Abstract: A pulse-generating apparatus, comprising a pulse source, an output terminal to which pulses from the pulse source are supplied, and a measuring device for measuring the level of a pulse that will be output from the output terminal at a pre-determined time position; a pulse-generating apparatus, further comprising a device for adjusting the level of the pulse that will be output at the pre-determined time position, based on at least the measured pulse level and the reference pulse level at the pre-determined time position; and a pulse-generating apparatus, wherein the pulse source generates pulses based on at least one parameter, and the adjusting device adjusts the level of the pulse that will be output by updating the parameter, changing the amount of amplification of the amplifier of the pulse source, or changing the amount of attenuation of the attenuator of the pulse source. The parameter may include at least one of the load impedance and the pulse level.

Abstract: A connection apparatus includes a switch; a control signal connector that transmits a switching signal, sent from a controller, to the switching means; a first plurality of connectors that are connected to the switch and that are to be connected to a plurality of measurement connectors included in first measuring apparatus for measuring a first electrical characteristic of the device under test; and a second plurality of connectors that are connected to the switch and that are to be connected to a plurality of measurement connectors included in second measuring apparatus for measuring a second electrical characteristic of the device under test. In accordance with the switching signal sent from the controller via the control-signal connector, the switch performs switching so that either the first plurality of connectors or the second plurality of connectors are electrically connected to the device under test.

Abstract: The heat-induced current that flows from the bushing on the outside into the electrostatic shield tube is recirculated to the conductive bushing by dividing the bushings into inside and outside insulating bushings in a concentric circle and a conductive bushing sandwiched by these insulating bushings with respect to the heat-induced current that flows as a result of the heat that has been transmitted from the coil bobbin to the electrostatic shield tube, and connecting the electrostatic shield tube and conductive bushing with a separate conductive member.

Abstract: A connection apparatus includes a switch; a control signal connector that transmits a switching signal, sent from a controller, to the swtiching means; a first plurality of connectors that are connected to the switch and that are to be connected to a plurality of measurement connectors included in first measuring apparatus for measuring a first electrical characteristic of the device under test; and a second plurality of connectors that are connected to the switch and that are to be connected to a plurality of measurement connectors included in second measuring apparatus for measuring a second electrical characteristic of the device under test. In accordance with the switching signal sent from the controller via the control-signal connector, the switch performs switching so that either the first plurality of connectors or the second plurality of connectors are electrically connected to the device under test.

Abstract: A connection apparatus includes a switch; a control signal connector that transmits a switching signal, sent from a controller, to the switching means; a first plurality of connectors that are connected to the switch and that are to be connected to a plurality of measurement connectors included in first measuring apparatus for measuring a first electrical characteristic of the device under test; and a second plurality of connectors that are connected to the switch and that are to be connected to a plurality of measurement connectors included in second measuring apparatus for measuring a second electrical characteristic of the device under test. In accordance with the switching signal sent from the controller via the control-signal connector, the switch performs switching so that either the first plurality of connectors or the second plurality of connectors are electrically connected to the device under test.

Abstract: A current-to-voltage converting apparatus connected to an element or a circuit having a first terminal connected to a signal source and comprising a feedback amplifier, which is connected to a second terminal of the element or the circuit and keeps the second terminal at virtual ground, and which converts the current signals that flow to the element or the circuit to voltage signals and outputs these signals; a device for opening the feedback loop of the feedback amplifier and measuring the open-loop loss of the feedback loop; and a compensating amplifier, which compensates for the open-loop loss. It further comprises a device for measuring the open-loop phase shift of the feedback loop when the feedback loop is open and a control unit for keeping the open-loop phase shift at a pre-determined value.

Abstract: A connection apparatus includes a switch; a control signal connector that transmits a switching signal, sent from a controller, to the swtiching means; a first plurality of connectors that are connected to the switch and that are to be connected to a plurality of measurement connectors included in first measuring apparatus for measuring a first electrical characteristic of the device under test; and a second plurality of connectors that are connected to the switch and that are to be connected to a plurality of measurement connectors included in second measuring apparatus for measuring a second electrical characteristic of the device under test. In accordance with the switching signal sent from the controller via the control-signal connector, the switch performs switching so that either the first plurality of connectors or the second plurality of connectors are electrically connected to the device under test.

Abstract: A current-to-voltage converting apparatus connected to an element or a circuit having a first terminal connected to a signal source and comprising a feedback amplifier, which is connected to a second terminal of the element or the circuit and keeps the second terminal at virtual ground, and which converts the current signals that flow to the element or the circuit to voltage signals and outputs these signals; a device for opening the feedback loop of the feedback amplifier and measuring the open-loop loss of the feedback loop; and a compensating amplifier, which compensates for the open-loop loss. It further comprises a device for measuring the open-loop phase shift of the feedback loop when the feedback loop is open and a control unit for keeping the open-loop phase shift at a pre-determined value.

