Abstract: A method of fabricating a memory array includes designing first layout sections in a row direction, each first layout section including first and second control lines in a first metal layer, and an upper conductive line in a third metal layer. A lower conductive line in a second metal layer is coupled to the first control line and the first control line is isolated from the second control line. A second layout section is inserted at every N-th first layout section, N being a positive integer equal to or greater than 2. The second layout section includes the first control line, the second control line and a lower conductive line in the second metal layer coupled to the second control line and to an upper conductive line in the third metal layer. The lower conductive lines in the first and second layout sections are isolated from each other.

Abstract: A memory compiler includes a processor configured to perform a simulation of an operation of an input stage coupled to an input terminal of a memory circuit, wherein the simulation of the operation of the input stage is performed for various slew rate values at the input terminal to obtain corresponding extrinsic input timing delays. The processor is further configured to perform a simulation of an operation of an output stage coupled to an output terminal of the memory circuit, wherein the simulation of the operation of the output stage is performed for various capacitance loading values at the output terminal to obtain corresponding extrinsic output timing delays. The processor is further configured to perform a simulation of an operation of a section of the memory circuit between the input stage and the output stage to obtain an intrinsic timing delay.

Abstract: A memory device includes: memory cells arranged in rows and columns; and regulated ground circuits corresponding to the columns. Each regulated ground circuit includes: a column ground node; at least three low-side voltage sources; at least three switches, each of the at least three switches being coupled between the column ground node and a corresponding one of the at least three voltage sources; and each of the at least three switches being controlled by a corresponding one of different control signals; Each memory cell includes: a high-side voltage source; an internal ground node coupled to the column ground node; and a cross latch having output and output_bar nodes. The cross latch is coupled between the high-side voltage source and the internal ground node, and is configured to selectively connect the output and output_bar nodes to corresponding bit and bit_bar lines.

Abstract: A method of fabricating a memory array includes designing first layout sections in a row direction, each first layout section including first and second control lines in a first metal layer, and an upper conductive line in a third metal layer. A lower conductive line in a second metal layer is coupled to the first control line and the first control line is isolated from the second control line. A second layout section is inserted at every N-th first layout section, N being a positive integer equal to or greater than 2. The second layout section includes the first control line, the second control line and a lower conductive line in the second metal layer coupled to the second control line and to an upper conductive line in the third metal layer. The lower conductive lines in the first and second layout sections are isolated from each other.

Abstract: A method of fabricating a memory includes forming a first portion of a first line in a first metal layer, forming a first portion of a second line in the first metal layer, forming a second portion of the first line in a second metal layer, and forming a second portion of the second line in a third metal layer. The first line is over a plurality of memory cells. The second line is over the plurality of memory cells, the first line is electrically isolated from the second line, and the first line and the second line extend in a same direction. The second metal layer is over the first metal layer. The third metal layer is over the second metal layer and the third metal layer is electrically isolated from the first line.

Abstract: A memory device includes: memory cells arranged in rows and columns; and regulated ground circuits corresponding to the columns. Each regulated ground circuit includes: a column ground node; at least three low-side voltage sources; at least three switches, each of the at least three switches being coupled between the column ground node and a corresponding one of the at least three voltage sources; and each of the at least three switches being controlled by a corresponding one of different control signals; Each memory cell includes: a high-side voltage source; an internal ground node coupled to the column ground node; and a cross latch having output and output_bar nodes. The cross latch is coupled between the high-side voltage source and the internal ground node, and is configured to selectively connect the output and output_bar nodes to corresponding bit and bit_bar lines.

Abstract: In response to a write operation to a memory cell that causes a data line of the memory cell to have a first voltage direction, causing the data line to have a second voltage direction opposite the first voltage direction.

Abstract: A method of writing data to an accessed memory cell of an accessed column of an accessed section of a memory array includes, electrically coupling a first voltage source of at least three voltage sources to a column internal ground node of the accessed column; and electrically coupling the first voltage source of the at least three voltage sources to a column internal ground node of an un-accessed column of an un-accessed segment. The memory array has at least one segment. Each memory cell has an internal ground node. The at least one segment has at least one section, and each section has at least one column and at least one row. Each column has at least three switches and a column internal ground node capable of being electrically coupled to at least three voltage sources through a corresponding one of the at least three switches.

Abstract: A memory macro includes a plurality of segments corresponding to a plurality of tracking circuits. Each segment of the plurality of segments thereby corresponds to one tracking circuit of the plurality of tracking circuits. In response to a read operation of a memory cell of a segment, a tracking circuit corresponding to the segment is configured to generate an edge of a tracking signal based on which a first edge of a cell signal associated with the memory cell is generated.

