Abstract: The water-based resist stripping liquid management apparatus according to the present invention manages in an adjusting bath a water-based resist stripping liquid that is used in resist stripping equipment. In this apparatus, an absorptiometer that measures the water concentration in the water-based resist stripping liquid and an electrical conductivity meter that measures the degraded component concentration in the water-based resist stripping liquid are connected to a resist stripping treatment bath (adjusting bath) via pipelines, and at least one of a resist stripping stock liquid, a resist stripping reclaimed liquid, pure water, and a premixed resist stripping new liquid are fed into the resist stripping treatment bath in accordance with the measurement values obtained. As a result, the resist stripping performance of the water-based resist stripping liquid can be stably maintained, the amount of liquid used can be reduced, and the time for which operation is shut down can be reduced.

Abstract: A processing solution preparation and supply apparatus includes a dissolving preparation bath to which a material powder and ultrapure water are supplied. This dissolving preparation bath is connected to a substrate processing apparatus via a pipe, and a processing solution prepared from the material powder on-site is supplied to the processing apparatus. To reduce an increase in the microorganism concentration in the ultrapure water, this ultrapure water is circulated substantially constantly. This suppresses deterioration and concentration fluctuations of a processing solution for use in processing of a semiconductor substrate, when this processing solution is supplied to the use side. This also reduces particles and improves the economical efficiency.

Abstract: A treating liquid adjusting equipment for adjusting an alkali-based treating liquid for use in treating an organic film applied onto a substrate, which includes an adjusting portion. The adjusting portion for adjusting an alkalinity of the alkali-based treating liquid is such that a concentration of a first component contained in the alkali-based treating liquid and constituting an organic film of a same type as or different type from the organic film is in a range of 0.0001 to 2.0 mass %, and a concentration of an alkali component contained in the alkali-based treating liquid is in a range of 0.05 to 2.5 mass %.

Abstract: A processing solution preparation and supply apparatus includes a dissolving preparation bath to which a material powder and ultrapure water are supplied. This dissolving preparation bath is connected to a substrate processing apparatus via a pipe, and a processing solution prepared from the material powder on-site is supplied to the processing apparatus. To reduce an increase in the microorganism concentration in the ultrapure water, this ultrapure water is circulated substantially constantly. This suppresses deterioration and concentration fluctuations of a processing solution for use in processing of a semiconductor substrate, when this processing solution is supplied to the use side. This also reduces particles and improves the economical efficiency.

Abstract: The present invention has the object of supplying an alkali-based treating liquid capable of reducing the amount used for treatment and the amount of liquid wastes produced, having an excellent solubility with respect to an exposed organic film such as a photoresist, and an equipment for supplying the same. In a developing liquid supplying equipment of the present invention, a receiving bath is connected to a development treating equipment via a line, and a pre-treating portion such as a filter, an adjusting bath and a leveling bath are sequentially provided in the following stages of the receiving bath. A liquid supplying system and a control device are connected to the adjusting bath, and the concentrations of the dissolved photoresist component and the alkali component in a used liquid can be adjusted to certain values, based on actually measured values obtained with a densitometer. The obtained regenerated liquid is supplied to the development treating equipment through a line.

Abstract: The non-water-based resist stripping liquid management apparatus according to the present invention manages in an adjusting bath a non-water-based resist stripping liquid that is used in resist stripping equipment. In this apparatus, an absorptiometer that measures the MEA concentration in the non-water-based resist stripping liquid and an analyzer that measures the degraded component concentration in the non-water-based resist stripping liquid are connected to a resist stripping treatment bath (adjusting bath) via pipelines, and at least one of a resist stripping stock liquid, an MEA stock liquid, a resist stripping reclaimed liquid, and a premixed resist stripping new liquid are fed into the resist stripping treatment bath in accordance with the measurement values obtained. As a result, the resist stripping performance of the non-water-based resist stripping liquid can be stably maintained, the amount of liquid used can be reduced, and the time for which operation is shut down can be reduced.

Abstract: The water-based resist stripping liquid management apparatus according to the present invention manages in an adjusting bath a water-based resist stripping liquid that is used in resist stripping equipment. In this apparatus, an absorptiometer that measures the water concentration in the water-based resist stripping liquid and an electrical conductivity meter that measures the degraded component concentration in the water-based resist stripping liquid are connected to a resist stripping treatment bath (adjusting bath) via pipelines, and at least one of a resist stripping stock liquid, a resist stripping reclaimed liquid, pure water, and a premixed resist stripping new liquid are fed into the resist stripping treatment bath in accordance with the measurement values obtained. As a result, the resist stripping performance of the water-based resist stripping liquid can be stably maintained, the amount of liquid used can be reduced, and the time for which operation is shut down can be reduced.