Abstract: The heat-induced current that flows from the bushing on the outside into the electrostatic shield tube is recirculated to the conductive bushing by dividing the bushings into inside and outside insulating bushings in a concentric circle and a conductive bushing sandwiched by these insulating bushings with respect to the heat-induced current that flows as a result of the heat that has been transmitted from the coil bobbin to the electrostatic shield tube, and connecting the electrostatic shield tube and conductive bushing with a separate conductive member.

Abstract: The present invention provides a probe card comprising a substrate and an external connection terminal located on substrate, wherein external connection terminal 1 is separated from a body of substrate by conductors attached to the substrate, whereby the waiting time due to dielectric absorption can be constantly shortened, and the steady-state leakage current can be stably reduced, thereby enhancing the accuracy of measuring microcurrents and determining microcurrent fluctuations for semiconductor wafer testing devices.

Abstract: A current-to-voltage converting apparatus connected to an element or a circuit having a first terminal connected to a signal source and comprising a feedback amplifier, which is connected to a second terminal of the element or the circuit and keeps the second terminal at virtual ground, and which converts the current signals that flow to the element or the circuit to voltage signals and outputs these signals; a device for opening the feedback loop of the feedback amplifier and measuring the open-loop loss of the feedback loop; and a compensating amplifier, which compensates for the open-loop loss. It further comprises a device for measuring the open-loop phase shift of the feedback loop when the feedback loop is open and a control unit for keeping the open-loop phase shift at a pre-determined value.

Abstract: To provide a capacitance measurement system with which capacitance is measured at a high speed using a semiconductor parametric test system. The capacitance measurement system has test head 104 comprising multiple input/output terminals 152 and 154 that connect the element under test 114, source and measure unit 110 that supplies voltage or current, capacitance measurement unit 108 with an impedance measurement function, and switching matrix 112 that connects the multiple input/output terminals, the source and measure unit, and the capacitance measurement unit.

Abstract: A blade-like connecting needle for measuring a semiconductor wafer has an increased capability for measuring a small current and also has stable characteristics. The blade-like connecting needle includes a blade signal line for transmitting signal from the semiconductor wafer, a support insulator covering at least a portion of the blade signal line, a plurality of blade guard patterns disposed in or on the support insulator for electromagnetically shielding the blade signal line, and a probe supported on the support insulator and connected to the blade signal line. There are also disclosed processes of producing the blade-like connecting needle. A method for manufacturing a coaxial or hollow blade-like connecting needle is also provided.

Abstract: The present invention provides a probe card comprising a substrate and an external connection terminal located on substrate, wherein external connection terminal 1 is separated from a body of substrate by conductors attached to the substrate, whereby the waiting time due to dielectric absorption can be constantly shortened, and the steady-state leakage current can be stably reduced, thereby enhancing the accuracy of measuring microcurrents and determining microcurrent fluctuations for semiconductor wafer testing devices.

Abstract: The present invention provides a probe card comprising a substrate and an external connection terminal located on substrate, wherein external connection terminal 1 is separated from a body of substrate by conductors attached to the substrate, whereby the waiting time due to dielectric absorption can be constantly shortened, and the steady-state leakage current can be stably reduced, thereby enhancing the accuracy of measuring microcurrents and determining microcurrent fluctuations for semiconductor wafer testing devices.

Abstract: A blade-like connecting needle for measuring a semiconductor wafer has an increased capability for measuring a small current and also has stable characteristics. The blade-like connecting needle 1 includes a blade signal 10 line for transmitting signal from the semiconductor wafer, a support insulator 8 covering at least a portion of the blade signal line 10, a plurality of blade guard patterns 12a, 12b, 12c, 12d disposed in or on the support insulator 8 for electromagnetically shielding the blade signal line 10, and a probe 2 supported on the support insulator 8 and connected to the blade signal line 10. There are also disclosed processes of producing the blade-like connecting needle 1. A method for manufacturing a coaxial or hollow blade-like connecting needle is also provided.

Abstract: The present invention provides a probe card comprising a substrate and an external connection terminal located on substrate, wherein external connection terminal 1 is separated from a body of substrate by conductors attached to the substrate, whereby the waiting time due to dielectric absorption can be constantly shortened, and the steady-state leakage current can be stably reduced, thereby enhancing the accuracy of measuring microcurrents and determining microcurrent fluctuations for semiconductor wafer testing devices.