Patents by Inventor Yulia Yu

Yulia Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF CLEAVING SUBSTRATE AND METHOD OF MANUFACTURING BONDED SUBSTRATE USING THE SAME
    Publication number: 20130029473
    Abstract: A method of cleaving a substrate and a method of manufacturing a bonded substrate using the same, in which warping in a cleaved substrate is reduced. The method includes the following steps of: forming an ion implantation layer by implanting ions into a substrate; annealing the substrate in which the ion implantation layer is formed; implanting ions again into the ion implantation layer of the substrate; and cleaving the substrate along the ion implantation layer by heating the substrate into which ions are implanted.
    Type: Application
    Filed: July 26, 2012
    Publication date: January 31, 2013
    Inventors: Dong-Woon KIM, Donghyun Kim, Mikyoung Kim, MINJU KIM, SEUNG YONG PARK, Seulgi Bae, JOONG WON SHUR, Yulia Yu, Bohyun Lee, BONGHEE JANG