Patents by Inventor Yuko Adachi

Yuko Adachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Negative thermal expansion material, composite material, and method for producing negative thermal expansion material
    Patent number: 11970396
    Abstract: A negative thermal expansion material having a negative thermal expansion coefficient according to the present invention is represented by Zr2?aMaSxP2O12+?, where M is at least one selected from Ti, Ce, Sn, Mn, Hf, Ir, Pb, Pd, and Cr; a is 0?a<2; x is 0.4?x?1; and ? is a value defined as to satisfy a charge neutral condition. The present invention makes it possible to provide a negative thermal expansion material, a composite material and a method for producing a negative thermal expansion material that can realize reduction in cost and density reduction.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: April 30, 2024
    Assignees: TOKYO INSTITUTE OF TECHNOLOGY, MITSUI MINING & SMELTING CO., LTD.
    Inventors: Toshihiro Isobe, Yuko Hayakawa, Yuri Adachi, Ryosuke Uehara
  • Solid-state image pick-up device
    Patent number: 6891243
    Abstract: In a solid-state image pick-up device comprising a plurality of light receiving sensor sections, a vertical transfer path 12 formed close to each of the light receiving sensor sections, and a channel stopper 13 provided between the adjacent vertical transfer paths 12 and formed by an insulating layer having a trench structure, a conductive substance 15 to which a predetermined voltage is applied is buried in the insulating layer 14. The predetermined voltage is a negative voltage if a signal charge is an electron, and is a positive voltage if the signal charge is a hole. Alternatively, the predetermined voltage is a pulse having an opposite phase to that of a read pulse to be applied to a transfer electrode 17 of the vertical transfer path 12.
    Type: Grant
    Filed: July 10, 2003
    Date of Patent: May 10, 2005
    Assignee: Fugi Photo Film Co., Ltd.
    Inventors: Yuko Adachi, Tetsuo Yamada, Shinji Uya
  • Solid-state image pick-up device
    Publication number: 20040007754
    Abstract: In a solid-state image pick-up device comprising a plurality of light receiving sensor sections, a vertical transfer path 12 formed close to each of the light receiving sensor sections, and a channel stopper 13 provided between the adjacent vertical transfer paths 12 and formed by an insulating layer having a trench structure, a conductive substance 15 to which a predetermined voltage is applied is buried in the insulating layer 14. The predetermined voltage is a negative voltage if a signal charge is an electron, and is a positive voltage if the signal charge is a hole. Alternatively, the predetermined voltage is a pulse having an opposite phase to that of a read pulse to be applied to a transfer electrode 17 of the vertical transfer path 12.
    Type: Application
    Filed: July 10, 2003
    Publication date: January 15, 2004
    Inventors: Yuko Adachi, Tetsuo Yamada, Shinji Uya