Patents by Inventor Yukio Sasaki

Yukio Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11851777
    Abstract: There is provided a hydrogen gas mixing device, including: a water electrolysis part configured to generate a hydrogen gas and an oxygen gas by electrolysis of water; a mixing gas supply part configured to supply a mixing gas; and a gas mixing part configured to mix the hydrogen gas and the mixing gas, wherein a non-combustible dilution gas is introduced into an oxygen flow part of the water electrolysis part through which the oxygen gas flows.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: December 26, 2023
    Assignee: YAMAHA FINE TECHNOLOGIES CO., LTD.
    Inventors: Hisashi Ichinokiyama, Takeshi Katoh, Toru Ishii, Yukio Sasaki
  • Patent number: 11471841
    Abstract: There is provided a hydrogen gas mixing device that includes a hydrogen generation part configured to generate a hydrogen gas; a mixing gas supply part configured to supply a mixing gas; a gas mixing part configured to mix the hydrogen gas and the mixing gas; a dilution gas supply part configured to supply a non-combustible dilution gas; and a valve circuit configured to, at an abnormality occurrence time, dilute the hydrogen gas with the dilution gas by connecting a first path for the hydrogen gas supplied from the hydrogen generation part and a second path for the dilution gas supplied from the dilution gas supply part.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: October 18, 2022
    Assignee: YAMAHA FINE TECHNOLOGIES CO., LTD.
    Inventors: Hisashi Ichinokiyama, Takeshi Katoh, Toru Ishii, Yukio Sasaki
  • Publication number: 20210213398
    Abstract: There is provided a hydrogen gas mixing device that includes a hydrogen generation part configured to generate a hydrogen gas; a mixing gas supply part configured to supply a mixing gas; a gas mixing part configured to mix the hydrogen gas and the mixing gas; a dilution gas supply part configured to supply a non-combustible dilution gas; and a valve circuit configured to, at an abnormality occurrence time, dilute the hydrogen gas with the dilution gas by connecting a first path for the hydrogen gas supplied from the hydrogen generation part and a second path for the dilution gas supplied from the dilution gas supply part.
    Type: Application
    Filed: December 28, 2020
    Publication date: July 15, 2021
    Inventors: Hisashi ICHINOKIYAMA, Takeshi KATOH, Toru ISHII, Yukio SASAKI
  • Publication number: 20210214853
    Abstract: There is provided a hydrogen gas mixing device, including: a water electrolysis part configured to generate a hydrogen gas and an oxygen gas by electrolysis of water; a mixing gas supply part configured to supply a mixing gas; and a gas mixing part configured to mix the hydrogen gas and the mixing gas, wherein a non-combustible dilution gas is introduced into an oxygen flow part of the water electrolysis part through which the oxygen gas flows.
    Type: Application
    Filed: December 28, 2020
    Publication date: July 15, 2021
    Inventors: Hisashi ICHINOKIYAMA, Takeshi KATOH, Toru ISHII, Yukio SASAKI
  • Publication number: 20100043352
    Abstract: A longitudinal sealing mechanism is adapted to seal an overlapped portion of a packaging material formed into a tubular shape with the overlapped portion extending along a conveying direction of the packaging material. The longitudinal sealing mechanism includes a contact section, a heating section and a receiving member. The contact section comes into contact with the overlapped portion of the packaging material. The heating section heats the contact section to perform longitudinal sealing of the overlapped portion to form a longitudinal seal portion. The receiving member abuts against the contact section with the overlapped portion of the packaging material being disposed therebetween. The contact section, the heating section, and the receiving member are arranged such that an amount of heat per unit time applied to the packaging material from the contact section decreases in a direction toward both sides of the longitudinal seal portion.
    Type: Application
    Filed: October 5, 2007
    Publication date: February 25, 2010
    Applicant: ISHIDA CO., LTD.
