Patents by Inventor Yuma TAKEUCHI

Yuma TAKEUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE
    Publication number: 20260146153
    Abstract: A resin composition for molding includes: an epoxy resin containing at least one of a phenol novolac type epoxy resin with an epoxy equivalent of 156 g/eq to 250 g/eq and a cresol novolac type epoxy resin with an epoxy equivalent of 156 g/eq to 250 g/eq; an active ester compound; and an inorganic filler.
    Type: Application
    Filed: November 21, 2023
    Publication date: May 28, 2026
    Applicant: RESONAC CORPORATION
    Inventors: Mika TANAKA, Yuma TAKEUCHI, Yuta SUKEGAWA, Shintaro OKADA
  • RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE
    Publication number: 20260098149
    Abstract: A resin composition for molding includes an epoxy resin, a curing agent containing an active ester compound, an inorganic filler, and a porous polymer particle.
    Type: Application
    Filed: November 13, 2023
    Publication date: April 9, 2026
    Applicant: RESONAC CORPORATION
    Inventors: Mika TANAKA, Yuma TAKEUCHI, Yuta SUKEGAWA, Shintaro OKADA
  • RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE AND METHOD OF PRODUCING ELECTRONIC COMPONENT DEVICE
    Publication number: 20260055256
    Abstract: A resin composition includes a compound having an oxazoline group, a phenol type curing agent, and an inorganic filler.
    Type: Application
    Filed: June 10, 2022
    Publication date: February 26, 2026
    Inventors: Yuta SUKEGAWA, Mika TANAKA, Yuma TAKEUCHI, Shintaro OKADA
  • PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGES
    Publication number: 20250385104
    Abstract: A production method for semiconductor packages according to the present disclosure includes: adhering an adhesive material to a surface of a first sealing material, peeling off the adhesive material from the surface of the first sealing material, and providing a second member to the surface of the first sealing material from which the adhesive material was peeled off.
    Type: Application
    Filed: January 13, 2022
    Publication date: December 18, 2025
    Inventors: Hirokazu NOMA, Tomohiro HAYASHI, Yuma TAKEUCHI, Kasumi NAKAMURA
  • RESIN COMPOSITION FOR MOLDING, AND ELECTRONIC COMPONENT DEVICE
    Publication number: 20250326926
    Abstract: The resin composition for molding includes: a sulfur atom-containing epoxy resin; a curing agent; a release agent; an inorganic filler; and a copolymer of a C5-30 ?-olefin and at least one of maleic anhydride and a maleic anhydride derivative.
    Type: Application
    Filed: November 21, 2023
    Publication date: October 23, 2025
    Applicant: RESONAC CORPORATION
    Inventors: Mika TANAKA, Takahiro HORIE, Yuma TAKEUCHI, Yuta SUKEGAWA
  • Liquid resin composition for sealing and electronic component device
    Patent number: 12269943
    Abstract: A liquid resin composition for sealing contains an epoxy resin (A); a curing agent (B) containing at least one amino group in a molecule; a polymer resin (C); and an inorganic filler (D), wherein the polymer resin (C) has a weight average molecular weight of 10,000 or more.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: April 8, 2025
    Assignee: RESONAC CORPORATION
    Inventors: Yuma Takeuchi, Hisato Takahashi, Hiroyoshi Deguchi
  • Sealing resin composition, electronic component device, and method of manufacturing electronic component device
    Patent number: 11873414
    Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 m2/g or more.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: January 16, 2024
    Assignee: RESONAC CORPORATION
    Inventors: Yuma Takeuchi, Hisato Takahashi, Yoshihito Inaba
  • Sealing resin composition, electronic component device, and method of manufacturing electronic component device
    Patent number: 11186742
    Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: November 30, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Yuma Takeuchi, Hisato Takahashi, Yoshihito Inaba
  • SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT DEVICE
    Publication number: 20210363380
    Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more.
    Type: Application
    Filed: August 3, 2021
    Publication date: November 25, 2021
    Inventors: Yuma TAKEUCHI, Hisato TAKAHASHI, Yoshihito INABA
  • Sealing resin composition, electronic component device, and method of manufacturing electronic component device
    Patent number: 11149164
    Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: October 19, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Yuma Takeuchi, Hisato Takahashi, Yoshihito Inaba
  • Sealing resin composition, electronic component device, and method of manufacturing electronic component device
    Patent number: 11111407
    Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: September 7, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Yuma Takeuchi, Hisato Takahashi, Yoshihito Inaba
  • SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT DEVICE
    Publication number: 20190233672
    Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more.
    Type: Application
    Filed: September 26, 2017
    Publication date: August 1, 2019
    Inventors: Yuma TAKEUCHI, Hisato TAKAHASHI, Yoshihito INABA
  • LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT DEVICE
    Publication number: 20190144660
    Abstract: A liquid resin composition for sealing contains an epoxy resin (A); a curing agent (B) containing at least one amino group in a molecule; a polymer resin (C); and an inorganic filler (D), wherein the polymer resin (C) has a weight average molecular weight of 10,000 or more.
    Type: Application
    Filed: May 11, 2016
    Publication date: May 16, 2019
    Inventors: Yuma TAKEUCHI, Hisato TAKAHASHI, Hiroyoshi DEGUCHI