Patents by Inventor Yukio Sasaki
Yukio Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11851777Abstract: There is provided a hydrogen gas mixing device, including: a water electrolysis part configured to generate a hydrogen gas and an oxygen gas by electrolysis of water; a mixing gas supply part configured to supply a mixing gas; and a gas mixing part configured to mix the hydrogen gas and the mixing gas, wherein a non-combustible dilution gas is introduced into an oxygen flow part of the water electrolysis part through which the oxygen gas flows.Type: GrantFiled: December 28, 2020Date of Patent: December 26, 2023Assignee: YAMAHA FINE TECHNOLOGIES CO., LTD.Inventors: Hisashi Ichinokiyama, Takeshi Katoh, Toru Ishii, Yukio Sasaki
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Patent number: 11471841Abstract: There is provided a hydrogen gas mixing device that includes a hydrogen generation part configured to generate a hydrogen gas; a mixing gas supply part configured to supply a mixing gas; a gas mixing part configured to mix the hydrogen gas and the mixing gas; a dilution gas supply part configured to supply a non-combustible dilution gas; and a valve circuit configured to, at an abnormality occurrence time, dilute the hydrogen gas with the dilution gas by connecting a first path for the hydrogen gas supplied from the hydrogen generation part and a second path for the dilution gas supplied from the dilution gas supply part.Type: GrantFiled: December 28, 2020Date of Patent: October 18, 2022Assignee: YAMAHA FINE TECHNOLOGIES CO., LTD.Inventors: Hisashi Ichinokiyama, Takeshi Katoh, Toru Ishii, Yukio Sasaki
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Publication number: 20210213398Abstract: There is provided a hydrogen gas mixing device that includes a hydrogen generation part configured to generate a hydrogen gas; a mixing gas supply part configured to supply a mixing gas; a gas mixing part configured to mix the hydrogen gas and the mixing gas; a dilution gas supply part configured to supply a non-combustible dilution gas; and a valve circuit configured to, at an abnormality occurrence time, dilute the hydrogen gas with the dilution gas by connecting a first path for the hydrogen gas supplied from the hydrogen generation part and a second path for the dilution gas supplied from the dilution gas supply part.Type: ApplicationFiled: December 28, 2020Publication date: July 15, 2021Inventors: Hisashi ICHINOKIYAMA, Takeshi KATOH, Toru ISHII, Yukio SASAKI
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Publication number: 20210214853Abstract: There is provided a hydrogen gas mixing device, including: a water electrolysis part configured to generate a hydrogen gas and an oxygen gas by electrolysis of water; a mixing gas supply part configured to supply a mixing gas; and a gas mixing part configured to mix the hydrogen gas and the mixing gas, wherein a non-combustible dilution gas is introduced into an oxygen flow part of the water electrolysis part through which the oxygen gas flows.Type: ApplicationFiled: December 28, 2020Publication date: July 15, 2021Inventors: Hisashi ICHINOKIYAMA, Takeshi KATOH, Toru ISHII, Yukio SASAKI
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Publication number: 20100043352Abstract: A longitudinal sealing mechanism is adapted to seal an overlapped portion of a packaging material formed into a tubular shape with the overlapped portion extending along a conveying direction of the packaging material. The longitudinal sealing mechanism includes a contact section, a heating section and a receiving member. The contact section comes into contact with the overlapped portion of the packaging material. The heating section heats the contact section to perform longitudinal sealing of the overlapped portion to form a longitudinal seal portion. The receiving member abuts against the contact section with the overlapped portion of the packaging material being disposed therebetween. The contact section, the heating section, and the receiving member are arranged such that an amount of heat per unit time applied to the packaging material from the contact section decreases in a direction toward both sides of the longitudinal seal portion.Type: ApplicationFiled: October 5, 2007Publication date: February 25, 2010Applicant: ISHIDA CO., LTD.Inventors: Satoshi Hashimoto, Masahiko Tatsuoka, Yukio Sasaki