    Inventors: Satoshi Hashimoto, Masahiko Tatsuoka, Yukio Sasaki
  • Patent number: 7112824
    Abstract: A light-emitting diode array comprising a conductive layer formed on a substrate, pluralities of separate light-emitting portions formed on the conductive layer, a first groove formed in the conductive layer to divide the light-emitting portions to blocks, first electrodes each formed on at least part of an upper surface of each light-emitting portion, one second electrode formed directly on the conductive layer in each block, common switching wirings separately connected to the first electrodes, first bonding pads each connected to each common wiring, first bonding pads each connected to each common wiring, and second bonding pads each connected to each second electrode, n light-emitting portions (n is an even number) being arranged transversely in each block, and second grooves being formed in the conductive layer between adjacent light-emitting portions such that the second grooves are arranged short and long alternately, with the nearest one to the first groove being short.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: September 26, 2006
    Assignee: Hitachi Cable, Ltd.
    Inventors: Tomihisa Yukimoto, Eiichi Kunitake, Yukio Sasaki
  • Publication number: 20060208265
    Abstract: A light emitting diode array comprises compound semiconductor layers epitaxially grown on a p-type GaAs conductive layer 11 formed on a semi-insulating GaAs substrate 30. The epitaxial layer is isolated and divided into a plurality of light emitting parts 1 which function as a light emitting diode. A Si-doped n-type GaAs buffer layer 31 is interposed between the semi-insulating GaAs substrate 30 and the p-type GaAs conductive layer 11. In the light emitting diode array comprising this epitaxial configuration, it is possible to prevent the short-circuit defect due to diffusion of p-type dopant from the p-type GaAs conductive layer into the semi-insulating GaAs substrate made by the LEC method.
    Type: Application
    Filed: November 15, 2005
    Publication date: September 21, 2006
    Applicant: Hitachi Cable, Ltd.
    Inventors: Tomihisa Yukimoto, Eiichi Kunitake, Yukio Sasaki
  • Publication number: 20050269579
    Abstract: A light-emitting diode array comprising a conductive layer formed on a substrate, pluralities of separate light-emitting portions formed on the conductive layer, a first groove formed in the conductive layer to divide the light-emitting portions to blocks, first electrodes each formed on at least part of an upper surface of each light-emitting portion, one second electrode formed directly on the conductive layer in each block, common switching wirings separately connected to the first electrodes, first bonding pads each connected to each common wiring, first bonding pads each connected to each common wiring, and second bonding pads each connected to each second electrode, n light-emitting portions (n is an even number) being arranged transversely in each block, and second grooves being formed in the conductive layer between adjacent light-emitting portions such that the second grooves are arranged short and long alternately, with the nearest one to the first groove being short.
    Type: Application
    Filed: December 3, 2004
    Publication date: December 8, 2005
    Inventors: Tomihisa Yukimoto, Eiichi Kunitake, Yukio Sasaki
  • Patent number: 6951090
    Abstract: A packaging machine has a former with a guiding member and tube for forming an elongated bag-making material into a tubular form, a longitudinal sealer disposed on the front side of the tube for sealing mutually overlapping side edge parts of the tubularly formed bag-making material in a longitudinal direction and a transverse sealer for sealing the longitudinally sealed bag-making material in a transverse direction transverse to the longitudinal direction to thereby package articles dropped down. The tube has a conical part at the top and a cylindrical part extending downward from the conical part. The cylindrical part has an opening on the back side such that articles dropped through the interior of the tube can directly contact the bag-making material and will be prevented from becoming clogged. An unopened part may be provided to the cylindrical part of the tube below the opening in order to maintain a circular cross-sectional shape of the bag-making material.
    Type: Grant
    Filed: July 6, 2004
    Date of Patent: October 4, 2005
    Assignee: Ishida Co., Ltd.
    Inventors: Masashi Kondo, Yukio Sasaki, Makoto Ichikawa
  • Publication number: 20050188660
    Abstract: A packaging machine has a former with a guiding member and tube for forming an elongated bag-making material into a tubular form, a longitudinal sealer disposed on the front side of the tube for sealing mutually overlapping side edge parts of the tubularly formed bag-making material in a longitudinal direction and a transverse sealer for sealing the longitudinally sealed bag-making material in a transverse direction transverse to the longitudinal direction to thereby package articles dropped down. The tube has a conical part at the top and a cylindrical part extending downward from the conical part. The cylindrical part has an opening on the back side such that articles dropped through the interior of the tube can directly contact the bag-making material and will be prevented from becoming clogged. An unopened part may be provided to the cylindrical part of the tube below the opening in order to maintain a circular cross-sectional shape of the bag-making material.
