Abstract: An apparatus for bonding disc substrates is provided with a spinner which spreads adhesive placed between a first substrate and second substrate, and a curing device which radiates ultraviolet light onto the adhesive through the substrate to cure it. The curing device includes; a support mechanism which supports the first substrate and second substrate after the adhesive is spread by the spinner, a semiconductor light emitting apparatus having a plurality of light emitting semiconductor elements arranged facing a region where the adhesive is cured, and a positioning mechanism which positions the semiconductor light emitting apparatus such that the light emitting semiconductor elements are a predetermined distance away from the adhesive. The adhesive is cured or semi-cured by ultraviolet light emitted from the plurality of light emitting semiconductor elements.

Abstract: An apparatus for bonding disc substrates is provided with a spinner which spreads adhesive placed between a first substrate and second substrate, and a curing device which radiates ultraviolet light onto the adhesive through the substrate to cure it. The curing device includes; a support mechanism which supports the first substrate and second substrate after the adhesive is spread by the spinner, a semiconductor light emitting apparatus having a plurality of light emitting semiconductor elements arranged facing a region where the adhesive is cured, and a positioning mechanism which positions the semiconductor light emitting apparatus such that the light emitting semiconductor elements are a predetermined distance away from the adhesive. The adhesive is cured or semi-cured by ultraviolet light emitted from the plurality of light emitting semiconductor elements.

Abstract: An apparatus for bonding disc substrates is provided with a spinner which spreads adhesive placed between a first substrate and second substrate, and a curing device which radiates ultraviolet light onto the adhesive through the substrate to cure it. The curing device includes; a support mechanism which supports the first substrate and second substrate after the adhesive is spread by the spinner, a semiconductor light emitting apparatus having a plurality of light emitting semiconductor elements arranged facing a region where the adhesive is cured, and a positioning mechanism which positions the semiconductor light emitting apparatus such that the light emitting semiconductor elements are a predetermined distance away from the adhesive. The adhesive is cured or semi-cured by ultraviolet light emitted from the plurality of light emitting semiconductor elements.

Abstract: A clock signal switching circuit having input terminals to receive a first clock signal of a first frequency, a second clock signal of a second frequency, and a frequency switching signal and an output terminal to output one of the first clock signal and second clock signal, wherein the output of the clock signal switching circuit is selected to be one of the first and second clock signals by the frequency switching signal.

Abstract: An IC card processing apparatus has a data reading/writing unit which accepts an IC card and electrically connects the IC card with terminal equipment. Data is exchanged with the IC card and/or the data reading/writing unit. To shorten the time for processing data of the IC card processing apparatus, the terminal equipment directly exchanges data with the IC card. To achieve this, the data line of the terminal equipment is connected to the data line of the IC card. Before using the IC card for transactions, the data reading/writing unit feeds a personal identification number (PIN) to the IC card for identifying the PIN information. To prevent the PIN information from being delivered to the terminal equipment, a switch is provided between the data line of the terminal equipment and the data line of the IC card. While identification of the PIN information is underway, the switch remains totally open, preventing reception of the code by an unauthorized party.