Abstract: A semiconductor memory device includes first, second, and third memory cells, and first, second, and third word lines that are respectively connected to gates of the first, second, and third memory cells. A control circuit executes first, second, and third read operations in response to first, second, and third command sets, respectively. The first read operation includes a first read sequence, in which the control circuit reads data by applying first to third voltages to the first word line. In the second read operation, the control circuit reads data by applying a second read voltage that is set based on a result of the first read sequence, to the second word line. In the third read operation, the control circuit reads data from the third memory cells by applying a second read voltage that is set independently of the result of the first read sequence, to the third word line.

Abstract: A semiconductor memory device includes first, second, and third memory cells, and first, second, and third word lines that are respectively connected to gates of the first, second, and third memory cells. A control circuit executes first, second, and third read operations in response to first, second, and third command sets, respectively. The first read operation includes a first read sequence, in which the control circuit reads data by applying first to third voltages to the first word line. In the second read operation, the control circuit reads data by applying a second read voltage that is set based on a result of the first read sequence, to the second word line. In the third read operation, the control circuit reads data from the third memory cells by applying a second read voltage that is set independently of the result of the first read sequence, to the third word line.

Abstract: A semiconductor memory device includes first, second, and third memory cells, and first, second, and third word lines that are respectively connected to gates of the first, second, and third memory cells. A control circuit executes first, second, and third read operations in response to first, second, and third command sets, respectively. The first read operation includes a first read sequence, in which the control circuit reads data by applying first to third voltages to the first word line. In the second read operation, the control circuit reads data by applying a second read voltage that is set based on a result of the first read sequence, to the second word line. In the third read operation, the control circuit reads data from the third memory cells by applying a second read voltage that is set independently of the result of the first read sequence, to the third word line.

Abstract: A semiconductor memory device includes memory cells, a sense amplifier unit including a first latch circuit, and a control unit configured to execute read and write operations on the memory cells. The control unit, while executing the write operation on the memory cells, responsive to a write suspend command followed by a read command, performs a data saving operation, the read operation, and a data restoring operation prior to resuming the write operation. The data saving operation includes transferring first data stored in the first latch circuit to an external device, the first data including at least a result of verify operation performed on the memory cells. The data restoring operation includes transferring the first data to the first latch circuit.

Abstract: A semiconductor memory device includes first, second, and third memory cells, and first, second, and third word lines that are respectively connected to gates of the first, second, and third memory cells. A control circuit executes first, second, and third read operations in response to first, second, and third command sets, respectively. The first read operation includes a first read sequence, in which the control circuit reads data by applying first to third voltages to the first word line. In the second read operation, the control circuit reads data by applying a second read voltage that is set based on a result of the first read sequence, to the second word line. In the third read operation, the control circuit reads data from the third memory cells by applying a second read voltage that is set independently of the result of the first read sequence, to the third word line.

Abstract: A semiconductor memory device includes memory cells, a sense amplifier unit including a first latch circuit, and a control unit configured to execute read and write operations on the memory cells. The control unit, while executing the write operation on the memory cells, responsive to a write suspend command followed by a read command, performs a data saving operation, the read operation, and a data restoring operation prior to resuming the write operation. The data saving operation includes transferring first data stored in the first latch circuit to an external device, the first data including at least a result of verify operation performed on the memory cells. The data restoring operation includes transferring the first data to the first latch circuit.

Abstract: A semiconductor memory device includes first and second memory cells, first and second word lines that are respectively connected to gates of the first and second memory cells, and a control circuit that executes first and second read operations in response to first and second command sets, respectively. The first read operation includes a first read sequence, in which the control circuit reads data by applying first to third voltages to the first word line, and a second read sequence, in which the control circuit reads data by applying a first read voltage that is set based on the result of the first read sequence, to the first word line. In the second read operation, the control circuit reads data by applying a second read voltage that is set based on the result of the first read sequence of the first read operation, to the second word line.