Patents by Inventor Yuma TAKEUCHI

Yuma TAKEUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sealing resin composition, electronic component device, and method of manufacturing electronic component device
    Patent number: 11873414
    Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 m2/g or more.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: January 16, 2024
    Assignee: RESONAC CORPORATION
    Inventors: Yuma Takeuchi, Hisato Takahashi, Yoshihito Inaba
  • Sealing resin composition, electronic component device, and method of manufacturing electronic component device
    Patent number: 11186742
    Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: November 30, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Yuma Takeuchi, Hisato Takahashi, Yoshihito Inaba
  • SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT DEVICE
    Publication number: 20210363380
    Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more.
    Type: Application
    Filed: August 3, 2021
    Publication date: November 25, 2021
    Inventors: Yuma TAKEUCHI, Hisato TAKAHASHI, Yoshihito INABA
  • Sealing resin composition, electronic component device, and method of manufacturing electronic component device
    Patent number: 11149164
    Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: October 19, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Yuma Takeuchi, Hisato Takahashi, Yoshihito Inaba
  • Sealing resin composition, electronic component device, and method of manufacturing electronic component device
    Patent number: 11111407
    Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: September 7, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Yuma Takeuchi, Hisato Takahashi, Yoshihito Inaba
  • SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT DEVICE
    Publication number: 20190233672
    Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more.
    Type: Application
    Filed: September 26, 2017
    Publication date: August 1, 2019
    Inventors: Yuma TAKEUCHI, Hisato TAKAHASHI, Yoshihito INABA
  • LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT DEVICE
    Publication number: 20190144660
    Abstract: A liquid resin composition for sealing contains an epoxy resin (A); a curing agent (B) containing at least one amino group in a molecule; a polymer resin (C); and an inorganic filler (D), wherein the polymer resin (C) has a weight average molecular weight of 10,000 or more.
    Type: Application
    Filed: May 11, 2016
    Publication date: May 16, 2019
    Inventors: Yuma TAKEUCHI, Hisato TAKAHASHI, Hiroyoshi DEGUCHI