Patents by Inventor Yuko Kimura

Yuko Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for treating copper surface
    Patent number: 4902551
    Abstract: Adhesion of copper to a resin layer is improved by reducing a copper oxide layer with an aqueous aldehyde solution (a) while applying a potential of -1000 mV to -400 mV to the copper oxide layer, (b) after contacting with a metal piece made of copper or a metal nobler than copper, or (c) after contacting with an aqueous solution of alkali borohydride.
    Type: Grant
    Filed: July 27, 1988
    Date of Patent: February 20, 1990
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Akishi Nakaso, Toshiro Okamura, Haruo Ogino, Tomoko Watanabe, Yuko Kimura