    Type: Application
    Filed: July 6, 2004
    Publication date: September 1, 2005
    Inventors: Masashi Kondo, Yukio Sasaki, Makoto Ichikawa
  • Publication number: 20050173809
    Abstract: This invention is aimed at providing a wafer-level package which is capable of relaxing the stress in a chip-size package and exalting the reliability of the operation of mounting on a printed board and a method for the production thereof. This invention is directed toward a wafer-level package of a semiconductor substrate possessed of either or both of an electrode part and a wiring layer connected to an electrode part, which is provided on the semiconductor substrate with an insulating layer formed mainly of a fluorene skeleton-containing resin and on the electrode part with one step or a plurality of steps of posts, and on the posts with bumps formed of electroconductive balls and a method for the production thereof.
    Type: Application
    Filed: January 19, 2005
    Publication date: August 11, 2005
    Inventors: Yukihiro Yamamoto, Keiji Iwata, Yukio Sasaki, Kohei Tatsumi, Vivek Dutta, Tomofumi Jin, Koji Nakamura, Shinji Inaba
  • Patent number: 6619018
    Abstract: A bagging and packaging Machine has a substitute gas supply passage provided in a tube member 13 forming a part of a bag former 10 for forming a strip of packaging material into a bag. By securing a generally elongated plate 21 to a front inner side of the tube member 13 to thereby form the substitute gas supply passage 20 that extends in a direction parallel to the longitudinal sense of the packaging material from an upper portion down to a lower end portion of the tube member 13 and by rendering the cross-sectional area of the substitute gas supply passage 21 to be larger at a lower portion thereof than at an upper portion, the structure can be obtained in which a required quantity of substitute gas can be introduced into the bag-shaped packaging material at a moderate flow velocity.
    Type: Grant
    Filed: August 16, 2000
    Date of Patent: September 16, 2003
    Assignee: Ishida Co., Ltd.
    Inventor: Yukio Sasaki
  • Patent number: 5595020
    Abstract: An assembly of pots for raising and transplanting seedlings. A plurality of cylindrical pots are made of paper and each pot is connected by a connection member into a continuous form. The connection member includes slits for allowing the spacing between adjacent pots to be elongated to a length corresponding to one intrarow spacing for various kinds of plants. The generally H-shaped or generally U-shaped slits can be vertically and alternatively provided from upper and lower edges of the connection member.
    Type: Grant
    Filed: April 25, 1995
    Date of Patent: January 21, 1997
    Assignee: Nihon Tensaiseito Kabushiki Kaisha
    Inventors: Sumio Ito, Hidekazu Terasawa, Yukio Sasaki
  • Patent number: 4923912
    Abstract: An epoxy resin composition consisting essentially of(A) an epoxy resin,(B) a curing agent,(C) a curing promoter,(D) an organic silicon compound having at least one phenolic hydroxyl group per molecule, and(E) a filler.
    Type: Grant
    Filed: July 20, 1988
    Date of Patent: May 8, 1990
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Yukio Sasaki, Takayuki Watanabe, Hiroshi Takamiya, Kazuo Watanabe, Yoko Yamazaki
  • Patent number: 4920164
    Abstract: An epoxy resin composition consisting essentially of(A) an epoxy resin,(B) a curing agent,(C) a curing promoter,(D) a polyphenylene ether resin, and(E) a filler.
    Type: Grant
    Filed: July 20, 1988
    Date of Patent: April 24, 1990
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Yukio Sasaki, Takayuki Watanabe, Hiroshi Takamiya, Kazuo Watanabe, Yoko Yamazaki
  • Patent number: 4837970
    Abstract: A method for selecting live seeds of sugar beet (those which are able to germinate) from dead seeds (those which are unable to germinate) based on the case of seed-cap releasing. When immersed in water, live seeds absorb much water and expand appreciably, while dead seeds expand only slightly because less water is absorbed. This expansion of live seeds upon absorption of water makes the seed caps, closely fitted onto the outer shells of fruit, ready to be released. When mechanical vibrations are given to a mixture of water-soaked fruit, only the seed caps of expanded fruit are easily released. Thus live seeds of sugar beet can be effectively obtained by selecting out the fruit from which seed caps have been released.
