Abstract: A flow guiding device in an immersion-cooled chassis of a server comprises at least one deflector located above a chip on a mainboard in the chassis, each deflector comprises a first end for mounting to the mainboard above the chip and a second end inclined away from the mainboard. The first end is immersed in coolant, the second end is higher than the first end; the deflector further comprises a hollow part including multiple through holes for interrupting upward movement vapor bubbles generated by the hot chip, which reduces probability of the vapor bubbles escaping from the coolant liquid and the chassis. A liquid-cooled chassis having the flow guiding device is also disclosed.

Abstract: A manifold for cooling server includes an inlet pipe, an outlet pipe, a plurality of first hole groups, and a plurality of second hole groups. The distance between every two adjacent first hole groups is first distance, the distance between every two adjacent second hole groups is second distance, and the first distance is not equal to the second distance. The first distance is designed for one size of server, and the second distance is designed for another size of server. When changing the size of all servers in the rack, turning manifold 100 to 180 degrees to change the first hole groups 30 to the second hole groups 40 for adapting the severs, which makes the manifold 100 adapt two different sizes of server. A rack and a data center cooling system using the manifold are also disclosed.

Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.

Abstract: An optical sensing device is disclosed. The optical sensing device includes a sensing pixel, a driving circuit and a first light shielding layer. The sensing pixel includes a sensing circuit and a sensing element electrically connected to the sensing circuit. The driving circuit is electrically connected to the sensing circuit. The first light shielding layer includes at least one first opening corresponding to the sensing element, and the first light shielding layer is overlapped with the driving circuit in a top-view direction of the optical sensing device.

Abstract: A method of manufacturing a semiconductor device includes the following steps. A photoresist layer is formed over a material layer on a substrate. The photoresist layer has a composition including a solvent and a first photo-active compound dissolved in the solvent. The first photo-active compound is represented by the following formula (A1) or formula (A2): Zr12O8(OH)14(RCO2)18 ??Formula (A1); or Hf6O4(OH)6(RCO2)10 ??Formula (A2). R in the formula (A1) and R in the formula (A2) each include one of the following formulae (1) to (6): The photoresist layer is patterned. The material layer is etched using the photoresist layer as an etch mask.

Abstract: System and method to use position information about a power supply unit (PSU) within a system for status reporting or control. The system may have multiple slots into which the PSU may be installed, and each of multiple PSUs installed may sense position information, such as an indication of the slot into which it is installed. A controller may receive the position information in connection with status information such that faults or other events associated with a PSU may be reported to a system operator in connection with a position of the affected PSU. The controller may determine adjustments to operating parameters of the PSUs that are impacted by position and may direct commends to the appropriate PSU based on the position information.

Abstract: A multifunction connector is provided. A housing of the connector has a base portion, a pair of walls extending from the base portion in a longitudinal direction and separated by a gap, and a pair of wings extending from the base portion on opposite sides of the pair of walls and in a transverse direction. A pair of power conductors each is held by one of the walls and has contact portions curving into the gap. A pair of sense conductors each is held by one of the walls and has a contact portion curving into the gap and being offset from the contact portions of a respective power conductor along the longitudinal direction. A position identification subassembly is held by a first wall of the pair and separate from the gap by the first wall. A ground conductor is held by a second wall of the pair and separate from the gap by the second wall. Such a configuration enables the connector to carry high current, identify insertion position on a busbar, sense the degree of insertion, and/or provide grounding.

Abstract: A method of measuring chromaticity of a target object is implemented using a computer device that stores a plurality of light source spectrum datasets each associated with a specific object. The method includes: obtaining a captured color image of the target object; generating a spectral image based on the captured color image using a spectral transformation matrix; obtaining one of the plurality of light source spectrum datasets that is associated with the target object; and calculating a chromaticity dataset of the target object based on the spectral image and the one of the plurality of light source spectrum datasets.

Abstract: An electronic device includes a chassis casing, a device casing, a latch assembly, a bracket, and a rotating shaft assembly. The chassis casing includes a bottom plate. The device casing is detachably disposed in the chassis casing, and the device casing is provided with a stopper. The latch assembly is disposed at the chassis casing, and the latch assembly includes a sliding member. The bracket is disposed in the chassis casing and at an end of the device casing opposite to the latch assembly. The rotating shaft assembly is respectively connected to the device casing and the bracket. The device casing is adjustable between an installation position and an lifting position via the rotating shaft assembly. The sliding member of the latch assembly is used to fix the stopper, so that the device casing is located at the installation position.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: A method for measuring a thickness of a thin film layer disposed on a piece of glass is implemented using a computer device that stores a thin film image of the thin film layer, a surface dataset associated with a surface of the thin film layer, and a plurality of reference parameter sets each being associated with a specific thickness of the thin film layer, the method including: generating a spectral image dataset that includes spectral data associated with different pixels of the thin film image using a spectral transformation matrix; performing regression analysis on the surface dataset and the spectral image dataset, so as to obtain a thickness parameter set including a plurality of thickness parameters; and determining a thickness of the thin film layer using the thickness parameter set and the plurality of reference parameter sets.