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Patent number: 7112824Abstract: A light-emitting diode array comprising a conductive layer formed on a substrate, pluralities of separate light-emitting portions formed on the conductive layer, a first groove formed in the conductive layer to divide the light-emitting portions to blocks, first electrodes each formed on at least part of an upper surface of each light-emitting portion, one second electrode formed directly on the conductive layer in each block, common switching wirings separately connected to the first electrodes, first bonding pads each connected to each common wiring, first bonding pads each connected to each common wiring, and second bonding pads each connected to each second electrode, n light-emitting portions (n is an even number) being arranged transversely in each block, and second grooves being formed in the conductive layer between adjacent light-emitting portions such that the second grooves are arranged short and long alternately, with the nearest one to the first groove being short.Type: GrantFiled: December 3, 2004Date of Patent: September 26, 2006Assignee: Hitachi Cable, Ltd.Inventors: Tomihisa Yukimoto, Eiichi Kunitake, Yukio Sasaki
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Publication number: 20060208265Abstract: A light emitting diode array comprises compound semiconductor layers epitaxially grown on a p-type GaAs conductive layer 11 formed on a semi-insulating GaAs substrate 30. The epitaxial layer is isolated and divided into a plurality of light emitting parts 1 which function as a light emitting diode. A Si-doped n-type GaAs buffer layer 31 is interposed between the semi-insulating GaAs substrate 30 and the p-type GaAs conductive layer 11. In the light emitting diode array comprising this epitaxial configuration, it is possible to prevent the short-circuit defect due to diffusion of p-type dopant from the p-type GaAs conductive layer into the semi-insulating GaAs substrate made by the LEC method.Type: ApplicationFiled: November 15, 2005Publication date: September 21, 2006Applicant: Hitachi Cable, Ltd.Inventors: Tomihisa Yukimoto, Eiichi Kunitake, Yukio Sasaki
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Publication number: 20050269579Abstract: A light-emitting diode array comprising a conductive layer formed on a substrate, pluralities of separate light-emitting portions formed on the conductive layer, a first groove formed in the conductive layer to divide the light-emitting portions to blocks, first electrodes each formed on at least part of an upper surface of each light-emitting portion, one second electrode formed directly on the conductive layer in each block, common switching wirings separately connected to the first electrodes, first bonding pads each connected to each common wiring, first bonding pads each connected to each common wiring, and second bonding pads each connected to each second electrode, n light-emitting portions (n is an even number) being arranged transversely in each block, and second grooves being formed in the conductive layer between adjacent light-emitting portions such that the second grooves are arranged short and long alternately, with the nearest one to the first groove being short.Type: ApplicationFiled: December 3, 2004Publication date: December 8, 2005Inventors: Tomihisa Yukimoto, Eiichi Kunitake, Yukio Sasaki
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Patent number: 6951090Abstract: A packaging machine has a former with a guiding member and tube for forming an elongated bag-making material into a tubular form, a longitudinal sealer disposed on the front side of the tube for sealing mutually overlapping side edge parts of the tubularly formed bag-making material in a longitudinal direction and a transverse sealer for sealing the longitudinally sealed bag-making material in a transverse direction transverse to the longitudinal direction to thereby package articles dropped down. The tube has a conical part at the top and a cylindrical part extending downward from the conical part. The cylindrical part has an opening on the back side such that articles dropped through the interior of the tube can directly contact the bag-making material and will be prevented from becoming clogged. An unopened part may be provided to the cylindrical part of the tube below the opening in order to maintain a circular cross-sectional shape of the bag-making material.Type: GrantFiled: July 6, 2004Date of Patent: October 4, 2005Assignee: Ishida Co., Ltd.Inventors: Masashi Kondo, Yukio Sasaki, Makoto Ichikawa