    Type: Grant
    Filed: April 10, 1987
    Date of Patent: June 13, 1989
    Assignee: Nippon Tensaiseito Kabushiki Kaisha
    Inventor: Yukio Sasaki
  • Patent number: 4641285
    Abstract: The line change-over circuit suitable for the semiconductor memory having a redundancy memory column comprises a pair of transfer gate elements provided between a first node to which a first signal to be transmitted is supplied and a pair of transmission lines, first and second switch elements. The paired transfer gate elements are controlled on a switch in complementary manner each other according to a transfer signal. The first switch element is controlled on a switch according to the transfer signal, and the second switch element is controlled on a switch according to the first signal transmitted to one of the paired transmission lines. The first switch element turns one of the transmission lines to a fixed potential like ground potential when it is kept on, and the second switch element turns the other of the transmission lines to a fixed potential when it is kept on. The line change-over circuit in the above configuration is effective to prevent a floating state of the paired transmission lines.
    Type: Grant
    Filed: August 13, 1984
    Date of Patent: February 3, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Yukio Sasaki, Kotaro Nishimura, Osamu Minato
  • Patent number: 4465631
    Abstract: A 5-substituted-3-isoxazolecarboxylic acid derivative of the general formula: ##STR1## wherein X stands for a phenyl group, thienyl group, furyl group or pyridyl group, each of which optionally may carry at least one substituent group; R stands for a phenyl group or hydroxyphenyl group; and A stands for a group of the formula: ##STR2## wherein Y stands for ##STR3## in which the carbon atom with which the carboxyl group combines with the nitrogen atom in A, M stands for a hydrogen atom or a substituent group, and Z stands for a hydrogen atom, hydroxy group, acyloxy group, carbamoyloxy group, aromatic heterocycle thio group or aromatic nitrogen-containing heterocycle quaternary ammonium group, is disclosed along with methods for producing these compounds.
    Type: Grant
    Filed: April 6, 1983
    Date of Patent: August 14, 1984
    Assignee: Ajinomoto Company, Incorporated
    Inventors: Naohiko Yasuda, Hisao Iwagami, Eiji Nakanishi, Yukio Sasaki, Shigeru Yamanaka
  • Patent number: 4427814
    Abstract: A polyphenylene ether resin composition having improved heat stability and good color, said composition comprising a polyphenylene ether resin matrix, and dispersed therein, a diphosphonite of the formula ##STR1## wherein R.sub.1 groups are identical or different and each represents a linear or branched alkyl group having 1 to 10 carbon atoms.
    Type: Grant
    Filed: March 15, 1983
    Date of Patent: January 24, 1984
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Akitoshi Sugio, Masanobu Masu, Masao Okabe, Yukio Sasaki, Kozo Ishiyama
  • Patent number: 4293478
    Abstract: An improved method for dispersing an inorganic pigment uniformly in polyphenylene ether resins. A polyphenylene ether composition having an inorganic pigment uniformly dispersed therein is obtained by intimately mixing a polyphenylene ether resin and the inorganic pigment in a weight ratio of from 0.5:1 to 2:1 by a high-speed mixer to form a pre-blend, and then mixing the pre-blend intimately with a polyphenylene ether in a conventional mixer such as an extruder. The pre-blend can also be uniformly dispersed in a mixture of the polyphenylene ether with polystyrene, a styrene/butadiene copolymer, a styrene/butadiene/acrylonitrile terpolymer, or a rubber-modified high impact polystyrene.
    Type: Grant
    Filed: October 3, 1979
    Date of Patent: October 6, 1981
    Assignee: Mitsubishi Gas Chemical Co., Inc.
    Inventors: Akitoshi Sugio, Masanobu Masu, Hiroshi Nakai, Yukio Sasaki