Abstract: An HVAC system is provided. Embodiments of the present disclosure generally relate to heat exchangers having tubing with a reduced diameter compared to traditional systems. In one embodiment, a ducted HVAC system comprises an outdoor heat exchanger with tubing that has an outer diameter of eight millimeters (8 mm) or less and an indoor heat exchanger with tubing that has an outer diameter of nine millimeters (9 mm) or less. Additional systems, devices, and methods are also disclosed.

Abstract: A power conversion apparatus mounted in a vehicle includes a semiconductor stack in which a plurality of semiconductor modules and a plurality of coolants including coolant passages are disposed by being alternately stacked, and a retaining unit which presses the semiconductor stack in a stacking direction to retain the semiconductor stack. The semiconductor modules and the coolants are attached to each other by a plate-shaped insulating resin adhesive member, and a roughened area on which a roughening treatment has been performed is formed in at least a part of the outer surface of the coolants to which the resin adhesive member is attached.

Abstract: A power converter (1) includes: planar semiconductor modules (10) each having a resin sealing part (16) in which a semiconductor element (11), conductive members (12, 13, and 14), and a signal terminal (15) are sealed with a resin; a cooler (20) that holds the plurality of semiconductor modules (10) in a laminated manner; and a cover (30) that covers the semiconductor modules and the cooler, wherein at least a part of the resin sealing part (16) and the cooler (20) are supported by support media (41 and 42) that extend from the cover (30) so that facing parts of the resin sealing part and the cooler with respect to the cover (30) is positioned in proximity to the cover, and the conductive members and the signal terminal protrude from the resin sealing part in a direction away from the cover.

Abstract: A power conversion apparatus mounted in a vehicle includes a semiconductor stack in which a plurality of semiconductor modules and a plurality of coolants including coolant passages are disposed by being alternately stacked, and a retaining unit which presses the semiconductor stack in a stacking direction to retain the semiconductor stack. The semiconductor modules and the coolants are attached to each other by a plate-shaped insulating resin adhesive member, and a roughened area on which a roughening treatment has been performed is formed in at least a part of the outer surface of the coolants to which the resin adhesive member is attached.

Abstract: A power converter includes: a refrigerant flow channel member in which a refrigerant cooling an electronic device flows; a flat refrigerant pipe portion stacked with a power module, provided for a refrigerant cooling the power module to flow therein, and including a contact surface portion contacting the power module to exchange heat; an inlet pipe portion that is disposed at one end of the refrigerant pipe portion and through which the refrigerant flows to the refrigerant pipe portion; an outlet pipe portion that is disposed at the other end of the refrigerant pipe portion and through which the refrigerant flows from the refrigerant pipe portion; an inlet connection portion connecting the inlet pipe portion to the refrigerant flow channel member and formed of a tubular elastic member; and an outlet connection portion connecting the outlet pipe portion to the refrigerant flow channel member and formed of a tubular elastic member.

Abstract: A power converter (1) includes: planar semiconductor modules (10) each having a resin sealing part (16) in which a semiconductor element (11), conductive members (12, 13, and 14), and a signal terminal (15) are sealed with a resin; a cooler (20) that holds the plurality of semiconductor modules (10) in a laminated manner; and a cover (30) that covers the semiconductor modules and the cooler, wherein at least a part of the resin sealing part (16) and the cooler (20) are supported by support media (41 and 42) that extend from the cover (30) so that facing parts of the resin sealing part and the cooler with respect to the cover (30) is positioned in proximity to the cover, and the conductive members and the signal terminal protrude from the resin sealing part in a direction away from the cover.

Abstract: A power converter includes: a refrigerant flow channel member in which a refrigerant cooling an electronic device flows; a flat refrigerant pipe portion stacked with a power module, provided for a refrigerant cooling the power module to flow therein, and including a contact surface portion contacting the power module to exchange heat; an inlet pipe portion that is disposed at one end of the refrigerant pipe portion and through which the refrigerant flows to the refrigerant pipe portion; an outlet pipe portion that is disposed at the other end of the refrigerant pipe portion and through which the refrigerant flows from the refrigerant pipe portion; an inlet connection portion connecting the inlet pipe portion to the refrigerant flow channel member and formed of a tubular elastic member; and an outlet connection portion connecting the outlet pipe portion to the refrigerant flow channel member and formed of a tubular elastic member.

Abstract: A gas sensor including a gas sensor element, and an inner member surrounding the gas sensor element. The gas sensor element has a detection element having therein a space to which a gas to be measured is introduced, and a heater laminated on the detection element. The detection element includes a first oxygen pumping cell for pumping oxygen into or out of the space, an oxygen concentration detection cell, a detection electrode and a reference electrode. In side faces of the detection element along a laminating direction, a region from a front end of the inner member to a part of the detection electrode along a longitudinal direction is covered with a glass coat having a glass transition point of over 700° C. Further the detection electrode is controlled at a temperature range from 600° C. or more to not more than the glass transition point of the glass coat.

