Patents by Inventor Yukiyoshi Saito
Yukiyoshi Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240084753Abstract: A control device and method controls a vehicle having an internal combustion engine connected to an automatic transmission via a torque converter with a lockup device. The torque of the internal combustion engine is limited the by a torque limit value based on a speed difference between an input rotational speed and an output rotational speed of the torque converter during acceleration in a non-lockup state. The torque-limiting of the internal combustion engine is prohibited torque-limiting upon a prescribed condition being met. The prescribed condition is met by a heating request, during hill climbing/towing, during travel at high vehicle speeds, when the accelerator pedal opening angle exceeds or is equal to a prescribed opening angle, when the torque limit value is greater than a target torque, in a range other than a D range, or in a mode other than normal mode.Type: ApplicationFiled: November 29, 2021Publication date: March 14, 2024Inventors: Tetsuya NISHIYAMA, Daigo KISHI, Tatsuo NAKANO, Seiichirou TAKAHASHI, Koji SAITO, Yukiyoshi INUTA, Takao ARIMATSU, Yasuhiro ENDO
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Publication number: 20230282493Abstract: A substrate processing system includes: a carry-in/out section in which a cassette accommodating a plurality of substrates is carried in/out; a batch processing section in which a wafer lot including the plurality of substrates is collectively processed in a state where each of the plurality of substrates stand upright; a single-wafer processing section in which the plurality of substrates included in the wafer lot are processed one by one in a horizontal state; and an interface section that delivers the plurality of substrates from the batch processing section to the single-wafer processing section. The interface section includes: a standby table that horizontally holds a substrate in a state of being in contact with pure water; and a transfer mechanism that delivers the substrate from the batch processing section to the standby table.Type: ApplicationFiled: February 28, 2023Publication date: September 7, 2023Inventors: Keita HIRASE, Yukiyoshi SAITO, Akihiro TERAMOTO, Koji TANAKA, Shota TAKEI, Masataka GOSHO, Kazuaki KITAMURA, Shinichi IKEDA, Shunsuke KURIZAKI, Yuji KIMURA
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Publication number: 20230268202Abstract: A substrate processing system includes: a carry-in/out section in which a cassette accommodating a plurality of substrates is carried in/out; a batch processing section in which a wafer lot including the plurality of substrates is collectively processed; a single-wafer processing section in which the substrates of the wafer lot is processed one by one; and an interface section that delivers the substrates between the batch processing section and the single-wafer processing section. The batch processing section includes: a processing bath in which the wafer lot is immersed and processed; and a first transfer device that transfers the wafer lot to the processing bath. The interface section includes: an immersion bath disposed outside a movement range of the first transfer device and that immerses the wafer lot; and a second transfer device that holds and transfers the wafer lot between the first transfer device and the immersion bath.Type: ApplicationFiled: February 7, 2023Publication date: August 24, 2023Inventors: Keita HIRASE, Koji TANAKA, Yukiyoshi SAITO, Keisuke SASAKI
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Patent number: 10506932Abstract: A vascular viscoelasticity evaluation device and method in which, a pulse wave obtained using a cuff is subjected to first derivation, a positive amplitude peak value Vf1 that occurs first and a negative amplitude peak value Vr2 that occurs second out of a plurality of negative amplitude peak values are detected in a state in which an external force substantially the same as or greater than the systolic blood pressure has been exerted on a blood vessel, and a ratio of the positive amplitude peak value Vf1 that occurs first to the negative amplitude peak value Vr2 that occurs second is calculated, and then the vascular viscoelasticity is evaluated on the basis of this calculated ratio.Type: GrantFiled: March 24, 2014Date of Patent: December 17, 2019Assignees: Shisei Datum Co., Ltd., RIKENInventors: Yukiyoshi Saito, Ryutaro Himeno, Shu Takagi, Fuyou Liang
