Patents by Inventor Yukitaka Tokumoto

Yukitaka Tokumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multiple wiring board
    Publication number: 20030104184
    Abstract: A multiple mother board holding electronic components has frame-shaped reinforcing conductive films surrounding peripheries on both surfaces of the mother board. In the conductive films, plural minute openings are formed such that positions of the openings on both surfaces are shifted from each other.
    Type: Application
    Filed: November 26, 2002
    Publication date: June 5, 2003
    Applicant: NEC ELECTRONICS CORPORATION
    Inventors: Taro Hirai, Shigekazu Hino, Gorou Ikegami, Yukitaka Tokumoto