Abstract: A biological information recording device as an example of the present disclosure includes: an acquisition processor configured to acquire biological information on a subject, which is detected by a biological information sensor, and a recording processor configured to record the biological information acquired by the acquisition processor, and to further record, when a designation operation that designates a task to be carried out by the subject is performed by an observer who observes the subject during recording of the biological information, the task in association with the biological information.

Abstract: A mold-preventing air filter filtration medium loaded with a water-retaining macromolecule polymer, a mold-preventing agent, and a binder resin, is formed by immersing a filter material or a reinforcing nonwoven fabric (a backing material) in a mold-preventing composition in which the water-retaining macromolecule polymer, the mold-preventing agent and the binder resin are dissolved, and drying the filter material or the reinforcing nonwoven fabric. The reinforcing nonwoven fabric (a backing material) may be bonded to a filter material to form a mold-preventing air filter filtration medium. A mold-preventing air filter includes the mold-preventing air filter filtration medium that is pleated and accommodated in a frame.

Abstract: A mold-preventing air filter filtration medium loaded with a water-retaining macromolecule polymer, a mold-preventing agent, and a binder resin, is formed by immersing a filter material or a reinforcing nonwoven fabric (a backing material) in a mold-preventing composition in which the water-retaining macromolecule polymer, the mold-preventing agent and the binder resin are dissolved, and drying the filter material or the reinforcing nonwoven fabric. The reinforcing nonwoven fabric (a backing material) may be bonded to a filter material to form a mold-preventing air filter filtration medium. A mold-preventing air filter includes the mold-preventing air filter filtration medium that is pleated and accommodated in a frame.

Abstract: A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20–60 ?m. Each of the lead-free solder particles can contain Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

Abstract: A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20-60 &mgr;m. Each of the lead-free solder particles can contain Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

Abstract: A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

Abstract: A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

Abstract: A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

Abstract: A lead-free solder alloy composition contains Sn, Bi and In, with respective contents such that the solder alloy composition provides a liquidus temperature below the heat resistant temperature of a work to be soldered. The alloy contains not more than about 60 wt % Bi; not more than about 50 wt % In; optionally at least one element selected from Ag, Zn, Ge, Ga, Sb, and P; and Sn. Also, lead-free solder powders containing same, and printed circuit boards, electronic components and electronic apparati employing such alloy.