Patents by Inventor Yukiteru SUGAYA
Yukiteru SUGAYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11831299Abstract: A high-frequency module includes a mounting substrate, a filter, and a common inductor. The mounting substrate includes a first main surface and a second main surface facing each other. The filter includes series arm resonators and parallel arm resonators, and is disposed on the first main surface. The mounting substrate includes a ground terminal on the second main surface. A first end of the common inductor is connected to all of the parallel arm resonators. A second end of the common inductor is connected to the ground terminal.Type: GrantFiled: April 2, 2021Date of Patent: November 28, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yukiteru Sugaya, Syunsuke Kido, Masanori Kato, Hiroshi Matsubara
-
Publication number: 20230318559Abstract: A radio frequency module includes a first switch, a second switch, a control circuit, a first filter, a second filter, a third filter, a fourth filter, and an antenna terminal. The first switch is capable of connecting a first selection terminal or a second selection terminal to a first common terminal in a selective manner. The second switch is capable of connecting a third selection terminal or a fourth selection terminal to a second common terminal in a selective manner. The first switch, the second switch, and the control circuit are provided in a single electronic component (a first electronic component). The control circuit is positioned between the first switch and the second switch in the electronic component.Type: ApplicationFiled: March 22, 2023Publication date: October 5, 2023Applicant: Murata Manufacturing Co., Ltd.Inventors: Syunsuke KIDO, Yukiteru SUGAYA
-
Patent number: 11658641Abstract: A high-frequency module includes a module substrate including an internal wiring pattern, and a SAW filter including a piezoelectric substrate, an electrode pattern on the piezoelectric substrate, a support surrounding the electrode pattern, and a cover on the support covering the electrode pattern to define a hollow space together with the support and the piezoelectric substrate. The module substrate, the cover, and the piezoelectric substrate are disposed in this order in a perpendicular or substantially perpendicular direction with respect to the module substrate, and a shield electrode is provided on a surface of the cover that faces the module substrate or on a surface of the cover that faces the piezoelectric substrate.Type: GrantFiled: October 13, 2020Date of Patent: May 23, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Yukiteru Sugaya
-
Publication number: 20230112175Abstract: In a radio-frequency module, a hybrid filter includes an acoustic wave filter including at least one acoustic wave resonator, an inductor having a winding portion, and a capacitor. A plurality of outer electrodes of the acoustic wave filter includes a first input and output electrode connected to a first signal terminal, a second input and output electrode connected to a second signal terminal, and a ground electrode connected to a ground terminal. The inductor is disposed on a first major surface of a mounting substrate and is adjacent to the acoustic wave filter in plan view in a thickness direction of the mounting substrate. When viewed in a direction of a winding axis of the winding portion of the inductor, an inner part of the winding portion in the inductor does not overlap any of the first input and output electrode, the second input and output electrode, and ground electrode.Type: ApplicationFiled: August 11, 2022Publication date: April 13, 2023Inventors: Keisuke NISHIO, Yukiteru SUGAYA, Masaki TADA, Masanori KATO, Syunsuke KIDO, Hiroshi MATSUBARA
-
Patent number: 11533806Abstract: A filter includes a first input/output electrode and the second input/output electrode, and is arranged on a first main surface of a mounting substrate. The mounting substrate includes a first land electrode, a second land electrode, a ground terminal, and a plurality of via conductors. The first land electrode is connected to the first input/output electrode. The second land electrode is connected to the second input/output electrode. The ground terminal is located closer to a second main surface side than the first main surface in a thickness direction of the mounting substrate. The plurality of via conductors is arranged between the first main surface and the second main surface, and is connected to the ground terminal. The plurality of via conductors is located between the first land electrode and the second land electrode in a plan view from the thickness direction of the mounting substrate.Type: GrantFiled: April 2, 2021Date of Patent: December 20, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Hiroshi Matsubara, Masanori Kato, Yukiteru Sugaya, Syunsuke Kido
-
Publication number: 20220345158Abstract: A multiplexer includes filters and low pass filters. A second frequency band and a third frequency band are partially different. A first frequency band does not overlap the second frequency band and the third frequency band. One end of the filter is connected to a common terminal and the other end is connected to an input/output terminal. The low pass filter is connected in one end to the common terminal and in the other end to one end of the filter. The other end of the filter is connected to one end of the low pass filter. The other end of the low pass filter is connected to the input/output terminal. One end of the filter is connected to a node between the other end of the low pass filter and one end of the filter and the other end of the filter is connected to the input/output terminal.Type: ApplicationFiled: July 8, 2022Publication date: October 27, 2022Inventors: Masanori KATO, Syunsuke KIDO, Yukiteru SUGAYA, Hiroshi MATSUBARA
-
