Abstract: A method of manufacturing a light-emitting device includes steps of: preparing at least one substrate having a plurality of through holes; providing an electric wire on a rear surface side of the substrate so that a plurality of portions of the electric wire communicates with a front surface side of the substrate at the plurality of through holes of the substrate; and respectively mounting a plurality of light-emitting diodes to the respective portions of the electric wire that communicate with the front surface side of the substrate.

Abstract: A method of manufacturing a light emitting element mounting base member includes: arranging a plurality of core members each including an electrical conductor core and a light-reflecting insulating member provided on a surface of the electrical conductor core; integrally holding the core members with a light blocking resin; and partially removing the insulating members such that at least one surface of the electrical conductor cores is exposed from the light blocking resin.

Abstract: A method of manufacturing a light emitting element mounting base member includes: providing a first insulating member in a plate shaped having at least one recess portion or at least one through-hole; disposing in the recess portion or in the through-hole a light blocking resin and a plurality of core members each equipped with a second insulating member having light reflectivity on each surface of a plurality of electrical conductor cores; and exposing at least one of the surface of the electrical conductor cores from the second insulating members by removing each part of at least one of the second insulating members.

Abstract: A method of manufacturing a light emitting element mounting base member includes: arranging a plurality of core members each including an electrical conductor core and a light-reflecting insulating member provided on a surface of the electrical conductor core; cutting the arranged core members to form a base member preparatory body including at least one cut surface on which at least one of the electrical conductor cores and the insulating members are exposed; and insert molding by placing the base member preparatory body in a set of mold, and injecting a light blocking resin composition into the set of mold such that at least one of the electrical conductor cores or at least one metal film formed on at least one of the electrical conductor cores are exposed on at least one outer surface of the light emitting element mounting base member.

Abstract: A light-emitting device may comprise a substrate, an electric wire fixed to the substrate, and a plurality of light-emitting diodes mounted to the electric wire. According to one embodiment, each of the plurality of light-emitting diodes is an LED chip, and the light-emitting diodes on the substrate are sealed individually or collectively by one or more sealing members. According to another embodiment, the substrate has a plurality of through holes, wherein a plurality of portions of the electric wire provided on a rear surface side of the substrate communicates with a front surface side of the substrate at the plurality of through holes of the substrate, and wherein the plurality of light-emitting diodes is respectively mounted to the respective portions of the electric wire that communicate with the front surface side of the substrate. Other embodiments relate to methods of manufacturing a light-emitting device.

Abstract: A light-emitting element includes: a light transmissive substrate having a first main surface, a second main surfaces, a first lateral surface, a second lateral surface, a third lateral surface, and a fourth lateral surface; a semiconductor layered body; a first light reflection member; and a second light reflection member. A cross-sectional plane of the light transmissive substrate perpendicular to the first main surface and intersecting with the third lateral surface and the fourth lateral surface has a first concave figure having a first recess. The deepest portion of the first recess is arranged on an inner side of an outer periphery of the semiconductor layered body. The third lateral surface includes one or more surfaces defining the first recess.

Abstract: A light emitting device includes a substrate member and at least one light emitting element. The substrate member has a groove portion defined between two wiring portions spaced apart from each other. The groove portion includes a first groove portion, a second groove portion, and a third groove portion. The first groove portion extends in a direction that forms a slanted angle with respect to a first direction, the second groove portion is spaced apart from the first groove and extends in a direction that forms a slanted angle with respect to the first direction, and the third groove portion is interconnected with the first groove portion and the second groove portion. The light emitting element is disposed over the third groove portion.

Abstract: A light-emitting device may comprise a substrate, an electric wire fixed to the substrate, and a plurality of light-emitting diodes mounted to the electric wire. According to one embodiment, each of the plurality of light-emitting diodes is an LED chip, and the light-emitting diodes on the substrate are sealed individually or collectively by one or more sealing members. According to another embodiment, the substrate has a plurality of through holes, wherein a plurality of portions of the electric wire provided on a rear surface side of the substrate communicates with a front surface side of the substrate at the plurality of through holes of the substrate, and wherein the plurality of light-emitting diodes is respectively mounted to the respective portions of the electric wire that communicate with the front surface side of the substrate. Other embodiments relate to methods of manufacturing a light-emitting device.

Abstract: A light-emitting device may comprise a substrate, an electric wire fixed to the substrate, and a plurality of light-emitting diodes mounted to the electric wire. According to one embodiment, each of the plurality of light-emitting diodes is an LED chip, and the light-emitting diodes on the substrate are sealed individually or collectively by one or more sealing members. According to another embodiment, the substrate has a plurality of through holes, wherein a plurality of portions of the electric wire provided on a rear surface side of the substrate communicates with a front surface side of the substrate at the plurality of through holes of the substrate, and wherein the plurality of light-emitting diodes is respectively mounted to the respective portions of the electric wire that communicate with the front surface side of the substrate. Other embodiments relate to methods of manufacturing a light-emitting device.

