Patents by Inventor Yukishiro Kosaka

Yukishiro Kosaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Melamine molded foam, process for producing the same, and wiper
    Patent number: 6608118
    Abstract: A melamine molded foam is produced by heat-compressing a melamine foam to a thickness of {fraction (1/1.2)} to {fraction (1/12)} to cause plastic deformation and temporarily fixing the shape; the heat-compression is performed under the conditions of from 210 to 350° C. for 3 minutes or longer; the heat-compression is preferably performed at a temperature within the range of lower than the decomposition temperature of the melamine monomer by 140° C. or less; in some of such molded foams, the shape recovery in the direction of thickness with the lapse of time is observed depending upon the heat-compression conditions; and the dimensional recovery ratio is 40% or less when allowed to stand at 23° C. for 200 hours.
    Type: Grant
    Filed: February 27, 2002
    Date of Patent: August 19, 2003
    Assignee: Inoac Corporation
    Inventors: Yukishiro Kosaka, Genjiro Hattori, Hidero Suzuki, Satoshi Kondo, Masahiro Fukuyama, Atsushi Ichinose
  • Melamine molded foam, process for producing the same, and wiper
    Publication number: 20020163105
    Abstract: A melamine molded foam is produced by heat-compressing a melamine foam to a thickness of {fraction (1/1.2)} to {fraction (1/12)} to cause plastic deformation and temporarily fixing the shape; the heat-compression is performed under the conditions of from 210 to 350° C. for 3 minutes or longer; the heat-compression is preferably performed at a temperature within the range of lower than the decomposition temperature of the melamine monomer by 140° C. or less; in some of such molded foams, the shape recovery in the direction of thickness with the lapse of time is observed depending upon the heat-compression conditions; and the dimensional recovery ratio is 40% or less when allowed to stand at 23° C. for 200 hours.
    Type: Application
    Filed: February 27, 2002
    Publication date: November 7, 2002
    Applicant: INOAC CORPORATION
    Inventors: Yukishiro Kosaka, Genjiro Hattori, Hidero Suzuki, Satoshi Kondo, Masahiro Fukuyama, Atsushi Ichinose