Patent number: 11271306Abstract: A wiring board includes couplers and external connection terminals including a first terminal group including a first antenna terminal and a first monitor terminal respectively connected to an output terminal and a coupler terminal of a coupler, and a first spacer terminal between the first antenna terminal and the first monitor terminal, and a second terminal group including a second antenna terminal and a second monitor terminal respectively connected to an output terminal and a coupler terminal of a coupler, and a second spacer terminal between the second antenna terminal and the second monitor terminal.Type: GrantFiled: May 26, 2020Date of Patent: March 8, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Yukiteru Sugaya
-
Publication number: 20210315096Abstract: A filter includes a first input/output electrode and the second input/output electrode, and is arranged on a first main surface of a mounting substrate. The mounting substrate includes a first land electrode, a second land electrode, a ground terminal, and a plurality of via conductors. The first land electrode is connected to the first input/output electrode. The second land electrode is connected to the second input/output electrode. The ground terminal is located closer to a second main surface side than the first main surface in a thickness direction of the mounting substrate. The plurality of via conductors is arranged between the first main surface and the second main surface, and is connected to the ground terminal. The plurality of via conductors is located between the first land electrode and the second land electrode in a plan view from the thickness direction of the mounting substrate.Type: ApplicationFiled: April 2, 2021Publication date: October 7, 2021Inventors: Hiroshi MATSUBARA, Masanori KATO, Yukiteru SUGAYA, Syunsuke KIDO
-
Publication number: 20210313962Abstract: A high-frequency module includes a mounting substrate, a filter, and a common inductor. The mounting substrate includes a first main surface and a second main surface facing each other. The filter includes series arm resonators and parallel arm resonators, and is disposed on the first main surface. The mounting substrate includes a ground terminal on the second main surface. A first end of the common inductor is connected to all of the parallel arm resonators. A second end of the common inductor is connected to the ground terminal.Type: ApplicationFiled: April 2, 2021Publication date: October 7, 2021Inventors: Yukiteru SUGAYA, Syunsuke KIDO, Masanori KATO, Hiroshi MATSUBARA
-
Publication number: 20210028767Abstract: A high-frequency module includes a module substrate including an internal wiring pattern, and a SAW filter including a piezoelectric substrate, an electrode pattern on the piezoelectric substrate, a support surrounding the electrode pattern, and a cover on the support covering the electrode pattern to define a hollow space together with the support and the piezoelectric substrate. The module substrate, the cover, and the piezoelectric substrate are disposed in this order in a perpendicular or substantially perpendicular direction with respect to the module substrate, and a shield electrode is provided on a surface of the cover that faces the module substrate or on a surface of the cover that faces the piezoelectric substrate.Type: ApplicationFiled: October 13, 2020Publication date: January 28, 2021Inventor: Yukiteru SUGAYA
-
Patent number: 10848129Abstract: A high-frequency module includes a module substrate including an internal wiring pattern, and a SAW filter including a piezoelectric substrate, an electrode pattern on the piezoelectric substrate, a support surrounding the electrode pattern, and a cover on the support covering the electrode pattern to define a hollow space together with the support and the piezoelectric substrate. The module substrate, the cover, and the piezoelectric substrate are disposed in this order in a perpendicular or substantially perpendicular direction with respect to the module substrate, and a shield electrode is provided on a surface of the cover that faces the module substrate or on a surface of the cover that faces the piezoelectric substrate.Type: GrantFiled: June 14, 2018Date of Patent: November 24, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Yukiteru Sugaya
-
Publication number: 20200287285Abstract: A wiring board includes couplers and external connection terminals including a first terminal group including a first antenna terminal and a first monitor terminal respectively connected to an output terminal and a coupler terminal of a coupler, and a first spacer terminal between the first antenna terminal and the first monitor terminal, and a second terminal group including a second antenna terminal and a second monitor terminal respectively connected to an output terminal and a coupler terminal of a coupler, and a second spacer terminal between the second antenna terminal and the second monitor terminal.Type: ApplicationFiled: May 26, 2020Publication date: September 10, 2020Inventor: Yukiteru SUGAYA
-
Patent number: 10700431Abstract: A wiring board includes couplers and external connection terminals including a first terminal group including a first antenna terminal and a first monitor terminal respectively connected to an output terminal and a coupler terminal of a coupler, and a first spacer terminal between the first antenna terminal and the first monitor terminal, and a second terminal group including a second antenna terminal and a second monitor terminal respectively connected to an output terminal and a coupler terminal of a coupler, and a second spacer terminal between the second antenna terminal and the second monitor terminal.Type: GrantFiled: May 1, 2019Date of Patent: June 30, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Yukiteru Sugaya
-
