Patents by Inventor Yumeki Shinmura

Yumeki Shinmura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10669614
    Abstract: A sputtering target material, wherein the strength of a sputtering target material can be enhanced without using pure Ta to prevent cracking during sputtering and generating particles and to suppress an irregular composition of a sputtered film, is provided. The present invention provides a sputtering target material containing, in at %, 35% to 50% of Ta with the balance being Ni and an inevitable impurity, wherein the sputtering target is composed only of a Ni2Ta compound phase and a NiTa compound phase, and a microstructure in each of the Ni2Ta compound phase and the NiTa compound phase has a maximum inscribed circle diameter of not more than 10 ?m.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: June 2, 2020
    Assignee: Sanyo Special Steel Co., Ltd.
    Inventors: Hiroyuki Hasegawa, Yumeki Shinmura
  • Publication number: 20190309394
    Abstract: A sputtering target material, wherein the strength of a sputtering target material can be enhanced without using pure Ta to prevent cracking during sputtering and generating particles and to suppress an irregular composition of a sputtered film, is provided. The present invention provides a sputtering target material containing, in at %, 35% to 50% of Ta with the balance being Ni and an inevitable impurity, wherein the sputtering target is composed only of a Ni2Ta compound phase and a NiTa compound phase, and a microstructure in each of the Ni2Ta compound phase and the NiTa compound phase has a maximum inscribed circle diameter of not more than 10 ?m.
    Type: Application
    Filed: May 22, 2017
    Publication date: October 10, 2019
    Inventors: Hiroyuki Hasegawa, Yumeki Shinmura