Abstract: The present invention relates to a method for producing recombinant human prethrombin-2 protein and having human ?-thrombin activity by the plant-based expression systems.

Abstract: An electronic device package includes a molded case, a plurality of leads and a case lid. The molded case includes integrally formed side walls, end walls, and a bottom wall, which together define an interior for components. Each side wall includes top and bottom portions. The top portion includes first and second surfaces extending downward from a top edge of the side wall. The bottom portion has a top surface that extends away from the interior, a third surface extending downward from the top surface to a bottom edge, and a fourth surface extending downward from the second surface to the bottom wall. The leads are molded in the side wall from the bottom edge to the top edge. Each lead has an end extending above the top edge, and another end extending along the bottom edge of the side wall. The case lid is engaged with the molded case.

Abstract: An electronic device includes a molded frame, a core, a coil and a plurality of leads. The molded frame includes central winding bobbin and first and second lateral supports extending laterally outward therefrom. Each of the first and second lateral supports includes a top surface and first and second lower surfaces. The core is disposed about the coil and is supported on the top surfaces of the first and second lateral supports. The leads are formed of conductive material and are molded in the first and second lateral supports. Each of the leads includes a first end portion extending downward from the first lower surface a lateral support, and a second end portion extending along a second lower surface the lateral support. The second lower surface is lower than the first lower surface. The coil is wound about the central winding bobbin. A first end of the coil is affixed to the first end portion of a lead, and a second end of the coil is affixed to the first end portion of another lead.

Abstract: An electronic device package includes a molded case and a plurality of leads. The molded case includes integrally formed side walls, end walls, and a top wall, the side walls, end walls and top wall defining an interior for receiving one or more electronic components. Each side wall includes a top portion, an intermediate portion, and a bottom portion. The top portion includes plate-like structure having first and second surfaces extending downward from the top wall. The intermediate portion includes a shelf structure having a shelf surface that extends from the first surface in a direction away from the interior, and a third surface extending downward from the shelf surface. The bottom portion extends downward from the intermediate portion. The leads are molded at least in part of the intermediate portion. Each lead has a first end portion exposed in the interior, and a second end portion extending along a bottom edge of the bottom portion.

Abstract: An electronic device package includes a molded case, a plurality of leads and a case lid. The molded case includes integrally formed side walls, end walls, and a bottom wall, which together define an interior for components. Each side wall includes top and bottom portions. The top portion includes first and second surfaces extending downward from a top edge of the side wall. The bottom portion has a top surface that extends away from the interior, a third surface extending downward from the top surface to a bottom edge, and a fourth surface extending downward from the second surface to the bottom wall. The leads are molded in the side wall from the bottom edge to the top edge. Each lead has an end extending above the top edge, and another end extending along the bottom edge of the side wall. The case lid is engaged with the molded case.

Abstract: An electronic device includes a molded frame, a core, a coil and a plurality of leads. The molded frame includes central winding bobbin and first and second lateral supports extending laterally outward therefrom. Each of the first and second lateral supports includes a top surface and first and second lower surfaces. The core is disposed about the coil and is supported on the top surfaces of the first and second lateral supports. The leads are formed of conductive material and are molded in the first and second lateral supports. Each of the leads includes a first end portion extending downward from the first lower surface a lateral support, and a second end portion extending along a second lower surface the lateral support. The second lower surface is lower than the first lower surface. The coil is wound about the central winding bobbin. A first end of the coil is affixed to the first end portion of a lead, and a second end of the coil is affixed to the first end portion of another lead.

Abstract: An electronic device package includes a molded case and a plurality of leads. The molded case includes integrally formed side walls, end walls, and a top wall, the side walls, end walls and top wall defining an interior for receiving one or more electronic components. Each side wall includes a top portion, an intermediate portion, and a bottom portion. The top portion includes plate-like structure having first and second surfaces extending downward from the top wall. The intermediate portion includes a shelf structure having a shelf surface that extends from the first surface in a direction away from the interior, and a third surface extending downward from the shelf surface. The bottom portion extends downward from the intermediate portion. The leads are molded at least in part of the intermediate portion. Each lead has a first end portion exposed in the interior, and a second end portion extending along a bottom edge of the bottom portion.