Abstract: The present invention relates to an multi-effect solar distiller with multiple heat sources. More particularly, the present invention relates to an multi-effect solar distiller with multiple heat sources capable of evaporating and distilling sea water using the solar thermal energy, evaporating the sea water using waste heat generated from a power generation facility in addition to the solar thermal energy, evaporating and distilling the sea water even by condensation heat generated at the time of condensing steam, and using a plurality of absorption reflectors to allow non-used sunlight to maximally evaporate the sea water by being reflected from the sea water surface.

Abstract: The present invention relates to an multi-effect solar distiller with multiple heat sources. More particularly, the present invention relates to an multi-effect solar distiller with multiple heat sources capable of evaporating and distilling sea water using the solar thermal energy, evaporating the sea water using waste heat generated from a power generation facility in addition to the solar thermal energy, evaporating and distilling the sea water even by condensation heat generated at the time of condensing steam, and using a plurality of absorption reflectors to allow non-used sunlight to maximally evaporate the sea water by being reflected from the sea water surface.

Abstract: A method for manufacturing a printed circuit board with a capacitor embedded therein which has a dielectric film using laser lift off, and a capacitor manufactured thereby. In the method, a dielectric film is formed on a transparent substrate and heat-treated. A first conductive layer is formed on the heat-treated dielectric film. A laser beam is irradiated onto a stack formed, from below the transparent substrate, to separate the transparent substrate from the stack. After the transparent substrate is separated from the stack, a second conductive layer is formed with a predetermined pattern on the dielectric film. Also, an insulating layer and a third conductive layer are formed on the first and second conductive layers to alternate with each other in a predetermined number.

Abstract: Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same. Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; and a method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.

Abstract: The invention provides a method for manufacturing a printed circuit board with a film capacitor embedded therein and a printed circuit board obtained thereby. In the method, a lower electrode is formed on an insulating substrate. An amorphous dielectric film is formed on the lower electrode by low temperature film formation. Also, a metal seed layer is formed on the dielectric film by electroless plating. An upper electrode is formed on the metal seed layer by electrolytic plating.

Abstract: The invention provides a PCB with a thin film capacitor embedded therein and a method for manufacturing the same. The PCB includes a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode via low temperature film formation; a buffer layer formed on the amorphous paraelectric film; a metal seed layer formed on the buffer layer; and an upper electrode formed on the metal seed layer.

Abstract: Disclosed herein is a composite dielectric composition having a small variation of capacitance with temperature, comprising a combination of a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a negative or positive variation of capacitance with temperature which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor prepared by using the same composition. Particularly, the present invention provides a composite dielectric composition comprising a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a variation of capacitance which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor formed of the same composition and having a variation of capacitance with temperature, ? C/C×100(%), of not more than 5%.

Abstract: A method of manufacturing a thin film capacitor includes steps of: performing recrystallization heat treatment on a metal foil; forming a dielectric layer on a top surface of the recrystallized metal foil; heat treating the metal foil and the dielectric layer; and forming an upper electrode on a top surface of the heat-treated dielectric layer. The recrystallization heat treatment prevents the oxidation of a metal foil, by which a dielectric layer can be heat treated at a high temperature, thereby improving electric properties of a thin film capacitor and the reliability of a product.

Abstract: Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a ?-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.

Abstract: The invention relates to a fabrication method of a composite metal oxide dielectric film containing at least two metallic elements on a substrate, and a composite metal oxide dielectric film fabricated thereby. The method includes: forming an amorphous film containing at least one of the metallic elements; preparing a hydrothermal solution where a precursor of the remaining element of the metallic elements is mixed; immersing the amorphous film into the hydrothermal solution; and hydrothermally treating the amorphous film so that the remaining one of the metallic elements is synthesized to the amorphous film, thereby forming a crystallized composite metal oxide film.

Abstract: The invention provides a method for manufacturing a crystalline dielectric film by which the crystalline dielectric film can be formed at a low temperature of 300° C. or less. In the manufacturing method of the invention, first, an amorphous dielectric film is formed on a substrate. Then, the amorphous dielectric film is immersed into water to be hydrothermally treated.

Abstract: The invention relates to a high-dielectric constant metal/ceramic/polymer composite material and a method for producing an embedded capacitor. As ceramic particles having a relatively small size are bound to the surface of metal particles having a relatively large size by mixing, the occurrence of percolation can be prevented without coating the metal particles, and at the same time, the capacitance of an embedded capacitor can be increased. In addition, a process for coating the surface of the metal particles can be omitted, thus contributing to the simplification of the overall preparation procedure.

Abstract: The present invention relates to a method of fabricating a printed circuit board having embedded multi-layer passive devices, and particularly, to a method of fabricating a printed circuit board having an embedded multi-layer capacitor, in which a capacitor is formed to have multiple layers in the PCB to increase capacitance.

Abstract: Disclosed herein is a resin composition for embedded capacitors having excellent adhesive strength, heat resistance and flame retardancy, a ceramic/polymer composite for embedded capacitors including the resin composition, a dielectric layer of a capacitor manufactured therefrom, and a printed circuit board. The resin composition for dielectric layers of embedded capacitors includes a resin selected from the group consisting of bisphenol-A epoxy resins, bisphenol-F epoxy resins and combinations thereof, a brominated epoxy resin containing 40 wt % or more bromine, and a resin selected from the group consisting of bisphenol-A novolac epoxy resins, multi-functional epoxy resins, polyimides, cyanate esters and combinations thereof, and exhibits excellent peel strength, Tg and/or flame retardancy. Further, a ceramic/polymer composite formed by adding a ceramic filler to the resin composition is provided.

Abstract: Disclosed herein is a resin composition and ceramic/polymer composite for dielectric layers of embedded capacitors having a high dielectric constant, a dielectric layer of a capacitor manufactured therefrom, and a printed circuit board including the dielectric layer. In addition, a method of increasing temperature stability and a dielectric constant of the ceramic/polymer composite for dielectric layers of embedded capacitors is also provided. The resin composition for embedded capacitors includes 5-30 wt % of at least one resin selected from the group consisting of bisphenol-A epoxy resins, bisphenol-F epoxy resins and combinations thereof, 60-85 wt % of at least one resin selected from the group consisting of novolac-type epoxy resins, polyimides, cyanate esters and combinations thereof, and 10-30 wt % of a multi-functional epoxy resin, and the ceramic/polymer composite includes such a resin composition.