Abstract: A first conductive pattern having a pitch of not more than a predetermined pitch is formed on a main surface of a thin flexible substrate. In addition, a second conductive pattern having a pitch of not less than the predetermined pitch is formed on a rear surface of the substrate. A through hole is formed so as to be enclosed by respective parts of the areas, mainly, land areas at edge portions, of the conductive patterns and has openings at both front and rear sides of the substrate. In the through hole, a high viscosity conductive material formed by screen printing from the main surface side of the flexible substrate and a low viscosity conductive material formed by screen printing from the rear surface side contact each other. Accordingly, a via connection structure is formed.

Abstract: An improved flip chip mounting method is provided for mounting an IC chip on a substrate. The IC chip has one surface and electrodes formed on the one surface, and the IC chip is positioned so that the electrodes oppose the substrate. The IC chip and the substrate are heat bonded to one another with a sheet of anisotropic conductive adhesive and paste-like adhesive being placed between the IC chip and the substrate.

Abstract: A small-sized electronic device with depth gauge includes a pressure sensor for measuring a present water pressure and outputting a pressure value. A memory stores the pressure data. A dive time measuring circuit measures a dive time interval. A mean depth calculator receives the pressure data and dive time interval and in response thereto outputs a mean depth value which is displayed on the device.

Abstract: A small electronic device having a depth gauge is provided. An electronic device includes a pressure sensor which produces a signal corresponding to a depth. A first memory stores decompression data while a second memory stores residual nitrogen time. The first counter counts a dive time while a second counter counts a surface interval time. A calculating circuit calculates non-decompression time limits based upon the depth information and decompression data. A decompression management circuit determines when the decompression time limit has exceed and calculates the decompression dot profile and output decompression dive data. A second calculating circuit calculates repetitive dive non-decompression time limits based upon the previous the dive depth, dive time interval surface time interval and the residual nitrogen time. The control circuit receives each bit of information and causes a displayed display information either simultaneously or independently.