Patents by Inventor Yumiko Kawana

Yumiko Kawana has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11915973
    Abstract: A substrate processing method includes providing a substrate containing a metal surface and a dielectric material surface, selectively forming a sacrificial capping layer containing a self-assembled monolayer on the metal surface, removing the sacrificial capping layer to restore the metal surface, and processing the restored metal surface and the dielectric material surface. The sacrificial capping layer may be used to prevent metal diffusion into the dielectric material and to prevent oxidation and contamination of the metal surface while waiting for further processing of the substrate.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: February 27, 2024
    Assignee: Tokyo Electron Limited
    Inventors: Ainhoa Romo Negreira, Yumiko Kawana, Dina Triyoso
  • Publication number: 20210175118
    Abstract: A substrate processing method includes providing a substrate containing a metal surface and a dielectric material surface, selectively forming a sacrificial capping layer containing a self-assembled monolayer on the metal surface, removing the sacrificial capping layer to restore the metal surface, and processing the restored metal surface and the dielectric material surface. The sacrificial capping layer may be used to prevent metal diffusion into the dielectric material and to prevent oxidation and contamination of the metal surface while waiting for further processing of the substrate.
    Type: Application
    Filed: December 8, 2020
    Publication date: June 10, 2021
    Inventors: Ainhoa Romo Negreira, Yumiko Kawana, Dina Triyoso