Patents by Inventor Yuko Matsuzaki

Yuko Matsuzaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240114909
    Abstract: The present invention provides a method for controlling a soybean rust fungus having an amino acid substitution of F129L on mitochondrial cytochrome b protein, by applying a compound represented by formula (I) [wherein Q represents a group represented by the following Q1, Q2, Q3, Q4 or Q5 (in the formulae, • represents a binding site to benzene ring); X represents an oxygen atom or NH; L represents CH2, an oxygen atom or NCH3; E represents a C6-C10 aryl group, etc.; R1 represents a C1-C3 chain hydrocarbon group or a cyclopropyl group, etc.; R2 represents a C1-C3 chain hydrocarbon group or a cyclopropyl group, etc.; R3 represents a C1-C3 alkoxy group or a C1-C3 chain hydrocarbon group, etc.; and n is 0, 1, 2, or 3] or its N oxide or an agriculturally acceptable salt thereof.
    Type: Application
    Filed: November 15, 2023
    Publication date: April 11, 2024
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Yuichi MATSUZAKI, Hidekatsu TOBITA, Hiroto TAMASHIMA, Yuko SEMBA
  • Publication number: 20020109216
    Abstract: An integrated electronic device has at least two semiconductor devices built up in a multi-layer construction on a wiring substrate in which a die pad and a plurality of electrode pads are formed, the semiconductor device having a plurality of electrodes formed thereon. The semiconductor device for a first stage is disposed on the die pad. The semiconductor device for a second stage is disposed on the top of the first stage semiconductor device with having an electrically insulating resin layer in between the first and second stage semiconductor devices. The electrodes of the semiconductor devices are wire-bonded with corresponding electrode pads, and all of the build-up semiconductor devices and their wires are sealed with insulating seal resin.
    Type: Application
    Filed: December 27, 2001
    Publication date: August 15, 2002
    Inventors: Yuko Matsuzaki, Hiroyuki Fukasawa