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Patent number: 10290518Abstract: A substrate liquid processing apparatus includes a substrate holding device which holds a substrate in horizontal position and rotate the substrate around vertical axis of the substrate, a liquid discharge device which is positioned underneath central portion of lower surface of the substrate in the horizontal position and discharges processing liquid toward the lower surface of the substrate, and a gas discharge passage structure which has a gas discharge passage formed around the discharge device such that drying gas passes through. The discharge device has a head including a cover which is extending beyond upper end of the passage such that the cover is covering the upper end of the passage, a liquid discharge port which is protruding from the cover toward the substrate in the horizontal position, and a curved portion which is formed between the port and cover such that the curved portion has a surface bending downward.Type: GrantFiled: August 25, 2015Date of Patent: May 14, 2019Assignee: TOKYO ELECTRON LIMITEDInventors: Kento Kurusu, Yukiyoshi Saito, Seiki Ishida
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Patent number: 10236196Abstract: A substrate processing system is provided. The substrate processing system includes: a first transfer apparatus; at least two first accommodating units including an upper first accommodating unit and a lower first accommodating unit; multiple first substrate processing units, which are divided into at least a first group and a second group and arranged in a height direction; an upper second accommodating unit corresponding to the first group; an upper second transfer apparatus corresponding to the first group; a lower second accommodating unit corresponding to the second group; a lower second transfer apparatus corresponding to the second group; a first delivery apparatus corresponding to the first group; and a second delivery apparatus corresponding to the second group.Type: GrantFiled: July 11, 2017Date of Patent: March 19, 2019Assignee: TOKYO ELECTRON LIMITEDInventors: Yukiyoshi Saito, Kumpei Tada
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Publication number: 20170309504Abstract: A substrate processing system is provided. The substrate processing system includes: a first transfer apparatus; at least two first accommodating units including an upper first accommodating unit and a lower first accommodating unit; multiple first substrate processing units, which are divided into at least a first group and a second group and arranged in a height direction; an upper second accommodating unit corresponding to the first group; an upper second transfer apparatus corresponding to the first group; a lower second accommodating unit corresponding to the second group; a lower second transfer apparatus corresponding to the second group; a first delivery apparatus corresponding to the first group; and a second delivery apparatus corresponding to the second group.Type: ApplicationFiled: July 11, 2017Publication date: October 26, 2017Inventors: Yukiyoshi Saito, Kumpei Tada
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Patent number: 9730594Abstract: An arterial-wall stiffness evaluation system of the present invention includes: a cuff to be attached to a part of a living body; a pressure sensor for detecting pressure in the cuff; a cuff-pressure control section for controlling the pressure in the cuff to be increased or decreased up to a predetermined value, based on a value detected by the pressure sensor; and a data processing section for calculating, based on pulse waves detected by the pressure sensor, pulse-wave amplitudes of cuff-pressure pulse waves and blood-pressure pulse waves, and for evaluating arterial-wall stiffness based on the pulse-wave amplitudes. The arterial-wall stiffness is evaluated by a pressure-diameter characteristic curve, which represents a relationship between vascular diameter and transmural pressure applied to a vascular wall, or by estimation from shapes and amplitudes of the detected pulse waves.Type: GrantFiled: September 17, 2008Date of Patent: August 15, 2017Assignees: NATIONAL INSTITUTE OF ADVANCE INDUSTRIAL SCIENCE AND TECHNOLOGY, SHISEI DATUM CO., LTD.Inventors: Hidehiko Komine, Yoshiyuki Asai, Takashi Yokoi, Yukiyoshi Saito
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Patent number: 9305819Abstract: A first transfer apparatus unloads and transfers substrates from a cassette. A first accommodating unit accommodates the substrates. First substrate processing units divided into at least two groups and arranged in a height direction performs a process to the substrates. Second accommodating units respectively corresponding to the groups are arranged to be parallel with the first accommodating unit in the height direction. Second transfer apparatuses respectively corresponding to the groups unload and transfer the substrates from the second accommodating units corresponding to the same groups into the first substrate processing units of the same groups. Second substrate processing units respectively corresponding to the groups are arranged to be parallel with the first and second accommodating units in the height direction.Type: GrantFiled: November 13, 2014Date of Patent: April 5, 2016Assignee: TOKYO ELECTRON LIMITEDInventors: Yukiyoshi Saito, Tomohiro Kaneko
