Abstract: The conductive composition of the present embodiment contains metal nanoparticles having an average particle diameter of 30 nm to 600 nm, metal particles having an average particle diameter larger than that of the metal nanoparticles, a thermosetting resin having an oxirane ring in a molecule, a curing agent, and a cellulose resin. Then, the specific resistance of the conductor formed by applying and calcining the conductive composition on the substrate is preferably 5.0×10?6 ?·cm or less, and the conductor does not peel from the substrate when a tape having an adhesive force of 3.9 N/10 mm to 39 N/10 mm is pressed against the conductor and peeled off.

Abstract: A printed circuit board includes a substrate and wiring provided on a surface of the substrate and including a cured conductive paste. The conductive paste contains metal nanoparticles having an average particle diameter of 30 nm or more and 600 nm or less, metal particles having an average particle diameter larger than that of the metal nanoparticles, a thermosetting resin having an oxirane ring in a molecule, a curing agent, and a cellulose resin. The wiring has a width of 0.3 mm or more and 6 mm or less, a thickness of 10 ?m or more and 40 ?m or less, and a resistance value of 500 m?/m or more and 5000 m?/m or less, and a welding strength of the electronic component to the substrate is 30 N or more.

Abstract: A printed wiring board includes a substrate and wiring provided on a surface of the substrate and including a cured conductive paste. The conductive paste contains metal nanoparticles having an average particle diameter of 30 nm or more and 600 nm or less, metal particles having an average particle diameter larger than that of the metal nanoparticles, a thermosetting resin having an oxirane ring in a molecule, a curing agent, and a cellulose resin. The wiring has a length of 100 mm or more and 1600 mm or less, a width of 0.3 mm or more and 3 mm or less, a thickness of 10 ?m or more and 40 ?m or less, and a resistance value of 1000 m?/m or less.

Abstract: The conductive composition of the present embodiment contains metal nanoparticles having an average particle diameter of 30 nm to 600 nm, metal particles having an average particle diameter larger than that of the metal nanoparticles, a thermosetting resin having an oxirane ring in a molecule, a curing agent, and a cellulose resin. Then, the specific resistance of the conductor formed by applying and calcining the conductive composition on the substrate is preferably 5.0×10?6 ?·cm or less, and the conductor does not peel from the substrate when a tape having an adhesive force of 3.9 N/10 mm to 39 N/10 mm is pressed against the conductor and peeled off.

Abstract: An electrically conductive paste contains: metal nanoparticles which are protected by an organic compound containing an amino group and have an average particle diameter of 30 nm to 400 nm; metal particles which are protected by a higher fatty acid and have an average particle diameter of 1 ?m to 5 ?m; an organic solvent; and a resin component consisting of a cellulose derivative. A conductor obtained by firing the electrically conductive paste has a film thickness of 30 ?m or more and a specific resistance of 5.0×10?6 ?·cm or less. In this way, the electrically conductive paste can reduce the resistance of the obtained conductor and to increase the amount of current flowing. A wiring board includes a conductor obtained from the electrically conductive paste.

Abstract: A printed circuit body includes a bus bar as a metal member electrically connected with a connected body, an insulator layer providing insulation properties, and a conductor layer formed across the metal member and the insulator layer and electrically connected with the metal member. The metal member and the insulator layer are positioned such that a metal-member side connected surface of the metal member on which the conductor layer is provided and an insulator-layer side connected surface of the insulator layer on which the conductor layer is provided are positioned at an identical plane. This configuration allows connection between the bus bar and the conductor layer and circuit formation to be simultaneously achieved at manufacturing of the printed circuit body, thereby facilitating formation of a wiring structure of the bus bar and the conductor layer.

Abstract: An exterior member having a tubular shape so as to accommodate and protect one conduction path or a plurality of conduction paths includes a resin portion. The resin portion includes a flexible tube portion having flexibility and a straight tube portion so as to linearly route the conduction path. The flexible tube portion and the straight tube portion are continuously formed. The flexible tube portion includes a spiral projection portion in which a first projection having a projecting shape as seen from a tube outer surface side spirally extends in a circumferential direction of the tube outer surface. The straight tube portion includes a straight projection portion in which a second projection continuously extends from an end portion of the spiral projection portion extends in a tube axis direction as the straight tube portion.

Abstract: An exterior member having a tubular shape so as to accommodate and protect one conduction path or a plurality of conduction paths includes a resin portion. The resin portion includes a flexible tube portion having flexibility and a straight tube portion so as to linearly route the conduction path. The flexible tube portion and the straight tube portion are continuously formed. The flexible tube portion includes a spiral projection portion in which a first projection having a projecting shape as seen from a tube outer surface side spirally extends in a circumferential direction of the tube outer surface. The straight tube portion includes a straight projection portion in which a second projection continuously extends from an end portion of the spiral projection portion extends in a tube axis direction as the straight tube portion.

Abstract: A printed circuit body includes a bus bar as a metal member electrically connected with a connected body, an insulator layer providing insulation properties, and a conductor layer formed across the metal member and the insulator layer and electrically connected with the metal member. The metal member and the insulator layer are positioned such that a metal-member side connected surface of the metal member on which the conductor layer is provided and an insulator-layer side connected surface of the insulator layer on which the conductor layer is provided are positioned at an identical plane. This configuration allows connection between the bus bar and the conductor layer and circuit formation to be simultaneously achieved at manufacturing of the printed circuit body, thereby facilitating formation of a wiring structure of the bus bar and the conductor layer.