Abstract: There is provided a semiconductor device including: a circuit board formed by bonding a first and a second metal plates to both surfaces of an insulating substrate respectively, at least one semiconductor element to be bonded to an external surface of the first metal plate through a first solder, and a radiating base plate to be bonded to an external surface of the second metal plate through a second solder, wherein the first and the second solders are constituted by solder materials of the same type, and a ratio of a sum of thicknesses of the first and the second metal plates to a thickness of the insulating substrate is set in a predetermined range to ensure an endurance to a temperature stress of each of the first and the second solders.

Abstract: [Objective] To provide a gas sensor having a solid electrolyte body in which an exposed portion thereof achieving a temperature lower than the temperature that burns off soot is covered with a glass coat so as to prevent deterioration in gas concentration detection performance of the gas sensor.

Abstract: There is provided a semiconductor device including: a circuit board formed by bonding a first and a second metal plates to both surfaces of an insulating substrate respectively, at least one semiconductor element to be bonded to an external surface of the first metal plate through a first solder, and a radiating base plate to be bonded to an external surface of the second metal plate through a second solder, wherein the first and the second solders are constituted by solder materials of the same type, and a ratio of a sum of thicknesses of the first and the second metal plates to a thickness of the insulating substrate is set in a predetermined range to ensure an endurance to a temperature stress of each of the first and the second solders.

Abstract: A contact comprises a contact body at least provided with an arm region extending in the right-left direction, and a tip region extending downward from the front end portion of the arm region. The tip region is provided with a pedestal portion integrally continuous to the lower edge portion on the front end side of the arm region, and a contact portion projecting downward from the lower end portion of the pedestal portion and having a tip to be brought into contact with an electrode of a device under test at the lower end. The pedestal portion includes an underside region having at least four inclined faces located around the contact portion when the tip region is seen from below, and inclined such that a portion closer to the side of the contact portion becomes lower.

Abstract: An in-vehicle hand-free apparatus that is for ensuring hand-free talk by a short-range wireless communication system in compliance with the Bluetooth includes a notification unit which notifies the status of the in-vehicle hand-free apparatus. As the in-vehicle hand-free apparatus notifies the status thereof by the notification unit, the user can easily perceive the status of the in-vehicle hand-free apparatus.

Abstract: A probe tip section of an electrical test probe has a laminated structure consisting of a first deposition portion and a second deposition portion covering the first deposition portion, and by the laminated structure, a maximum cross-sectional area portion at which the cross-sectional area of the probe tip section is increased to a base portion is provided between a tip end of the probe tip section and the base portion in the probe tip section. At the maximum cross-sectional area portion, a dimension in the X direction as seen on a flat surface perpendicular to a protruding direction of the probe tip section is increased in a one-dimensional way, and in addition, a dimension in the Y direction perpendicular to the X direction is increased from the tip end toward the base portion, as a result of which the cross-sectional area of the probe tip section can be increased in a two-dimensional way.

Abstract: A contact comprises a contact body at least provided with an arm region extending in the right-left direction, and a tip region extending downward from the front end portion of the arm region. The tip region is provided with a pedestal portion integrally continuous to the lower edge portion on the front end side of the arm region, and a contact portion projecting downward from the lower end portion of the pedestal portion and having a tip to be brought into contact with an electrode of a device under test at the lower end. The pedestal portion includes an underside region having at least four inclined faces located around the contact portion when the tip region is seen from below, and inclined such that a portion closer to the side of the contact portion becomes lower.

Abstract: The present invention provides a probe in which electrical short-circuit between the probes adjacent to each other is reliably prevented and that is manufactured relatively easily. The present invention provides a probe comprising a probe main body made of a plate-shaped member having an attachment region having an attachment end portion and extending in a direction distanced from the attachment end portion, an arm region continuing into the attachment region and extending in a direction intersecting with the extending direction of the attachment region, and a probe tip region intersecting with the longitudinal direction of the arm region, extending from the arm region to the opposite side of a side where the attachment end portion of the attachment region is located, seen from the arm portion, and having a probe tip at its extending end portion.

Abstract: A probe tip section of an electrical test probe has a laminated structure consisting of a first deposition portion and a second deposition portion covering the first deposition portion, and by the laminated structure, a maximum cross-sectional area portion at which the cross-sectional area of the probe tip section is increased to a base portion is provided between a tip end of the probe tip section and the base portion in the probe tip section. At the maximum cross-sectional area portion, a dimension in the X direction as seen on a flat surface perpendicular to a protruding direction of the probe tip section is increased in a one-dimensional way, and in addition, a dimension in the Y direction perpendicular to the X direction is increased from the tip end toward the base portion, as a result of which the cross-sectional area of the probe tip section can be increased in a two-dimensional way.

Abstract: An in-vehicle hand-free apparatus that is for ensuring hand-free talk by a short-range wireless communication system in compliance with the Bluetooth includes a notification unit which notifies the status of the in-vehicle hand-free apparatus. As the in-vehicle hand-free apparatus notifies the status thereof by the notification unit, the user can easily perceive the status of the in-vehicle hand-free apparatus.

Abstract: In construction of a musical recorder, a sound collector such as a microphone is attached to the body of the recorder at the position of the constant belly of the basic vibration of resonant air columns formed in the bore of the recorder at musical tone generation in order to obtain constant sound collecting level with large howling margin at musical tone regeneration without any influence of the wall configuration of the bore.