Abstract: An organic LED element includes a transparent substrate; a light scattering layer formed on the transparent substrate; a transparent first electrode formed on the light scattering layer; an organic light emitting layer formed on the first electrode; and a second electrode formed on the organic light emitting layer, wherein the light scattering layer includes a base material made of glass, and a plurality of scattering substances dispersed in the base material, and wherein a coating layer, which is not a molten glass, is provided between the light scattering layer and the first electrode.

Abstract: A translucent substrate may include a transparent support substrate, and a light extracting layer formed on the transparent support substrate, including a glass material having a first refractive index in a range of 1.6 to 2.2 for D line, and a scattering material having a second refractive index different from the first refractive index for the D line. The light extracting layer may have a surface formed with a plurality of projections including at least one of an approximately pyramid-shaped projection having one peak point and an approximately triangular prism-shaped projection having one peak edge. An inclination angle formed by an edge and a base edge of an approximate triangle, obtained in a vertical cross section passing through the peak point or the peak edge of the projection, may be in a range of 10° to 60°.

Abstract: A substrate includes an auxiliary wiring pattern formed on a first main surface of a glass substrate in a grid-like pattern arranged horizontally and vertically, and a translucent glass layer formed on a surface of the glass substrate to cover the first main surface and the auxiliary wiring pattern. Through-holes exposing the auxiliary wiring pattern are formed in a portion of the translucent glass layer formed on the auxiliary wiring pattern, in each side of each grid of the grid-like pattern at uniform intervals. The substrate may be used in an electronic device having a long-life and a high reliability in which exfoliation or deterioration of a wiring is inhibited by embedding the wiring therein while maintaining smoothness of the surface.

Abstract: The present invention relates to an organic LED element sequentially including: a transparent substrate; a scattering layer; a first electrode; an organic layer; and a second electrode, in which the scattering layer includes a first glass material and a second glass material dispersed in the first glass material and having a different refractive index from the first glass material.

Abstract: The present invention relates to an organic LED element sequentially including: a transparent substrate; a scattering layer; a first electrode; an organic layer; and a second electrode, in which the scattering layer includes a first glass material and a second glass material dispersed in the first glass material and having a different refractive index from the first glass material.

Abstract: Provided is a substrate for an electronic device for providing an electronic device having a long-life and a high reliability in which exfoliation or deterioration of a wiring is inhibited by embedding the wiring therein while maintaining smoothness of the surface. The substrate is a substrate 100 for an electronic device, including a first and a second main surfaces facing each other, in which an electrode wiring is formed on the first main surface. The substrate 100 for an electronic device includes a glass substrate 101, an auxiliary wiring pattern 200 formed on the first main surface on the glass substrate 101, and a translucent glass layer 102 formed on the surface of the glass substrate 100 to cover the upper layer of the auxiliary wiring pattern 200, in which through-holes H exposing the auxiliary wiring pattern 200 are formed in a portion of the glass layer 102.

Abstract: A process for producing a glass substrate having a circuit pattern is disclosed. The process includes forming a thin film layer on a glass substrate and then irradiating the thin film layer with laser light to form a circuit pattern on the glass substrate; depositing a low-melting point glass having a softening point of from 450 to 630° C. on the glass substrate having the circuit pattern formed thereon; and sintering the low-melting point glass to form a low-melting point glass layer which includes the low-melting point glass sintered on the glass substrate having the circuit pattern formed thereon and which forms a compatible layer between the glass substrate and the low-melting point glass layer.

Abstract: The invention provides a process for producing a glass substrate (10) having a circuit pattern (26), which includes a circuit pattern formation step of forming a thin film layer (12) on a glass substrate and then irradiating the thin film layer with laser light (22) to form a circuit pattern on the glass substrate; a low-melting point glass deposition step of depositing a low-melting point glass (28) having a softening point of from 450 to 630° C. on the glass substrate having the circuit pattern formed thereon; and a sintering step of sintering the low-melting point glass to form a low-melting point glass layer (32) comprising the low-melting point glass sintered on the glass substrate having the circuit pattern formed thereon and to form a compatible layer (34) between the glass substrate and the low-melting point glass layer.

Abstract: Provided is a nonlead glass for covering an electrode, which comprises, in mol %, B2O3 15-65%, SiO2 2-38%, MgO 2-30%, MgO+CaO+SrO+BaO 5-45%, Li2O 1-15%, Li2O+Na2O+K2O 2-25% and others, and which comprises ZnO 0-15%. Provided is a nonlead glass for covering an electrode, which comprises, in mol %, B2O3 25-65%, SiO2 2-38%, MgO 2-30%, MgO+CaO+SrO+BaO 5-45%, Li2O+Na2O+K2O 2-25%, Al2O3 0-30, TiO 0-10% and ZnO 0-15%.

