Abstract: The present invention provides an epoxy resin solution, from which an epoxy resin-cured product adequately excellent in heat-resisting properties and dielectric properties can be obtained with adequately good working properties ensured. The present invention relates to an epoxy resin solution containing at least a curing agent and an epoxy resin mixed in an organic solvent, wherein the curing agent comprises an imide group-containing curing agent having 1-4 imide groups and 2-4 glycidyl group-reactive functional groups in a molecule.

Abstract: A polyester resin comprises a dicarboxylic acid component and a glycol component, wherein the glycol component contains ethylene glycol together with diethylene glycol and triethylene glycol, and a content of triethylene glycol in the glycol component is more than 0.1 mol % and 5.5 mol % or less.

Abstract: The present invention provides an epoxy resin solution, from which an epoxy resin-cured product adequately excellent in heat-resisting properties and dielectric properties can be obtained with adequately good working properties ensured. The present invention relates to an epoxy resin solution containing at least a curing agent and an epoxy resin mixed in an organic solvent, wherein the curing agent comprises an imide group-containing curing agent having 1-4 imide groups and 2-4 glycidyl group-reactive functional groups in a molecule.

Abstract: The present invention provides a production method of an organic compound, in which a reaction is performed between functional groups without using any solvents. The present invention relates to a production method of an organic compound, in which a reaction is performed between functional groups by using a mechanochemical effect.

Abstract: The present invention is to provide a polyamide-imide which has a high regularity of molecular structure and few branched structures, does not contain hydrogen halide, is not required to be separated and purified in post processes, and can be suitably used as a film, a varnish, or a molding material; raw material salt of polyamide-imide and production method thereof. The polyamide-imide has a repeating unit represented by the general formula (1): in which R1, R2 represent independently a divalent residue having an aromatic ring, an aliphatic ring or an aliphatic hydrocarbon; R3, R4 represent independently a trivalent residue having an aromatic ring or an aliphatic ring; and an hydrogen atom bonding to the respective rings may be replaced by another atom or an atomic group.

Abstract: An object of the present invention is to provide an industrially advantageous method for producing a bisimide dicarboxylic acid, which uses substantially no solvent and requires no granulation after completion of the reaction.

Abstract: An object of the present invention is to provide an industrially advantageous method for producing a bisimide dicarboxylic acid, which uses substantially no solvent and requires no granulation after completion of the reaction.

Abstract: The present invention is to provide a polyamide-imide which has a high regularity of molecular structure and few branched structures, does not contain hydrogen halide, is not required to be separated and purified in post processes, and can be suitably used as a film, a varnish, or a molding material; raw material salt of polyamide-imide and production method thereof. The polyamide-imide has a repeating unit represented by the general formula (1): in which R1, R2 represent independently a divalent residue having an aromatic ring, an aliphatic ring or an aliphatic hydrocarbon; R3, R4 represent independently a trivalent residue having an aromatic ring or an aliphatic ring; and an hydrogen atom bonding to the respective rings may be replaced by another atom or an atomic group.