Abstract: A photosensitive resin composition includes an alkali-soluble resin, a quinone diazide, a surfactant, and a solvent. The solvent includes a diethylene glycol dialkyl ether that includes an alkyl group including one to five carbon atoms, an ethyl 3-ethoxy propionate, an alkyl acetate that includes an alkyl group including three to eight carbon atoms, and an alkyl lactate that includes an alkyl group including one to six carbon atoms. The composition may be used to make high-quality display panels with uniformly-coated insulating layers.

Abstract: A photosensitive resin composition includes an alkali-soluble resin, a quinone diazide, a surfactant, and a solvent. The surfactant includes an organic fluorine compound having the structure a first silicone compound having the structure a second silicone compound having the structure The resin composition may be used in display panels.

Abstract: A positive working photoresist composition is provided which comprises a resin which is converted to alkali-soluble from alkali-insoluble or alkali slightly soluble by the action of an acid; an acid generator; and a nitrogen-containing cyclic compound represented by the following formula (I): wherein X represents CH2 or C(═O), two of R1, R2, R3 and R4 represent a lower alkyl and the rest two represent hydrogen; gives a good profile with a smooth pattern side even on a substrate having a high reflection; and has a wide focus margin and a good sensitivity and resolution.

Abstract: A chemical amplifying type positive photoresist composition, excellent in various properties, and not form necking at the potion where the bottom antireflective coating and the resist film contact, which comprises (A) a resin which is converted to alkali-soluble from alkali-insoluble or alkali slightly soluble by the action of an acid, (B) an acid generator, (C) a tertiary amine compound and (D) a diphenyl sulfone compound, and a fine photoresist pattern can be formed in high precision using the photoresist composition.

Abstract: A chemical amplifying type positive photoresist composition, excellent in various properties such as film retention ratio, applicability, heat resistance, sensitivity, resolution, profile and time delay resistance, and not easily affected by environment, which comprises (A) a resin which is converted to alkali-soluble by the action of an acid, (B) an acid generator and (C) a tertiary amine compound having an ether bond; and a fine photoresist pattern can be formed in high precision using the photoresist composition.

Abstract: A positive photoresist composition having excellent various performances (e.g. resolution, resistance to time delay effect, profile), small PEB dependence as well as excellent sensitivity, film retention and coatability, which comprises a polyvinylphenol resin whose phenolic hydroxyl group is partially protected; a sulfonate of a N-hydroxyimide compound as an acid generator; an amine compound; and an electron donor having a redox potential of not more than 1.7 eV is provided.

Abstract: A positive photo resist composition of chemical amplifying type, which is excellent in various properties such as sensitivity resolution, heat resistance, film retention ratio, applicability and profile and also excellent in time delay effect resistance, and which comprises(A) a resin which is converted to alkali-soluble from alkali-insoluble or alkali-slightly soluble by the action of an acid,(B) an acid generator and(C) a tertiary amine compound having an aliphatic hydroxyl group.

Abstract: A positive photo resist composition of chemical amplifying type, which is excellent in various properties such as sensitivity, resolution, heat resistance, film retention ratio, applicability and profile and also excellent in time delay effect resistance, and which comprises(A) a resin which is converted to alkali-soluble from alkali-insoluble or alkali-slightly soluble by the action of an acid,(B) an acid generator and(C) a dipyridyl compound represented by the following formula (I): ##STR1## wherein, Z represents an organic bonding group having least one hetero atom, and R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5 and R.sup.6 each independently represent hydrogen or an alkyl group having 1 to 4 carbon atoms.

Abstract: A positive-working photoresist composition which exhibits a high sensitivity and a high resolution in addition to excellent characteristics such as heat resistance, film retention ratio, coatability and profile;which comprises an alkali-soluble resin comprising a polyvinylphenol resin which is polyvinylphenol and/or its partially hydrogenated product in which the phenolic hydroxyl groups are partially alkyletherified and partially protected;and a sulfonate of a N-hydroxyimide compound as an acid generator.