Abstract: A method of fabricating a memory includes forming a first portion of a first line in a first metal layer, forming a first portion of a second line in the first metal layer, forming a second portion of the first line in a second metal layer, and forming a second portion of the second line in a third metal layer. The first line is over a plurality of memory cells. The second line is over the plurality of memory cells, the first line is electrically isolated from the second line, and the first line and the second line extend in a same direction. The second metal layer is over the first metal layer. The third metal layer is over the second metal layer and the third metal layer is electrically isolated from the first line.

Abstract: A circuit includes a write driver, a data circuit, a memory cell, a tracking write buffer, a tracking write driver, and a tracking cell. The circuit is configured that, during a write operation of the memory cell based on a clock signal, the write driver circuit is configured to generate a write control signal to control the memory cell; the data circuit is configured to provide write data to the memory cell; the tracking write buffer is configured to generate a tracking write control signal; and the tracking write driver is configured to generate a tracking write data signal to be transferred to the tracking cell. The tracking cell is configured to adjust a signal at a first node of the tracking cell based on a logical value of the tracking write data signal in response to the tracking write control signal.

Abstract: A memory includes a plurality of memory cells. A first line is over the plurality of memory cells. The first line in a first layout section includes a first metal layer and a second metal layer. The second metal layer is over the first metal layer. A second line is over the plurality of memory cells. The second line in the first layout section includes the first metal layer and a third metal layer. The third metal layer is over the second metal layer The first line is electrically isolated from the second line. The first line and the second line extend in a same direction.

Abstract: A memory macro includes a first data line, a second data line, a first switch and a voltage keeper. The first switch is configured between the first data line and the second data line. The voltage keeper is electrically coupled to the second data line. The voltage keeper is configured to control a voltage level at the second data line in response to the voltage level at the second data line during the first switch electrically couples the second data line to the first data line.

Abstract: A method of writing data to an accessed memory cell of an accessed column of an accessed section of a memory array includes, electrically coupling a first voltage source of at least three voltage sources to a column internal ground node of the accessed column; and electrically coupling the first voltage source of the at least three voltage sources to a column internal ground node of an un-accessed column of an un-accessed segment. The memory array has at least one segment. Each memory cell has an internal ground node. The at least one segment has at least one section, and each section has at least one column and at least one row. Each column has at least three switches and a column internal ground node capable of being electrically coupled to at least three voltage sources through a corresponding one of the at least three switches.

Abstract: A method of designing a semiconductor circuit includes generating a model of the semiconductor circuit. The model includes a functional area corresponding to a first block of the semiconductor circuit, and a loading area corresponding to a second block of the semiconductor circuit, wherein the first block is connected to the second block by a signal line. The method further includes extracting, in the functional area, parasitic parameters of the signal line and a device of the first block. The method further includes extracting, in the loading area, parasitic parameters of the signal line, without extracting parasitic parameters of a device of the second block.

Abstract: A method of reading data from an accessed memory cell of an accessed column of an accessed section of a memory array includes, in the accessed section, electrically coupling a first voltage source of at least three voltage sources to a corresponding column internal ground node of the accessed column; and electrically coupling the first voltage source to a corresponding column internal ground node of an un-accessed column. The memory array has at least one segment, the at least one segment has at least one section, and each section has at least one column. Each column has at least three switches and a column internal ground node capable of being electrically coupled to at least three voltage sources through a corresponding one of the at least three switches.

Abstract: In response to a write operation to a memory cell that causes a data line of the memory cell to have a first voltage direction, causing the data line to have a second voltage direction opposite the first voltage direction.

Abstract: A memory compiler includes a processor configured to perform a simulation of an operation of an input stage coupled to an input terminal of a memory circuit, wherein the simulation of the operation of the input stage is performed for various slew rate values at the input terminal to obtain corresponding extrinsic input timing delays. The processor is further configured to perform a simulation of an operation of an output stage coupled to an output terminal of the memory circuit, wherein the simulation of the operation of the output stage is performed for various capacitance loading values at the output terminal to obtain corresponding extrinsic output timing delays. The processor is further configured to perform a simulation of an operation of a section of the memory circuit between the input stage and the output stage to obtain an intrinsic timing delay.

Abstract: A memory macro includes a first data line, a second data line, a first switch and a voltage keeper. The first switch is configured between the first data line and the second data line. The voltage keeper is electrically coupled to the second data line. The voltage keeper is configured to control a voltage level at the second data line in response to the voltage level at the second data line during the first switch electrically couples the second data line to the first data line.

Abstract: A circuit includes a write driver, a data circuit, a memory cell, a tracking write buffer, a tracking write driver, and a tracking cell. The circuit is configured that, during a write operation of the memory cell based on a clock signal, the write driver circuit is configured to generate a write control signal to control the memory cell; the data circuit is configured to provide write data to the memory cell; the tracking write buffer is configured to generate a tracking write control signal; and the tracking write driver is configured to generate a tracking write data signal to be transferred to the tracking cell. The tracking cell is configured to adjust a signal at a first node of the tracking cell based on a logical value of the tracking write data signal in response to the tracking write control signal.