Abstract: Provided is a nonlead glass for covering an electrode, which comprises, in mol %, B2O3 15-65%, SiO2 2-38%, MgO 2-30%, MgO+CaO+SrO+BaO 5-45%, Li2O 1-15%, Li2O+Na2O+K2O 2-25% and others, and which comprises ZnO 0-15%. Provided is a nonlead glass for covering an electrode, which comprises, in mol %, B2O3 25-65%, SiO2 2-38%, MgO 2-30%, MgO+CaO+SrO+BaO 5-45%, Li2O+Na2O+K2O 2-25%, Al2O3 0-30, TiO 0-10% and ZnO 0-15%.

Abstract: Provided is a nonlead glass for covering an electrode, which comprises, in mol%, B2O3 15-65%, SiO2 2-38%, MgO 2-30%, MgO+CaO+SrO+BaO 5-45%, Li2O 1-15%, Li2O+Na2O+K2O 2-25% and others, and which comprises ZnO 0-15%. Provided is a nonlead glass for covering an electrode, which comprises, in mol %, B2O3 25-65%, SiO2 2-38%, MgO 2-30%, MgO+CaO+SrO+BaO 5-45%, Li2O+Na2O+K2O 2-25%, Al2O3 0-30, TiO 0-10% and ZnO 0-15%.

Abstract: A glass for covering electrodes, which consists, as represented by mass percentage based on the following oxides, essentially of: Mass percentage PbO 44 to 68% Bi2O3 0 to 18%, B2O3 19 to 23%, SiO2 1.2 to 5%, Al2O3 2 to 6%, ZnO 4 to 9%, CuO 0.1 to 0.5%, In2O3 1.1 to 2%, SnO2 0 to 1%, and CeO2 0 to 1%.

Abstract: A low melting point glass for covering electrodes, which contains Cu in a content as calculated as CuO within a range of from 0.1 to 0.9% by mass percentage and which contains neither Mo or Sb.

Abstract: A glass for covering electrodes, which consists, as represented by mass percentage based on the following oxides, essentially of: 1 Mass percentage PbO 44 to 68% Bi2O3 0 to 18%, B2O3 19 to 23%, SiO2 1.2 to 5%, Al2O3 2 to 6%, ZnO 4 to 9%, CuO 0.1 to 0.5%, In2O3 1.1 to 2%, SnO2 0 to 1%, and CeO2 0 to 1%.

Abstract: A low melting point glass for covering electrodes, consisting, as represented by mass percentage based on the following oxides, essentially of: Mass percentage PbO 20 to 60%, Bi2O3  0 to 30%, B2O3 20 to 55%, SiO2  0 to 10%, Al2O3  0 to 15%, MgO + CaO  0 to 35%, SrO  0 to 35%, BaO  0 to 35%, ZnO  0 to 8%.

Abstract: A substrate for a plasma display panel, having electrodes and a covering material for the electrodes, provided thereon, wherein the covering material is a non-crystallizable glass having a softening point of at most 510.degree. C. and an average thermal expansion coefficient of from 70.times.10.sup.-7 to 85.times.10.sup.-7 /.degree.C. within a range of from 50 to 350.degree. C.

Abstract: A water-color ink composition comprising a fusible inorganic component, an aqueous medium and an organic binder soluble and/or dispersible in the aqueous binder.

Abstract: A surface conductive paste composition to be applied to the surface of a green sheet for a cermaic substrate or to the surface of a ceramic substrate after being fired and to be then fired, the solid content of which has a composition comprising from 80 to 99.9% by weight of Au powder, from 0.1 to 20% by weight of crystallized glass frit and from 0 to 19.9% by weight of non-crystallized glas frit, provided that the total of the crystallized glass frit and the non-crystallized glass frit is at most 20% by weight, and which has a lead compound powder incorporated in an amount of from 0 to 5% by weight based on the total amount of said composition.

Abstract: A surface conductive paste composition to be applied to the surface of a green sheet for a ceramic substrate or to the surface of a ceramic substrate after being fired and to be then fired, the solid content of which has a composition comprising from 80 to 99.9% by weight of Au powder, from 0.1 to 20% by weight of crystallized glass frit and from 0 to 19.9% by weight of non-crystallized glass frit, provided that the total of the crystallized glass frit and the non-crystallized glass frit is at most 20% by weight, and which has a lead compound powder incorporated in an amount of from 0 to 5% by weight based on the total amount of said composition.