Abstract: A crane safety apparatus for displaying a schematic diagram of a part of a crane mechanism on a two-dimensional screen dynamically as the crane mechanism is operated, and displaying on the same screen a predetermined operation zone as a visually discriminative zone pattern. The operation zone pattern is displayed on the screen in response to the key command by an operator during a selected crane operation mode, while referring to the schematic crane mechanism diagram currently displayed on the screen.

Abstract: Rope extension is detected as a rope shift distance at predetermined time intervals. A rope extension amount is obtained as the accumulated value of the shift distances. The rope shift accumulated value is automatically reset to 0 when a hook structure reaches an overhoist position to renew the reference position of the rope extension amount and to correct any measurement errors of the rope extension amount. From this rope extension amount, a hanging length of the hook structure from a boom or jib top is obtained and used to calculate a hook lifting distance. The calculated hook lifting distance, or hook structure position, is displayed on a display screen relative to a fixed index or pattern. An operator can monitor the state of the hook structure from the display.

Abstract: There is disclosed a wafer-polishing apparatus suitably designed to carry out a chemical mechanical polishing operation. The apparatus includes a lower polishing plate assembly, a first rotating mechanism for rotating the first polishing plate assembly, an upper polishing plate assembly, a second rotating mechanism for rotating the upper polishing plate assembly, a pressing mechanism, a conveying mechanism and a discharging mechanism. The lower polishing plate assembly includes a lower polishing plate, a polishing pad, a porous sheet interposed between the lower polishing plate and the polishing pad. The porous sheet has a thickness of 0.5 to 3 mm, and is formed of a foaming resin. The upper polishing plate assembly includes an upper polishing plate, a plate-like chuck and a backing pad, a pressure reducing unit, and a cleaning unit.

Abstract: The present invention relates to a method and an apparatus for automatically binding a silicon wafer to a carrier plate. In the binding method of the present invention, the wafer is positioned underneath the carrier plate and then lifted and bonded to the carrier plate, at or below atmospheric pressure: once this is accomplished the process returns to the previous pressure. In addition, in the apparatus which performs this process, by means of a carrier means which supplies the carrier plate and wafer to the location where binding is to be carried out, the binding surface of the carrier plate and wafer are turned upward, transported and the carrier plate is flipped around in the interval between the carrier plate transportation apparatus and the binding unit.

Abstract: The present invention relates to a method and an apparatus for automatically binding a silicon wafer to a carrier plate. In the binding method of the present invention, the wafer is positioned underneath the carrier plate and then lifted and bonded to the carrier plate, at or below atmospheric pressure: once this is accomplished the process returns to the previous pressure. In addition, in the apparatus which performs this process, by means of a carrier means which supplies the carrier plate and wafer to the location where binding is to be carried out, the binding surface of the carrier plate and wafer are turned upward, transported and the carrier plate is flipped around in the interval between the carrier plate transportation apparatus and the binding unit.

Abstract: A method and an apparatus for applying molten wax to one face of a wafer is disclosed. A container having an upwardly facing opening contains the molten wax. The wafer is held substantially horizontally above the opening of the container, with one face of the wafer facing downwardly toward the opening of the container. At least one of the container and the wafer is moved toward the other to bring the opening of the container and underside of the wafer into contact with each other to thereby apply a predetermined amount of molten wax within the container to the underside of the wafer. Preferably, the container is filled with the molten wax such that the molten wax stands up, under surface tension, above a peripheral edge of the opening of the container. Preferably, the wafer is spinned around its central axis in a high speed so that the molten wax applied at the central portion thereof is spread on the entire surface of the wafer and that the extra wax is scattered out of the wafer.