Patent number: 10680579Abstract: A transmission filter in a high frequency module includes serial arm resonators electrically connected in series to a serial arm electrically connecting a shared terminal and a transmission terminal, parallel arm resonators each electrically connected in series to each of parallel arms electrically connecting the serial arm and a ground, a first inductor electrically connected between the ground and a connection end electrically connecting at least the two parallel arm resonators of the parallel arm resonators, and a second inductor electrically connected between the ground and one parallel arm resonator different from the at least two parallel arm resonators of the parallel arm resonators. The second inductor is electromagnetic field coupled to at least one of an antenna side matching element, a transmission side matching element, and a portion of the serial arm in the transmission filter. The first and second inductors obstruct electromagnetic field coupling therebetween.Type: GrantFiled: August 20, 2019Date of Patent: June 9, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Masanori Kato, Shinya Mizoguchi, Yukiteru Sugaya
-
Publication number: 20190379350Abstract: A transmission filter in a high frequency module includes serial arm resonators electrically connected in series to a serial arm electrically connecting a shared terminal and a transmission terminal, parallel arm resonators each electrically connected in series to each of parallel arms electrically connecting the serial arm and a ground, a first inductor electrically connected between the ground and a connection end electrically connecting at least the two parallel arm resonators of the parallel arm resonators, and a second inductor electrically connected between the ground and one parallel arm resonator different from the at least two parallel arm resonators of the parallel arm resonators. The second inductor is electromagnetic field coupled to at least one of an antenna side matching element, a transmission side matching element, and a portion of the serial arm in the transmission filter. The first and second inductors obstruct electromagnetic field coupling therebetween.Type: ApplicationFiled: August 20, 2019Publication date: December 12, 2019Inventors: Masanori KATO, Shinya MIZOGUCHI, Yukiteru SUGAYA
-
Patent number: 10439588Abstract: A transmission filter in a high frequency module includes serial arm resonators electrically connected in series to a serial arm electrically connecting a shared terminal and a transmission terminal, parallel arm resonators each electrically connected in series to each of parallel arms electrically connecting the serial arm and a ground, a first inductor electrically connected between the ground and a connection end electrically connecting at least the two parallel arm resonators of the parallel arm resonators, and a second inductor electrically connected between the ground and one parallel arm resonator different from the at least two parallel arm resonators of the parallel arm resonators. The second inductor is electromagnetic field coupled to at least one of an antenna side matching element, a transmission side matching element, and a portion of the serial arm in the transmission filter. The first and second inductors obstruct electromagnetic field coupling therebetween.Type: GrantFiled: October 26, 2017Date of Patent: October 8, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Masanori Kato, Shinya Mizoguchi, Yukiteru Sugaya
-
Publication number: 20190260128Abstract: A wiring board includes couplers and external connection terminals including a first terminal group including a first antenna terminal and a first monitor terminal respectively connected to an output terminal and a coupler terminal of a coupler, and a first spacer terminal between the first antenna terminal and the first monitor terminal, and a second terminal group including a second antenna terminal and a second monitor terminal respectively connected to an output terminal and a coupler terminal of a coupler, and a second spacer terminal between the second antenna terminal and the second monitor terminal.Type: ApplicationFiled: May 1, 2019Publication date: August 22, 2019Inventor: Yukiteru SUGAYA
-
Patent number: 10340883Abstract: A high-frequency module includes a SAW filter including a piezoelectric substrate and an electrode pattern provided on the piezoelectric substrate, a module substrate, a resin member covering the SAW filter, and a wiring pattern connected to the electrode pattern and provided on the resin member. The electrode pattern and the wiring pattern are inductively coupled, capacitively coupled, or inductively coupled and capacitively coupled with each other.Type: GrantFiled: June 14, 2018Date of Patent: July 2, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Yukiteru Sugaya
-
Patent number: 10270485Abstract: A switch module includes a switch circuit and a filter. The switch circuit includes two or more selection terminals, a common terminal provided for the two or more selection terminals, and first and second bypass terminals. The filter is connected between the first and second bypass terminals and reduces harmonics of a radio-frequency signal which passes through the filter. The switch circuit is selectively switched between a first connection mode and a second connection mode. In the first connection mode, the common terminal is connected to any of the two or more selection terminals. In the second connection mode, the common terminal is connected to the first bypass terminal and the second bypass terminal is connected to any of the two or more selection terminals.Type: GrantFiled: May 9, 2017Date of Patent: April 23, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Yukiteru Sugaya
-
Publication number: 20180302062Abstract: A high-frequency module includes a module substrate including an internal wiring pattern, and a SAW filter including a piezoelectric substrate, an electrode pattern on the piezoelectric substrate, a support surrounding the electrode pattern, and a cover on the support covering the electrode pattern to define a hollow space together with the support and the piezoelectric substrate. The module substrate, the cover, and the piezoelectric substrate are disposed in this order in a perpendicular or substantially perpendicular direction with respect to the module substrate, and a shield electrode is provided on a surface of the cover that faces the module substrate or on a surface of the cover that faces the piezoelectric substrate.Type: ApplicationFiled: June 14, 2018Publication date: October 18, 2018Inventor: Yukiteru SUGAYA