Abstract: When connecting a semiconductor device such as an IC chip with a circuit board by the flip-chip method, a semiconductor device is provided without forming bumps thereon, which enables highly reliable and low cost connection between the IC chip and circuit board while ensuring suppressing short-circuiting, lowering connection costs, suppressing stress concentrations at the joints and reducing damage of the IC chip or circuit board. The bumpless semiconductor device is provided with electrode pads 2 on the surface thereof and with a passivation film 3 at the periphery of the electrode pads 2, and conductive particles 4 are metallically bonded to the electric pads 2. Composite particles in which a metallic plating layer is formed at the surface of resin particles are employed as the conductive particles 4.

Abstract: When connecting a semiconductor device such as an IC chip with a circuit board by the flip-chip method, a semiconductor device is provided without forming bumps thereon, which enables highly reliable and low cost connection between the IC chip and circuit board while ensuring suppressing short-circuiting, lowering connection costs, suppressing stress concentrations at the joints and reducing damage of the IC chip or circuit board. The bumpless semiconductor device is provided with electrode pads 2 on the surface thereof and with a passivation film 3 at the periphery of the electrode pads 2, and conductive particles 4 are metallically bonded to the electric pads 2. Composite particles in which a metallic plating layer is formed at the surface of resin particles are employed as the conductive particles 4.

Abstract: A conductive particle 30 which can be used for connecting a variety of adherends is provided, and the conductive particle 30 includes a resin particle 31, a first conductive particle disposed around the resin particle 31, a first resin coating 25 disposed on the periphery thereof and softer than the resin particle 31, and a second conductive thin film 36 disposed therearound; and if the surface part of, for example, an electrode 13 of an adherend that is to be connected is hard, a first resin coating 35 and the second conductive thin film 36 are destroyed by pressure to bring the second conductive thin film 36 in contact with the electrode 13 and a metal wiring 17.

Abstract: An image pickup apparatus is provided. The image pickup apparatus permitting a conversion lens to be mounted and dismounted, wherein a lens hood is composed of a base portion on the mounting side and a tubular portion on the front side, the base portion and the tubular portion are detachably coupled to each other, and another lens is contained in the inside of the lens hood when the another lens is mounted on the front side of an optical system, whereby even when the conversion lens is being used, the lens hood can be used as it is, and the incident light contracting function of the lens hood can be maintained.

Abstract: A conversion lens apparatus includes a first and second barrels for housing a first and second lenses, wherein a back portion of the first barrel is detachably attached to the main body side barrel, a back portion of the second barrel is detachably attached to a front portion of the first barrel, the first barrel is configured, so a magnification rate of total optical system including the first lens and imaging optical system is converted to be more wide-angle side than magnification rate of the imaging optical system itself, when attached to the main body side barrel, and the second barrel is configured, so the magnification rate of total optical system including the first lens and imaging optical system is converted to be more telescopic side than magnification rate of the imaging optical system itself, when attached to the first barrel which is attached to the main body side barrel.

Abstract: This invention provides a process for producing optically active 2-[6-(hydroxymethyl)-1,3-dioxan-4-yl]acetic acid derivatives, which are of value as intermediates of drugs, from inexpensive starting materials without using any special equipment such as that required for super-low temperature reactions. A process for producing optically active 2-[6-(hydroxymethyl)-1,3-dioxan-4-yl]acetic acid derivatives which comprises reacting an acetic acid derivative at a temperature of not less than ?30° C.

Abstract: An emission cleaning installation which is easy to connect continuously even to existing large-scale incineration furnaces and which is able to oxidatively break down and eliminate environmental pollutants contained in the emissions, for example dioxins, dibenzofurans, coplanar PCBs, nitrogen oxides (NOx) and the like without temperature control of the emission temperature, by the photocatalytic action of the photocatalyst, and to a method for emission cleaning and elimination which uses the abovementioned emission cleaning installation.

Abstract: An emission cleaning installation which is easy to connect continuously even to existing large-scale incineration furnaces and which is able to oxidatively break down and eliminate environmental pollutants contained in the emissions, for example dioxins, dibenzofurans, coplanar PCBs, nitrogen oxides (NOx) and the like without temperature control of the emission temperature, by the photocatalytic action of the photocatalyst, and to a method for emission cleaning and elimination which uses the abovementioned emission cleaning installation.

Abstract: A working oil accumulated in oil reservoirs is supplied to electric motor cooling oil passages and lubricating oil passages in well-balanced manner all during the time of normal and very low temperatures in an electric drive unit. The electric drive unit comprises an electric motor and a feed oil passage, through which a working oil for cooling and lubrication is supplied to respective mechanisms of a drive unit including the electric motor, in a drive unit body. An oil reservoir communicates with a working oil supply source and is provided in an upper area of the drive unit body. A weir is provided between a first reservoir, which communicates the oil reservoir to the working oil supply source and communicated to small flow-rate discharge oil passages, and a second reservoir communicates with a large flow-rate discharge oil passage.

