Patents by Inventor Yuko Koseki

Yuko Koseki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11340026
    Abstract: A heat storage sheet includes a resin matrix and a heat storage material that is dispersed in the resin matrix. The heat storage sheet has a tensile strength of 0.1 MPa or more and a tensile elongation at break of 10% or more, as measured in accordance with the method of JIS K6251.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: May 24, 2022
    Assignee: DIC Corporation
    Inventors: Kenichi Fujisaki, Yuko Koseki
  • Patent number: 10968379
    Abstract: A heat-storage composition includes a resin and a heat storage material. The composition has a viscosity of 100 to 1,000 dPa·s, as measured with a cylinder-type rotational viscometer. The composition also has a storage elastic modulus (G?) of 3 Pa or more at an angular frequency of 1 rad/s, as measured by a dynamic viscoelasticity measurement method at a temperature of 25° C. and at a strain of 0.1%.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: April 6, 2021
    Assignee: DIC Corporation
    Inventors: Yuko Koseki, Kenichi Fujisaki, Junichirou Koike, Kyouichi Toyomura
  • Patent number: 10619942
    Abstract: A heat storage molded body includes a heat storage medium dispersed in a resin matrix, wherein the resin matrix includes a resin composition containing a thermoplastic resin and a non-phthalate plasticizer, and wherein an absorbed amount of the non-phthalate plasticizer per 100 parts by mass of the heat storage medium when the non-phthalate plasticizer is mixed with the heat storage medium as measured in accordance with JIS K5101-13-1 is 150 parts by mass or less.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: April 14, 2020
    Assignee: DIC Corporation
    Inventors: Kenichi Fujisaki, Yuko Koseki
  • Patent number: 10502499
    Abstract: A heat storage molded body includes a heat storage medium dispersed in a resin matrix, wherein the resin matrix includes a resin composition containing a thermoplastic resin and a non-phthalate plasticizer, and wherein the Hansen Solubility Parameter (HSP) distance between the non-phthalate plasticizer and the heat storage medium is 6 or more.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: December 10, 2019
    Assignee: DIC Corporation
    Inventors: Kenichi Fujisaki, Yuko Koseki
  • Publication number: 20190106612
    Abstract: A heat-storage composition includes a resin and a heat storage material. The composition has a viscosity of 100 to 1,000 dPa·s, as measured with a cylinder-type rotational viscometer. The composition also has a storage elastic modulus (G?) of 3 Pa or more at an angular frequency of 1 rad/s, as measured by a dynamic viscoelasticity measurement method at a temperature of 25° C. and at a strain of 0.1%.
    Type: Application
    Filed: December 7, 2018
    Publication date: April 11, 2019
    Applicant: DIC Corporation
    Inventors: Yuko Koseki, Kenichi Fujisaki, Junichirou Koike, Kyouichi Toyomura
  • Publication number: 20190107334
    Abstract: A heat storage sheet includes a resin matrix and a heat storage material that is dispersed in the resin matrix. The heat storage sheet has a tensile strength of 0.1 MPa or more and a tensile elongation at break of 10% or more, as measured in accordance with the method of JIS K6251.
    Type: Application
    Filed: December 7, 2018
    Publication date: April 11, 2019
    Applicant: DIC Corporation
    Inventors: Kenichi Fujisaki, Yuko Koseki
  • Publication number: 20190107335
    Abstract: A heat storage laminate includes an inorganic substrate and an organic heat storage layer, wherein the inorganic substrate and the organic heat storage layer are laminated to one another. The inorganic substrate has a thickness of 8 mm or more and a mass reduction ratio of 4% by mass or more, as measured when the inorganic substrate is held at a temperature of 105° C. until a constant mass is obtained.
    Type: Application
    Filed: December 7, 2018
    Publication date: April 11, 2019
    Applicant: DIC Corporation
    Inventors: Kenichi Fujisaki, Yuko Koseki, Tomoyuki Furukawa
  • Publication number: 20180094872
    Abstract: A heat storage molded body includes a heat storage medium dispersed in a resin matrix, wherein the resin matrix includes a resin composition containing a thermoplastic resin and a non-phthalate plasticizer, and wherein the Hansen Solubility Parameter (HSP) distance between the non-phthalate plasticizer and the heat storage medium is 6 or more.
    Type: Application
    Filed: December 5, 2017
    Publication date: April 5, 2018
    Applicant: DIC Corporation
    Inventors: Kenichi Fujisaki, Yuko Koseki
  • Publication number: 20180094873
    Abstract: A heat storage molded body includes a heat storage medium dispersed in a resin matrix, wherein the resin matrix includes a resin composition containing a thermoplastic resin and a non-phthalate plasticizer, and wherein an absorbed amount of the non-phthalate plasticizer per 100 parts by mass of the heat storage medium when the non-phthalate plasticizer is mixed with the heat storage medium as measured in accordance with JIS K5101-13-1 is 150 parts by mass or less.
    Type: Application
    Filed: December 5, 2017
    Publication date: April 5, 2018
    Applicant: DIC Corporation
    Inventors: Kenichi Fujisaki, Yuko Koseki