Abstract: A method for detecting objects in hyperspectral imaging is revealed. First obtaining a hyperspectral imaging information by a reference image. Then converting an input image according to the hyperspectral imaging information to get a hyperspectral image. A plurality of hyperspectral eigenvalues is obtained after image analysis of the hyperspectral image. Next getting a plurality of dimensionality reduction eigenvalues by a principal component analysis (PCA). Then performing convolution operation on the dimensionality reduction eigenvalues to get a value of a convolution matrix for extracting a feature image from an image of an object to be detected in the input image. Generating an anchor box and a prediction box in the feature image to get a bounded image. Lastly matching and comparing the bounded image with a sample image to determine whether the input image is a target object image. Thereby the method provides assistance for physicians in gastrointestinal image diagnosis.

Abstract: A method of measuring chromaticity of a target object is implemented using a computer device that stores a plurality of light source spectrum datasets each associated with a specific object. The method includes: obtaining a captured color image of the target object; generating a spectral image based on the captured color image using a spectral transformation matrix; obtaining one of the plurality of light source spectrum datasets that is associated with the target object; and calculating a chromaticity dataset of the target object based on the spectral image and the one of the plurality of light source spectrum datasets.

Abstract: The present disclosure relates to a media broadcasting system, including a first broadcasting device, a second broadcasting device and a processing device. The first broadcasting device and the second broadcasting device are respectively arranged at a first side and a second side of the media broadcasting system. The processing device is electrically coupled to the first broadcasting device and the second broadcasting device, and is configured to receive a media. The processing device is configured to obtain a first channel audio signal and a second channel audio signal from the media according to a first position parameter corresponding to the first broadcasting device and a second position parameter corresponding to the second broadcasting device. The processing device is further configured to transmit the first channel audio signal to the first broadcasting device and the second channel audio signal to the second broadcasting device.

Abstract: The present disclosure relates to a media broadcasting system, including a first broadcasting device, a second broadcasting device and a processing device. The first broadcasting device and the second broadcasting device are respectively arranged at a first side and a second side of the media broadcasting system. The processing device is electrically coupled to the first broadcasting device and the second broadcasting device, and is configured to receive a media. The processing device is configured to obtain a first channel audio signal and a second channel audio signal from the media according to a first position parameter corresponding to the first broadcasting device and a second position parameter corresponding to the second broadcasting device. The processing device is further configured to transmit the first channel audio signal to the first broadcasting device and the second channel audio signal to the second broadcasting device.

Abstract: Interconnect structures and corresponding techniques for forming the interconnect structures are disclosed herein. An exemplary method includes forming a contact opening in a dielectric layer. The contact opening has sidewalls defined by the dielectric layer and a bottom defined by a conductive feature. An ALD-like nitrogen-containing plasma pre-treatment process is performed on the sidewalls (and, in some implementations, the bottom) of the contact opening. An ALD process is performed to form a titanium-and-nitrogen containing barrier layer over the sidewalls and the bottom of the contact opening. A cobalt-containing bulk layer is then formed over the titanium-and-nitrogen-containing barrier layer. A cycle of the ALD-like nitrogen-containing plasma pre-treatment process can include a nitrogen-containing plasma pulse phase and a purge phase. A cycle of the ALD process can include a titanium-containing pulse phase, a first purge phase, a nitrogen-containing plasma pulse phase, and a second purge phase.

Abstract: Interconnect structures and corresponding techniques for forming the interconnect structures are disclosed herein. An exemplary method includes forming a contact opening in a dielectric layer. The contact opening has sidewalls defined by the dielectric layer and a bottom defined by a conductive feature. An ALD-like nitrogen-containing plasma pre-treatment process is performed on the sidewalls (and, in some implementations, the bottom) of the contact opening. An ALD process is performed to form a titanium-and-nitrogen containing barrier layer over the sidewalls and the bottom of the contact opening. A cobalt-containing bulk layer is then formed over the titanium-and-nitrogen-containing barrier layer. A cycle of the ALD-like nitrogen-containing plasma pre-treatment process can include a nitrogen-containing plasma pulse phase and a purge phase. A cycle of the ALD process can include a titanium-containing pulse phase, a first purge phase, a nitrogen-containing plasma pulse phase, and a second purge phase.