Patents by Inventor Yukiyasu Miyazaki

Yukiyasu Miyazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead structure of semiconductor device
    Patent number: 5442134
    Abstract: Disclosed is a semiconductor device such as a DIP (Dual In-line Package) or PGA (Pin Grid Alley), which has a plurality of leads protruding only from one surface of a flat package. A single independent lead protrudes from the surface of the package at the position which is aligned with a guide hole formed in the package. The independent lead has a bore which penetrates through the lead lengthwise and connects to the guide hole. A wiring member of an electronic part or the like placed in the bore via the guide hole is soldered to the inner wall of the independent terminal.
    Type: Grant
    Filed: December 1, 1994
    Date of Patent: August 15, 1995
    Assignees: Kabushiki Kaisha Toyoda Jidoshokki Seisakusho, Toyota Jidosha Kabushiki Kaisha, Kyocera Corporation
    Inventors: Yukiyasu Miyazaki, Nobuyoshi Sugitani, Yoshiaki Shimojo