Abstract: When connecting a semiconductor device such as an IC chip with a circuit board by the flip-chip method, a semiconductor device is provided without forming bumps thereon, which enables highly reliable and low cost connection between the IC chip and circuit board while ensuring suppressing short-circuiting, lowering connection costs, suppressing stress concentrations at the joints and reducing damage of the IC chip or circuit board. The bumpless semiconductor device is provided with electrode pads 2 on the surface thereof and with a passivation film 3 at the periphery of the electrode pads 2, and conductive particles 4 are metallically bonded to the electric pads 2. Composite particles in which a metallic plating layer is formed at the surface of resin particles are employed as the conductive particles 4.

Abstract: A process for mounting a semiconductor device and a mounting apparatus whereby electrodes of a fine-pitch semiconductor device and a wiring board can be surely connected to each other.

Abstract: The present invention provides an adhesive film for producing an electric device having high reliability. Release agent layer of release film of the present invention is based on a fluorine compound with no silicone oil so that the adhesive force between substrate and release agent layer is enough high to provide an electric device having high reliability wherein release agent layer is not adhered when release film is separated from adhesive layer. The surface roughness of substrate of 3 &mgr;m or less limits irregularities on the side of adhesive layer from which release film has been separated and therefore, no bubbles occur between adhesive layer and semiconductor chip when semiconductor chip is pressed against adhesive layer. If the surface roughness of substrate is 1 &mgr;m or more, adhesive film also has high slitting performance.

Abstract: A working oil accumulated in oil reservoirs is supplied to electric motor cooling oil passages and lubricating oil passages in well-balanced manner all during the time of normal and very low temperatures in an electric drive unit. The electric drive unit comprises an electric motor and a feed oil passage, through which a working oil for cooling and lubrication is supplied to respective mechanisms of a drive unit including the electric motor, in a drive unit body. An oil reservoir communicates with a working oil supply source and is provided in an upper area of the drive unit body. A weir is provided between a first reservoir, which communicates the oil reservoir to the working oil supply source and communicated to small flow-rate discharge oil passages, and a second reservoir communicates with a large flow-rate discharge oil passage.

Abstract: A basic antimicrobial protein is activated by a partner protein having an isoelectric point below pH 7 and a chaperon function, by expressing an antimicrobially inactive fusion protein between the basic antimicrobial protein and the partner protein, recovering the fusion protein and separating the two proteins from each other. In such manner, an advantageous mass expression system of the basic antimicrobial protein having an appropriate disulfide bond as an active type is realized at lost cost.

Abstract: A novel polypeptide for producing tert-butyl (3R,5S)-6-chloro-3,5-dihydroxyhexanoate, a gene encoding the polypeptide, and a method of using the polypeptide, are provided. The polypeptide has an enzyme activity to asymmetrically reduce tert-butyl (S)-6-chloro-5-hydroxy-3-oxohexanoate to tert-butyl (3R,5S)-6-chloro-3,5-dihydroxyhexanoate. The polypeptide comprises the amino acid sequence represented by SEQ ID NO. 1 in the Sequence Listing, or the amino acid sequence having at least one amino acid substitution, insertion, deletion, or addition thereof.

Abstract: A particle material for anisotropic conductive connection, is comprised of a conductive particle and an insulating resin layer covering the surface thereof, wherein the insulating resin layer includes an insulating gelled resin with a gel proportion of at least 90%. The particle material can be manufactured by fixing an insulating gelled resin powder with a gel proportion of at least 90% to the surface of the conductive particle by a physical/mechanical method to form the insulating resin layer.

Abstract: A film-shaped adhesive application apparatus includes a supply reel retainer for mounting a film-shaped adhesive supply reel used to wind into a roll shape a film-shaped adhesive 1 comprising a base film and an adhesive layer formed thereon, thermocompression bonding means for thermocompression-bonding the film-shaped adhesive drawn from the film-shaped adhesive supply reel to an adherend, and a winding reel retainer for mounting a winding reel used to wind the base film of the thermocompression-bonded film-shaped adhesive, and further temperature control means (thermal shield plate, cooler, or the like) for controlling the film-shaped adhesive supply reel mounted on the supply reel retainer at a prescribed temperature.

Abstract: A method for mounting electronic elements, comprises the step of arranging a thermosetting adhesive between a circuit board, situated on a stage, and an electronic element to be connected with the wiring pattern of the circuit board, and then bonding the electronic element to the circuit board by the application of heat and pressure from the electronic element side. The electronic element is temporarily thermocompression-bonded to the circuit board such that the thermosetting reaction rate of the thermosetting adhesive on the side of the circuit board is lower than the thermosetting reaction rate on the side of the electronic element. The thermosetting adhesive is then set finally in order to bond the electronic element to the circuit board.

Abstract: This invention provides a process for producing optically active 2-[6-(hydroxymethyl)-1,3-dioxan-4-yl]acetic acid derivatives, which are of value as intermediates of drugs, from inexpensive starting materials without using any special equipment such as that required for super-low temperature reactions.

Abstract: Insulating adhesives or adhesive films which ensure both of sufficient repairability and continuity reliability and connection methods with the use of the same are provided.