Patents by Inventor Yukio Tsujimoto

Yukio Tsujimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of heat treatment of low melting-point metal on an electrode of a chip part
    Patent number: 4842654
    Abstract: Disclosed is a method of heat treatment of a low melting-point metal for production of spheroidal bodies formed of a low melting-point metal or alloy or heat treatment of the low-melting point metal coated on the surface of an electrode of a chip part.
    Type: Grant
    Filed: January 19, 1988
    Date of Patent: June 27, 1989
    Assignee: Matsushita Electric Industrial Co. Ltd.
    Inventors: Yasuhiro Shindo, Yukio Tsujimoto, Isami Saito, Isamu Hiraoka, Hiroshi Hirayama
  • Chip type component
    Patent number: 4829553
    Abstract: The invention is directed to the electrode structure of a chip type component, such as a chip resistor, in which a plated film of low melting point metal is used as an outermost coating electrode film on the electrode portion, the layer underlying said plated film of low melting point metal on the electrode portion is formed of a metal material having a higher melting point than that of the plated film and also having good affinity with said plated film, and the electrode material comprising said plated film of low melting point metal is subjected to heat treatment at a temperature higher than the melting point thereof, so that the outermost surface of the electrode portion is coated with a remolten metal film.
    Type: Grant
    Filed: January 19, 1988
    Date of Patent: May 9, 1989
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yasuhiro Shindo, Yukio Tsujimoto, Isami Saito