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Publication number: 20050188660Abstract: A packaging machine has a former with a guiding member and tube for forming an elongated bag-making material into a tubular form, a longitudinal sealer disposed on the front side of the tube for sealing mutually overlapping side edge parts of the tubularly formed bag-making material in a longitudinal direction and a transverse sealer for sealing the longitudinally sealed bag-making material in a transverse direction transverse to the longitudinal direction to thereby package articles dropped down. The tube has a conical part at the top and a cylindrical part extending downward from the conical part. The cylindrical part has an opening on the back side such that articles dropped through the interior of the tube can directly contact the bag-making material and will be prevented from becoming clogged. An unopened part may be provided to the cylindrical part of the tube below the opening in order to maintain a circular cross-sectional shape of the bag-making material.Type: ApplicationFiled: July 6, 2004Publication date: September 1, 2005Inventors: Masashi Kondo, Yukio Sasaki, Makoto Ichikawa
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Publication number: 20050173809Abstract: This invention is aimed at providing a wafer-level package which is capable of relaxing the stress in a chip-size package and exalting the reliability of the operation of mounting on a printed board and a method for the production thereof. This invention is directed toward a wafer-level package of a semiconductor substrate possessed of either or both of an electrode part and a wiring layer connected to an electrode part, which is provided on the semiconductor substrate with an insulating layer formed mainly of a fluorene skeleton-containing resin and on the electrode part with one step or a plurality of steps of posts, and on the posts with bumps formed of electroconductive balls and a method for the production thereof.Type: ApplicationFiled: January 19, 2005Publication date: August 11, 2005Inventors: Yukihiro Yamamoto, Keiji Iwata, Yukio Sasaki, Kohei Tatsumi, Vivek Dutta, Tomofumi Jin, Koji Nakamura, Shinji Inaba
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Patent number: 6619018Abstract: A bagging and packaging Machine has a substitute gas supply passage provided in a tube member 13 forming a part of a bag former 10 for forming a strip of packaging material into a bag. By securing a generally elongated plate 21 to a front inner side of the tube member 13 to thereby form the substitute gas supply passage 20 that extends in a direction parallel to the longitudinal sense of the packaging material from an upper portion down to a lower end portion of the tube member 13 and by rendering the cross-sectional area of the substitute gas supply passage 21 to be larger at a lower portion thereof than at an upper portion, the structure can be obtained in which a required quantity of substitute gas can be introduced into the bag-shaped packaging material at a moderate flow velocity.Type: GrantFiled: August 16, 2000Date of Patent: September 16, 2003Assignee: Ishida Co., Ltd.Inventor: Yukio Sasaki
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Patent number: 5595020Abstract: An assembly of pots for raising and transplanting seedlings. A plurality of cylindrical pots are made of paper and each pot is connected by a connection member into a continuous form. The connection member includes slits for allowing the spacing between adjacent pots to be elongated to a length corresponding to one intrarow spacing for various kinds of plants. The generally H-shaped or generally U-shaped slits can be vertically and alternatively provided from upper and lower edges of the connection member.Type: GrantFiled: April 25, 1995Date of Patent: January 21, 1997Assignee: Nihon Tensaiseito Kabushiki KaishaInventors: Sumio Ito, Hidekazu Terasawa, Yukio Sasaki
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Patent number: 4923912Abstract: An epoxy resin composition consisting essentially of(A) an epoxy resin,(B) a curing agent,(C) a curing promoter,(D) an organic silicon compound having at least one phenolic hydroxyl group per molecule, and(E) a filler.Type: GrantFiled: July 20, 1988Date of Patent: May 8, 1990Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Yukio Sasaki, Takayuki Watanabe, Hiroshi Takamiya, Kazuo Watanabe, Yoko Yamazaki
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Patent number: 4920164Abstract: An epoxy resin composition consisting essentially of(A) an epoxy resin,(B) a curing agent,(C) a curing promoter,(D) a polyphenylene ether resin, and(E) a filler.Type: GrantFiled: July 20, 1988Date of Patent: April 24, 1990Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Yukio Sasaki, Takayuki Watanabe, Hiroshi Takamiya, Kazuo Watanabe, Yoko Yamazaki