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Publication number: 20160064259Abstract: A substrate liquid processing apparatus includes a substrate holding device which holds a substrate in horizontal position and rotate the substrate around vertical axis of the substrate, a liquid discharge device which is positioned underneath central portion of lower surface of the substrate in the horizontal position and discharges processing liquid toward the lower surface of the substrate, and a gas discharge passage structure which has a gas discharge passage formed around the discharge device such that drying gas passes through. The discharge device has a head including a cover which is extending beyond upper end of the passage such that the cover is covering the upper end of the passage, a liquid discharge port which is protruding from the cover toward the substrate in the horizontal position, and a curved portion which is formed between the port and cover such that the curved portion has a surface bending downward.Type: ApplicationFiled: August 25, 2015Publication date: March 3, 2016Applicant: TOKYO ELECTRON LIMITEDInventors: Kento KURUSU, Yukiyoshi SAITO, Seiki ISHIDA
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Publication number: 20160051151Abstract: A vascular viscoelasticity evaluation device and method in which, a pulse wave obtained using a cuff is subjected to first derivation, a positive amplitude peak value Vf1 that occurs first and a negative amplitude peak value Vr2 that occurs second out of a plurality of negative amplitude peak values are detected in a state in which an external force substantially the same as or greater than the systolic blood pressure has been exerted on a blood vessel, and a ratio of the positive amplitude peak value Vf1 that occurs first to the negative amplitude peak value Vr2 that occurs second is calculated, and then the vascular viscoelasticity is evaluated on the basis of this calculated ratio.Type: ApplicationFiled: March 24, 2014Publication date: February 25, 2016Applicant: SHISEI DATUM CO., LTD.Inventors: Yukiyoshi SAITO, Ryutaro HIMENO, Shu TAKAGI, Fuyou LIANG
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Publication number: 20150132085Abstract: A first transfer apparatus unloads and transfers substrates from a cassette. A first accommodating unit accommodates the substrates. First substrate processing units divided into at least two groups and arranged in a height direction performs a process to the substrates. Second accommodating units respectively corresponding to the groups are arranged to be parallel with the first accommodating unit in the height direction. Second transfer apparatuses respectively corresponding to the groups unload and transfer the substrates from the second accommodating units corresponding to the same groups into the first substrate processing units of the same groups. Second substrate processing units respectively corresponding to the groups are arranged to be parallel with the first and second accommodating units in the height direction.Type: ApplicationFiled: November 13, 2014Publication date: May 14, 2015Inventors: Yukiyoshi Saito, Tomohiro Kaneko
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Publication number: 20150132086Abstract: A first transfer apparatus unloads and transfers substrates from a cassette. A first accommodating unit accommodates the substrates. First substrate processing units are divided into at least two groups arranged in a height direction. Second accommodating units corresponding to the groups are arranged to be parallel with the first accommodating unit in the height direction. Second transfer apparatuses corresponding to the groups unload and transfer the substrates from the second accommodating units corresponding to the same groups into the first substrate processing units of the same groups. Delivery apparatuses corresponding to the groups deliver the substrates in the first accommodating unit to the second accommodating units corresponding to the same groups. The first accommodating unit corresponding to the two adjacent groups is arranged at a middle height position of the groups. The second accommodating units respectively corresponding to the groups are arranged on and below the first accommodating unit.Type: ApplicationFiled: November 13, 2014Publication date: May 14, 2015Inventors: Yukiyoshi Saito, Kumpei Tada
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Patent number: 8443513Abstract: Disclosed is a substrate processing apparatus which can achieve an improvement in throughput and suppress the reduction in the operation rate of the entire apparatus even when a problem occurs. In the disclosed apparatus, at the rear end of a substrate loading block including a loading/unloading arm for transferring a wafer to a carrier, a first, a second, and a third processing blocks are disposed in that order. In the substrate loading block, transfer stages are provide for transferring a wafer from the loading/unloading arm to the first processing block, for transferring a wafer to the second processing block, and for transferring a wafer to the third processing block so that the wafer on the transfer stage is directly carried to the second processing block by a first direct carrying mechanism, and to the third processing block by a second direct carrying mechanism.Type: GrantFiled: September 30, 2010Date of Patent: May 21, 2013Assignee: Tokyo Electron LimitedInventors: Seiki Ishida, Yukiyoshi Saito
