Abstract: A residual chlorine measuring apparatus includes: a detection electrode that is immersed in a sample solution, the detection electrode being made of gold or platinum; a counter electrode that is immersed in the sample solution, the counter electrode being made of silver/silver chloride; a voltage applying device that applies an applied voltage between the detection electrode and the counter electrode; an ammeter that measures an oxidation-reduction current flowing between the detection electrode and the counter electrode; and an arithmetic controller that controls the voltage applying device and acquires the oxidation-reduction current measured by the ammeter.

Abstract: A residual chlorine measuring apparatus includes: a detection electrode that is immersed in a sample solution, the detection electrode being made of gold or platinum; a counter electrode that is immersed in the sample solution, the counter electrode being made of silver/silver chloride; a voltage applying device that applies an applied voltage between the detection electrode and the counter electrode; an ammeter that measures an oxidation-reduction current flowing between the detection electrode and the counter electrode; and an arithmetic controller that controls the voltage applying device and acquires the oxidation-reduction current measured by the ammeter.

Abstract: The present invention relates to electronic components assembly for electrically connecting electronic components to each other, wherein a wiring formed on a surface of a first electronic component and a wiring formed on a surface of a second electronic component face each other, and are bonded to each other with an electric conductor interposed therebetween, so as to electrically connect the first electronic component and the second electronic component. The electric conductor is a resin composition containing solder or conductive filler.

Abstract: The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ?1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ?1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).

Abstract: A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor device 1 of which a plurality of connecting terminals are exposed, a resin film is formed on a surface of the insulating layer, a groove of a depth equal to or exceeding a thickness of the resin film is formed from a surface side of the resin film so that the groove passes in a vicinity of connecting terminals that are to be connected, and furthermore communicating holes which reach the connecting terminals to be connected from this portion that groove passes in the vicinity thereof are formed.

Abstract: A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor device 1 of which a plurality of connecting terminals are exposed, a resin film is formed on a surface of the insulating layer, a groove of a depth equal to or exceeding a thickness of the resin film is formed from a surface side of the resin film so that the groove passes in a vicinity of connecting terminals that are to be connected, and furthermore communicating holes which reach the connecting terminals to be connected from this portion that groove passes in the vicinity thereof are formed.

Abstract: The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ?1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ?1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).

Abstract: The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ?1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ?1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).

Abstract: The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ?1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ?1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).

Abstract: The present invention relates to electronic components assembly for electrically connecting electronic components to each other, wherein a wiring formed on a surface of a first electronic component and a wiring formed on a surface of a second electronic component face each other, and are bonded to each other with an electric conductor interposed therebetween, so as to electrically connect the first electronic component and the second electronic component. The electric conductor is a resin composition containing solder or conductive filler.

Abstract: A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor device 1 of which a plurality of connecting terminals are exposed, a resin film is formed on a surface of the insulating layer, a groove of a depth equal to or exceeding a thickness of the resin film is formed from a surface side of the resin film so that the groove passes in a vicinity of connecting terminals that are to be connected, and furthermore communicating holes which reach the connecting terminals to be connected from this portion that groove passes in the vicinity thereof are formed.