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Patent number: 4837970Abstract: A method for selecting live seeds of sugar beet (those which are able to germinate) from dead seeds (those which are unable to germinate) based on the case of seed-cap releasing. When immersed in water, live seeds absorb much water and expand appreciably, while dead seeds expand only slightly because less water is absorbed. This expansion of live seeds upon absorption of water makes the seed caps, closely fitted onto the outer shells of fruit, ready to be released. When mechanical vibrations are given to a mixture of water-soaked fruit, only the seed caps of expanded fruit are easily released. Thus live seeds of sugar beet can be effectively obtained by selecting out the fruit from which seed caps have been released.Type: GrantFiled: April 10, 1987Date of Patent: June 13, 1989Assignee: Nippon Tensaiseito Kabushiki KaishaInventor: Yukio Sasaki
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Patent number: 4641285Abstract: The line change-over circuit suitable for the semiconductor memory having a redundancy memory column comprises a pair of transfer gate elements provided between a first node to which a first signal to be transmitted is supplied and a pair of transmission lines, first and second switch elements. The paired transfer gate elements are controlled on a switch in complementary manner each other according to a transfer signal. The first switch element is controlled on a switch according to the transfer signal, and the second switch element is controlled on a switch according to the first signal transmitted to one of the paired transmission lines. The first switch element turns one of the transmission lines to a fixed potential like ground potential when it is kept on, and the second switch element turns the other of the transmission lines to a fixed potential when it is kept on. The line change-over circuit in the above configuration is effective to prevent a floating state of the paired transmission lines.Type: GrantFiled: August 13, 1984Date of Patent: February 3, 1987Assignee: Hitachi, Ltd.Inventors: Yukio Sasaki, Kotaro Nishimura, Osamu Minato
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Patent number: 4465631Abstract: A 5-substituted-3-isoxazolecarboxylic acid derivative of the general formula: ##STR1## wherein X stands for a phenyl group, thienyl group, furyl group or pyridyl group, each of which optionally may carry at least one substituent group; R stands for a phenyl group or hydroxyphenyl group; and A stands for a group of the formula: ##STR2## wherein Y stands for ##STR3## in which the carbon atom with which the carboxyl group combines with the nitrogen atom in A, M stands for a hydrogen atom or a substituent group, and Z stands for a hydrogen atom, hydroxy group, acyloxy group, carbamoyloxy group, aromatic heterocycle thio group or aromatic nitrogen-containing heterocycle quaternary ammonium group, is disclosed along with methods for producing these compounds.Type: GrantFiled: April 6, 1983Date of Patent: August 14, 1984Assignee: Ajinomoto Company, IncorporatedInventors: Naohiko Yasuda, Hisao Iwagami, Eiji Nakanishi, Yukio Sasaki, Shigeru Yamanaka
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Patent number: 4427814Abstract: A polyphenylene ether resin composition having improved heat stability and good color, said composition comprising a polyphenylene ether resin matrix, and dispersed therein, a diphosphonite of the formula ##STR1## wherein R.sub.1 groups are identical or different and each represents a linear or branched alkyl group having 1 to 10 carbon atoms.Type: GrantFiled: March 15, 1983Date of Patent: January 24, 1984Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Akitoshi Sugio, Masanobu Masu, Masao Okabe, Yukio Sasaki, Kozo Ishiyama
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Patent number: 4293478Abstract: An improved method for dispersing an inorganic pigment uniformly in polyphenylene ether resins. A polyphenylene ether composition having an inorganic pigment uniformly dispersed therein is obtained by intimately mixing a polyphenylene ether resin and the inorganic pigment in a weight ratio of from 0.5:1 to 2:1 by a high-speed mixer to form a pre-blend, and then mixing the pre-blend intimately with a polyphenylene ether in a conventional mixer such as an extruder. The pre-blend can also be uniformly dispersed in a mixture of the polyphenylene ether with polystyrene, a styrene/butadiene copolymer, a styrene/butadiene/acrylonitrile terpolymer, or a rubber-modified high impact polystyrene.Type: GrantFiled: October 3, 1979Date of Patent: October 6, 1981Assignee: Mitsubishi Gas Chemical Co., Inc.Inventors: Akitoshi Sugio, Masanobu Masu, Hiroshi Nakai, Yukio Sasaki