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Patent number: 8251910Abstract: The present invention is directed to provide an apparatus for measuring a vascular viscoelasticity index which is noninvasive, simple in structure and yet inexpensive. The present invention provides an apparatus for measuring a vascular viscoelasticity index, which measures a vascular viscoelasticity index ? by a formula ?={(Pb2?Pa2)?(Pb1?Pa1)}/(Va2?Va1) wherein Pb1 is the maximal value of the first pulse wave; Va1 is the local maximum value of a time derivative value of the first pulse wave; Pa1 is the pulse wave amplitude corresponding to the local maximum value Va1; Pb2 is the maximal value of the second pulse wave; Va2 is the local maximum value of a time derivative value of the second pulse wave; and Pa2 is the pulse wave amplitude corresponding to the local maximum value Va2.Type: GrantFiled: July 7, 2007Date of Patent: August 28, 2012Assignees: Shisei Datum Co., Ltd., National Institute of Advanced Industrial Science and TechnologyInventors: Yukiyoshi Saito, Minoru Tokiwa, Toshikazu Yokokawa, Takashi Yokoi, Hidehiko Komine, Yoshiyuki Asai
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Publication number: 20110172546Abstract: An arterial-wall stiffness evaluation system of the present invention includes: a cuff to be attached to a part of a living body; a pressure sensor for detecting pressure in the cuff; a cuff-pressure control section for controlling the pressure in the cuff to be increased or decreased up to a predetermined value, based on a value detected by the pressure sensor; and a data processing section for calculating, based on pulse waves detected by the pressure sensor, pulse-wave amplitudes of cuff-pressure pulse waves and blood-pressure pulse waves, and for evaluating arterial-wall stiffness based on the pulse-wave amplitudes. The arterial-wall stiffness is evaluated by a pressure-diameter characteristic curve, which represents a relationship between vascular diameter and transmural pressure applied to a vascular wall, or by estimation from shapes and amplitudes of the detected pulse waves.Type: ApplicationFiled: September 17, 2008Publication date: July 14, 2011Inventors: Hidehiko Komine, Yoshiyuki Asai, Takashi Yokoi, Yukiyoshi Saito
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Publication number: 20110078898Abstract: Disclosed is a substrate processing apparatus which can achieve an improvement in throughput and suppress the reduction in the operation rate of the entire apparatus even when a problem occurs. In the disclosed apparatus, at the rear end of a substrate loading block including a loading/unloading arm for transferring a wafer to a carrier, a first, a second, and a third processing blocks are disposed in that order. In the substrate loading block, transfer stages are provide for transferring a wafer from the loading/unloading arm to the first processing block, for transferring a wafer to the second processing block, and for transferring a wafer to the third processing block so that the wafer on the transfer stage is directly carried to the second processing block by a first direct carrying mechanism, and to the third processing block by a second direct carrying mechanism.Type: ApplicationFiled: September 30, 2010Publication date: April 7, 2011Applicant: TOKYO ELECTRON LIMITEDInventors: Seiki ISHIDA, Yukiyoshi SAITO
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Publication number: 20090306523Abstract: The present invention is directed to provide an apparatus for measuring a vascular viscoelasticity index which is noninvasive, simple in structure and yet inexpensive. The present invention provides an apparatus for measuring a vascular viscoelasticity index, which measures a vascular viscoelasticity index ? by a formula ?={(Pb2?Pa2)?(Pb1?Pa1)}/(Va2?Va1) wherein Pb1 is the maximal value of the first pulse wave; Va1 is the local maximum value of a time derivative value of the first pulse wave; Pa1 is the pulse wave amplitude corresponding to the local maximum value Va1; Pb2 is the maximal value of the second pulse wave; Va2 is the local maximum value of a time derivative value of the second pulse wave; and Pa2 is the pulse wave amplitude corresponding to the local maximum value Va2.Type: ApplicationFiled: July 7, 2007Publication date: December 10, 2009Inventors: Yukiyoshi Saito, Minoru Tokiwa, Toshikazu Yokokawa, Takashi Yokoi, Hidehiko Komine, Yoshiyuki Asai