Abstract: A method for manufacturing a light-emitting device comprises retaining a conductor wire so that a straight-line distance between adjacent mounting portions while the conductor is retained is less than a distance along the conductor wire between the adjacent mounting portions; mounting a plurality of light emitting diodes to respective ones of the mounting portions on the retained conductor wire; and after the mounting step, sealing the plurality of light-emitting diodes mounted on the conductor wire.

Abstract: A light emitting element includes a semiconductor including an active layer, and a planar shape of the light emitting elements including a concave polygon. The planar shape of the concave polygon has interior angles including at least one acute angle.

Abstract: A light source device includes a light source main unit made of a combination of a plurality of semiconductor laser devices, a plurality of collimator lens respectively capable of converting light beams emitted by the respective semiconductor laser devices of the light source main unit to respective approximately parallel light beam fluxes, and a condenser lens capable of condensing light beam fluxes emitted by the plurality of collimator lenses. The light source main unit has the plurality of semiconductor laser devices arranged, when viewed from the condenser lens, so that the stems of the adjacent semiconductor laser devices are seemingly continuous in a first direction perpendicular to the optical axis of the condenser lens, and the stems of the adjacent semiconductor laser devices are overlapped in a second direction perpendicular to both the direction of optical axis and the first direction.

Abstract: A light emitting device includes a substrate member and at least one light emitting element. The substrate member has a groove portion defined between two wiring portions spaced apart from each other. The groove portion includes a first groove portion, a second groove portion, and a third groove portion. The first groove portion extends in a direction that forms a slanted angle with respect to a first direction, the second groove portion is spaced apart from the first groove and extends in a direction that forms a slanted angle with respect to the first direction, and the third groove portion is interconnected with the first groove portion and the second groove portion. The light emitting element is disposed over the third groove portion.

Abstract: A light-emitting device may comprise a substrate, an electric wire fixed to the substrate, and a plurality of light-emitting diodes mounted to the electric wire. According to one embodiment, each of the plurality of light-emitting diodes is an LED chip, and the light-emitting diodes on the substrate are sealed individually or collectively by one or more sealing members. According to another embodiment, the substrate has a plurality of through holes, wherein a plurality of portions of the electric wire provided on a rear surface side of the substrate communicates with a front surface side of the substrate at the plurality of through holes of the substrate, and wherein the plurality of light-emitting diodes is respectively mounted to the respective portions of the electric wire that communicate with the front surface side of the substrate. Other embodiments relate to methods of manufacturing a light-emitting device.

Abstract: A method for manufacturing a light-emitting device comprises retaining a conductor wire so that a straight-line distance between adjacent mounting portions while the conductor is retained is less than a distance along the conductor wire between the adjacent mounting portions; mounting a plurality of light emitting diodes to respective ones of the mounting portions on the retained conductor wire; and after the mounting step, sealing the plurality of light-emitting diodes mounted on the conductor wire.

Abstract: A light source device includes a light source main unit made of a combination of a plurality of semiconductor laser devices, a plurality of collimator lens respectively capable of converting light beams emitted by the respective semiconductor laser devices of the light source main unit to respective approximately parallel light beam fluxes, and a condenser lens capable of condensing light beam fluxes emitted by the plurality of collimator lenses. The light source main unit has the plurality of semiconductor laser devices arranged, when viewed from the condenser lens, so that the stems of the adjacent semiconductor laser devices are seemingly continuous in a first direction perpendicular to the optical axis of the condenser lens, and the stems of the adjacent semiconductor laser devices are overlapped in a second direction perpendicular to both the direction of optical axis and the first direction.

Abstract: To provide a point emission type light emitting element that restricts the light emitting area within a sufficiently tiny region and can be manufactured at a low cost, the point emission type light emitting element is a light emitting element that has stripe ridge comprising an n-type layer, an active layer and a p-type layer that are formed from semiconductors on a substrate, so as to emit light from one end face of the stripe ridge, wherein the stripe ridge has a protruding portion on the end face described above and the surface of the light emitting element is covered with an shading film except for the tip of the protruding portion.

Abstract: To provide a point emission type light emitting element that restricts the light emitting area within a sufficiently tiny region and can be manufactured at a low cost, the point emission type light emitting element is a light emitting element that has stripe ridge comprising an n-type layer, an active layer and a p-type layer that are formed from semiconductors on a substrate, so as to emit light from one end face of the stripe ridge, wherein the stripe ridge has a protruding portion on the end face described above and the surface of the light emitting element is covered with an shading film except for the tip of the protruding portion.