Abstract: A semiconductor transistor comprising: a drain region; a plurality of source regions; and a plurality of gate regions interleaved with the source regions.

Abstract: An electrical power switch, the power switch comprising: an array of rows and columns of lateral field effect (LFET) transistors, each transistor having a source, drain, and gate; a plurality of internal interconnect layers comprising metallizations configured to connect the transistors to operate in parallel; a source electrode and a drain electrode for respectively connecting the sources and drains of the transistors to an external circuit; and a bridging interconnect layer comprising: a plurality of undulating source bridging conductors that provide electrical connections for the sources of the transistors to the source electrode; and a plurality of undulating drain bridging conductors that provide electrical connections for the drains of the transistors to the drain electrode.

Abstract: A GaN field effect transistor (FET) including a plurality of transistor cells. A gate metal layer of a transistor cell includes a gate-drain overhang (width 0.2 um to 2.5 um) and a gate-source overhang (width 0.3 um to 1 um), and a widening at each narrow edge of the transistor cell, wherein the width of the widening of gate metal layer (150) is of 2-5 um. A metal (1) layer of the transistor sell extends beyond metal (0) layer. A last metal layer includes a drain plate and a source plate, each having a trapezoid form. More than two vias are located at a widening for connecting the gate metal layer to the gate bus. More than six vias distributed along the longitudinal dimension of the transistor cell connect metal (1) layer to metal (0) layer. A plurality of type 2 vias connect metal (1) layer to the last metal layer.

Abstract: A GaN field effect transistor (FET) including a plurality of transistor cells. A gate metal layer of a transistor cell includes a gate-drain overhang (width 0.2 um to 2.5 um) and a gate-source overhang (width 0.3 um to 1 um), and a widening at each narrow edge of the transistor cell, wherein the width of the widening of gate metal layer (150) is of 2-5 um. A metal (1) layer of the transistor sell extends beyond metal (0) layer. A last metal layer includes a drain plate and a source plate, each having a trapezoid form. More than two vias are located at a widening for connecting the gate metal layer to the gate bus. More than six vias distributed along the longitudinal dimension of the transistor cell connect metal (1) layer to metal (0) layer. A plurality of type 2 vias connect metal (1) layer to the last metal layer.