Patents by Inventor Yukitaka Matsuda

Yukitaka Matsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8790102
    Abstract: The injection molding employing a mold that includes a molding surface in which a pin hole is formed, and at least one ejector pin that is inserted through the pin hole and that includes an outer peripheral surface facing an inner peripheral surface of the pin hole; includes closing a mold, injecting material into the mold, setting the material, opening the mold, and extruding the material by making a tip end surface of the at least one ejector pin protrude out of a pin hole. The tip end surface is recessed from the molding surface by a predetermined distance in a direction opposite a direction in which the material is extruded, while injecting the material into the mold.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: July 29, 2014
  • Patent number: 8511620
    Abstract: An aircraft wing load alleviation system incorporating a wing, a spoiler panel (14), a device (16, 17) which restricts circulation of air around a trailing edge of the spoiler and a control system. The spoiler panel is pivotally attached to the wing so that the spoiler panel can be rotated up from a lowered position to a raised position, thereby opening a void between the spoiler panel and the wing. The retractable device can be deployed from a retracted position to an extended position in which it restricts circulation of air around the trailing edge of the spoiler panel and into the void, thus reducing induced drag. The control system is configured to detect or predict an increase in the lift of the wing and rotate the spoiler panel to its raised position in response to a detected or predicted increase in the lift of the wing.
    Type: Grant
    Filed: February 16, 2010
    Date of Patent: August 20, 2013
  • Publication number: 20130032972
    Abstract: The injection molding employing a mold that includes a molding surface in which a pin hole is formed, and at least one ejector pin that is inserted through the pin hole and that includes an outer peripheral surface facing an inner peripheral surface of the pin hole; includes closing a mold, injecting material into the mold, setting the material, opening the mold, and extruding the material by making a tip end surface of the at least one ejector pin protrude out of a pin hole. The tip end surface is recessed from the molding surface by a predetermined distance in a direction opposite a direction in which the material is extruded, while injecting the material into the mold.
    Type: Application
    Filed: April 12, 2011
    Publication date: February 7, 2013
  • Publication number: 20110272532
    Abstract: An aircraft wing load alleviation system incorporating a wing, a spoiler panel (14), a device (16, 17) which restricts circulation of air around a trailing edge of the spoiler and a control system. The spoiler panel is pivotally attached to the wing so that the spoiler panel can be rotated up from a lowered position to a raised position, thereby opening a void between the spoiler panel and the wing. The retractable device can be deployed from a retracted position to an extended position in which it restricts circulation of air around the trailing edge of the spoiler panel and into the void, thus reducing induced drag. The control system is configured to detect or predict an increase in the lift of the wing and rotate the spoiler panel to its raised position in response to a detected or predicted increase in the lift of the wing.
    Type: Application
    Filed: February 16, 2010
    Publication date: November 10, 2011
  • Patent number: 8016248
    Abstract: An aircraft wing comprising an upper surface; and two or more spoilers pivotally attached to the upper surface, wherein at least two adjacent ones of the spoilers are separated by a gap, and wherein the width of the gap is: greater than 1 cm; and sufficiently small to choke the flow of air through the gap such that for at least one flight regime with the adjacent spoilers deployed, the average air flow speed through the gap is less than 10% of the true air speed. The reduced size of the spoilers reduces the spanwise wing loading and the spoiler hinge moment, while providing a net aerodynamic effect (in terms of destroying lift over the wing) similar to that of a conventional spoiler array with no gaps.
    Type: Grant
    Filed: July 11, 2008
    Date of Patent: September 13, 2011
  • Publication number: 20090050749
    Abstract: An aircraft wing comprising an upper surface; and two or more spoilers pivotally attached to the upper surface, wherein at least two adjacent ones of the spoilers are separated by a gap, and wherein the width of the gap is: greater than 1 cm; and sufficiently small to choke the flow of air through the gap such that for at least one flight regime with the adjacent spoilers deployed, the average air flow speed through the gap is less than 10% of the true air speed. The reduced size of the spoilers reduces the spanwise wing loading and the spoiler hinge moment, whilst providing a net aerodynamic effect (in terms of destroying lift over the wing) similar to that of a conventional spoiler array with no gaps.
    Type: Application
    Filed: July 11, 2008
    Publication date: February 26, 2009