, Yukio Sanada, Koji Sato, Seiichi Matsumoto