Abstract: Provided is a curable composition in which the solubility in a solvent (in particular, water) is high and in which properties of a cured film obtained using the curable composition stored for a predetermined time are superior. The curable composition includes: a compound A represented by Formula (A) and at least one compound X selected from the group consisting of compounds represented by Formulae (X1) to (X4), in which a content of the compound X is 0.01 to 2.0 mass % with respect to a total mass of the compound A and the compound X; or a compound B represented by Formula (B) and a compound Y represented by Formula (Y), in which a content of the compound Y is 0.01 to 2.0 mass % with respect to a total mass of the compound B and the compound Y.

Abstract: Provided is a curable composition in which the solubility in a solvent (in particular, water) is high and in which properties of a cured film obtained using the curable composition stored for a predetermined time are superior. The curable composition includes: a compound A represented by Formula (A) and at least one compound X selected from the group consisting of compounds represented by Formulae (X1) to (X4), in which a content of the compound X is 0.01 to 2.0 mass % with respect to a total mass of the compound A and the compound X; or a compound B represented by Formula (B) and a compound Y represented by Formula (Y), in which a content of the compound Y is 0.01 to 2.0 mass % with respect to a total mass of the compound B and the compound Y.

Abstract: A positive photosensitive composition includes at least one compound that when exposed to actinic rays or radiation, generates any of the sulfonic acids of general formula (I) and a resin whose solubility in an alkali developer is increased by the action of an acid, wherein each of X1 and X2 independently represents a fluorine atom or a fluoroalkyl group, R1 represents a group with a polycyclic structure, provided that the polycyclic structure may have a substituent, and R2 represents a hydrogen atom, a chain alkyl group, a monocyclic alkyl group, a group with a polycyclic structure or a monocyclic aryl group, provided that each of the chain alkyl group, monocyclic alkyl group, polycyclic structure and monocyclic aryl group may have a substituent, and provided that R1 and R2 may be bonded to each other to thereby form a polycyclic structure.

Abstract: A positive photosensitive composition ensuring wide exposure latitude and reduced line edge roughness not only in normal exposure (dry exposure) but also in immersion exposure, a pattern forming method using the positive photosensitive composition, and a novel resin contained in the positive photosensitive composition are provided, which are a positive photosensitive composition comprising (A) a resin having a specific lactone structure in the side chain and being capable of increasing the solubility in an alkali developer by the action of an acid and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, a pattern forming method using the positive photosensitive composition, and a novel resin contained in the positive photosensitive composition.

Abstract: A positive photosensitive composition ensuring wide exposure latitude and reduced line edge roughness not only in normal exposure (dry exposure) but also in immersion exposure, a pattern forming method using the positive photosensitive composition, and a novel resin contained in the positive photosensitive composition are provided, which are a positive photosensitive composition comprising (A) a resin having a specific lactone structure in the side chain and being capable of increasing the solubility in an alkali developer by the action of an acid and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, a pattern forming method using the positive photosensitive composition, and a novel resin contained in the positive photosensitive composition.

Abstract: A positive photosensitive composition includes at least one compound that when exposed to actinic rays or radiation, generates any of the sulfonic acids of general formula (I) and a resin whose solubility in an alkali developer is increased by the action of an acid, wherein each of X1 and X2 independently represents a fluorine atom or a fluoroalkyl group, R1 represents a group with a polycyclic structure, provided that the polycyclic structure may have a substituent, and R2 represents a hydrogen atom, a chain alkyl group, a monocyclic alkyl group, a group with a polycyclic structure or a monocyclic aryl group, provided that each of the chain alkyl group, monocyclic alkyl group, polycyclic structure and monocyclic aryl group may have a substituent, and provided that R1 and R2 may be bonded to each other to thereby form a polycyclic structure.

Abstract: A surface treating agent for resist pattern formation comprises a compound having two or more nucleophilic functional groups in each of the molecules thereof, or its salt, and a solvent.

Abstract: A positive photosensitive composition includes (A) a resin having a repeating unit with a lactone structure of 5.0 or below an Onishi parameter and having any of repeating units of Formula (I) that when acted on by an acid, generates a carboxylic acid, and (B) a compound that when exposed to actinic rays or radiation, generates an acid, wherein each of R1, R2 and R3 independently represents a substituted or unsubstituted alkyl group or a substituted or unsubstituted cycloalkyl group, provided that R2 and R3 may be bonded with each other to thereby form a ring structure, and Ra represents a hydrogen atom, an alkyl group or a group of the formula —CH2—O—Ra2 in which Ra2 represents a hydrogen atom, an alkyl group or an acyl group, the structure of Formula (I) having a van der Waals volume of 306×10?30 m3 or less.