Patents by Inventor Yuko Iwasaki

Yuko Iwasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230273181
    Abstract: Provided is a method of quantification of free sulfur that can accurately measure the free sulfur content of a rubber composition. The present disclosure relates to a method of quantification of free sulfur in a rubber composition, the method including extracting the free sulfur in the rubber composition with toluene.
    Type: Application
    Filed: February 6, 2023
    Publication date: August 31, 2023
    Applicant: SUMITOMO RUBBER INDUSTRIES, LTD.
    Inventors: Yuko IWASAKI, Yumi SAKAGUCHI, Hiroaki YAMADA
  • Patent number: 6873167
    Abstract: An evaluation device and method for DUT boards and probe cards which increase the reproducibility of the measured values and decrease the abrasion of pads in evaluation tests. A connection box is provided with contact pins, mounting mechanisms used to mount the DUT boards, and a plurality of connectors which feed signals from the contact pins to the outside.
    Type: Grant
    Filed: October 24, 2002
    Date of Patent: March 29, 2005
    Assignee: Agilent Technologies, Inc.
    Inventors: Akihiko Goto, Yuko Iwasaki, Tsuyoshi Tanaka, Koji Tokuno
  • Publication number: 20030082936
    Abstract: An evaluation device and method for DUT boards and probe cards which increase the reproducibility of the measured values and decrease the abrasion of pads in evaluation tests. A connection box is provided with contact pins, mounting mechanisms used to mount the DUT boards, and a plurality of connectors which feed signals from the contact pins to the outside.
    Type: Application
    Filed: October 24, 2002
    Publication date: May 1, 2003
    Applicant: Agilent Technologies, Inc.
    Inventors: Akihiko Goto, Yuko Iwasaki, Tsuyoshi Tanaka, Koji Tokuno
  • Patent number: 5929626
    Abstract: A contact making and breaking device improves the dielectric absorption property of capacitance between one signal wire brought out from a reed switch and an conductive casing. A low current measurement system using the contact making breaking device greatly shortens the measurement waiting time when low current is measured. The contact making and breaking device includes a reed switch with first and second signal wires brought out from either end, a conductive casing, and an insulating material formed between at least the first signal wire and the conductive casing. A tubular conductor is emplaced in the region in which the insulating material is formed and at least partially encloses the reed switch. The tubular conductor is connected to the first signal wire.
    Type: Grant
    Filed: November 3, 1997
    Date of Patent: July 27, 1999
    Assignee: Hewlett-Packard Company
    Inventors: Yuko Iwasaki, Susumu Takagi, Hideyuki Norimatsu
  • Patent number: 5880540
    Abstract: A signal switching apparatus performs precise and high speed measurements that indicate DUT breakdown. Several switching circuits having multiple signal switching apparatus provided in parallel with input terminals and output terminals. Each switching circuit is structured to have; (a) A first switch circuit which inputs the guard signal together with the low current measurement signal; (b) a current limiting circuit connected to a stress signal terminal on the input; (c) a second switch circuit connected on the input to the output of the current limiting circuit, having a guard terminal connected to the output of the first switch circuit; (d) A guarded line, one end of which is connected to the output terminals, and the other end of which is connected to the first switch circuit and the output of second switch circuit.
    Type: Grant
    Filed: August 28, 1996
    Date of Patent: March 9, 1999
    Assignee: Hewlett-Packard Company
    Inventors: Yoshiyuki Bessho, Yuko Iwasaki, Norio Sone
  • Patent number: 5742216
    Abstract: A contact making and breaking device improves the dielectric absorption property of capacitance between one signal wire brought out from a reed switch and an conductive casing. A low current measurement system using the contact making breaking device greatly shortens the measurement waiting time when low current is measured. The contact making and breaking device includes a reed switch with first and second signal wires brought out from either end, a conductive casing, and an insulating material formed between at least the first signal wire and the conductive casing. A tubular conductor is emplaced in the region in which the insulating material is formed and at least partially encloses the reed switch. The tubular conductor is connected to the first signal wire.
    Type: Grant
    Filed: April 2, 1996
    Date of Patent: April 21, 1998
    Assignee: Hewlett-Packard Company
    Inventors: Yuko Iwasaki, Susumu Takagi, Hideyuki Norimatsu