Abstract: To provide a cutting insert such that a tool body can sufficiently hold the cutting insert even if one of cutting parts is broken. The cutting insert includes two side surfaces opposed to each other, a fixing hole passing through the centers of the two side surfaces, and an outer circumferential surface that is disposed between the outer circumferential edges of the two side surfaces and are connected to the outer circumferential edges of the two side surfaces. The outer circumferential surface includes four cutting parts, a first outer circumferential surface part that is disposed between the first cutting part and the second cutting part, and a second outer circumferential surface part that is opposed to the first outer circumferential surface part and is disposed between the third cutting part and the fourth cutting part.

Abstract: A ceramic substrate is provided that includes a ceramic substrate main body including a principal surface, a connecting terminal portion disposed on the principal surface of the ceramic substrate main body that is capable of being connected to another component via solder, the connecting terminal portion including a copper layer and a coating metal layer covering a surface of the copper layer; a contact layer of titanium or chromium disposed between the ceramic substrate main body and the connecting terminal portion; and an intermediate layer disposed between the copper layer of the connecting terminal portion and the contact layer, the intermediate layer including one of a titanium-tungsten alloy, a nickel-chromium alloy, tungsten, palladium, and molybdenum. The contact layer and the intermediate layer are set back from a side surface of the copper layer in a substrate plane direction.

Abstract: A ceramic substrate is provided that includes a ceramic substrate main body having a principal surface, and a connecting terminal portion disposed on the principal surface of the ceramic substrate main body that is capable of being connected to another component via solder. The connecting terminal portion includes a copper layer and a coating metal layer covering a surface of the copper layer. The ceramic substrate includes a contact layer disposed between the ceramic substrate main body and the copper layer. The contact layer includes one of a nickel-chromium alloy, chromium, molybdenum, and palladium, and is set back from a side surface of the copper layer in a substrate plane direction.

Abstract: A ceramic substrate includes: a substrate body formed by laminating a plurality of ceramic layers and including a first and second opposing principal surfaces and a peripheral portion having a positioning portion; a first conductor pad formed on the first principal surface; a second conductor pad formed on the second principal surface and having a diameter smaller than that of the first conductor pad. The positioning portion includes first and second through holes that individually pass through respective ceramic layers and are connected to each other in an axial direction. The first through hole passes through the first principal surface. The second through hole passes through the second principal surface and has a cross-sectional area that is smaller than that of the first through hole. At least apart of a peripheral edge of a ceramic layer defining the second through hole is visible through the first through hole.

Abstract: A wiring substrate includes a substrate main body having a first main face and a second main face opposite the first main face; a resistor formed on the first main face; a plurality of first-main-face-side wiring layers which are each formed on the resistor and which each include a grounding metal layer formed of a metal having a resistance lower than that of the resistor and a conductor layer formed on the grounding metal layer; a second-main-face-side wiring layer formed on the second main face; and a via which is formed in the substrate main body and which establishes electrical connectivity between the first-main-face-side wiring layers and the second-main-face-side wiring layer. The wiring substrate further includes a conductive covering layer which covers an upper surface and substantially covers the side surfaces of each of the first-main-face-side wiring layers.

Abstract: A ceramic substrate is provided that includes a ceramic substrate main body having a principal surface, and a connecting terminal portion disposed on the principal surface of the ceramic substrate main body that is capable of being connected to another component via solder. The connecting terminal portion includes a copper layer and a coating metal layer covering a surface of the copper layer. The ceramic substrate includes a contact layer disposed between the ceramic substrate main body and the copper layer. The contact layer includes one of a nickel-chromium alloy, chromium, molybdenum, and palladium, and is set back from a side surface of the copper layer in a substrate plane direction.

Abstract: A ceramic substrate is provided that includes a ceramic substrate main body including a principal surface, a connecting terminal portion disposed on the principal surface of the ceramic substrate main body that is capable of being connected to another component via solder, the connecting terminal portion including a copper layer and a coating metal layer covering a surface of the copper layer; a contact layer of titanium or chromium disposed between the ceramic substrate main body and the connecting terminal portion; and an intermediate layer disposed between the copper layer of the connecting terminal portion and the contact layer, the intermediate layer including one of a titanium-tungsten alloy, a nickel-chromium alloy, tungsten, palladium, and molybdenum. The contact layer and the intermediate layer are set back from a side surface of the copper layer in a substrate plane direction.

Abstract: A multilayer wiring substrate includes one or more resin dielectric layers (81), conductor layers (84), via conductors (91), and projecting portions (85). The one or more resin dielectric layers (81) individually having via holes (90) formed therein and extending through a first surface (82) and a second surface (83). The conductor layers (84) are formed from a conductive metal material and disposed on the first surface (82) of the one or more resin dielectric layers (81). The via conductors (91) are disposed in the respective via holes (90) and electrically connected to respective conductor layers (84). The projecting portions (85) are bent toward the main surface (72) or the back surface (73) of the multilayer wiring substrate, project from opening edges of respective via holes (90) toward center axes thereof, and penetrate into the respective via conductors (91).