Patents by Inventor Yumiko Omiya

Yumiko Omiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8794951
    Abstract: An object of the present invention is to provide a mold for resin molding which ensures ventilation characteristic without requiring an enormous amount of work. The mold for resin molding of the present invention includes: a mold 12; a design layer 16 formed inside the mold 12; and a air permeable interposing layer 22 for forming the design layer 16 on an inner surface of the mold 12. The mold 12 forms a ventilating throughhole 14. The design layer 16 is made of a resin having projections and depressions on the surface, and has a ventilating throughhole 18 formed so as to couple to the ventilating throughhole 14. The air permeable interposing layer 22 is arranged next to the inner surface of the mold 12 so that an inner surface of the design layer 16, the ventilating throughhole 18 of the design layer 16, and the ventilating throughhole 14 of the mold 12 couple to each other.
    Type: Grant
    Filed: November 21, 2007
    Date of Patent: August 5, 2014
    Assignee: Tanazawa Hallosha Co., Ltd.
    Inventors: Sadayuki Yoneshima, Masayuki Sakai, Hisao Aota, Hiroshi Watanabe, Mitsuaki Samejima, Yumiko Omiya
  • Publication number: 20120064308
    Abstract: A method for forming a convex pattern on a surface of a sheet includes the steps of covering a photosensitive resin film 21 with a masking film 4 having a convex forming area 40 corresponding to a convex pattern to be obtained, exposing the photosensitive resin film 21 to light from an outside of the masking film 4, and removing an unexposed portion of the photosensitive resin film 21 subjected to the exposing step, thereby forming a sheet 2 with an exposed portion 22 left, and the convex forming area 40 of the masking film 4 has a semi-translucent portion 43 and a translucent portion 41 formed in sequence at an outside of a light-shielding portion 42 in order to express a shade in gradation, and a light transmittance increases stepwise from the light-shielding portion 42 toward the translucent portion 41.
    Type: Application
    Filed: April 8, 2010
    Publication date: March 15, 2012
    Inventors: Sadayuki Yoneshima, Mitsushi Sogabe, Hisao Aota, Masayuki Goryozono, Yumiko Omiya
  • Publication number: 20100075149
    Abstract: An object of the present invention is to provide a mold for resin molding which ensures ventilation characteristic without requiring an enormous amount of work. The mold for resin molding of the present invention includes: a mold 12; a design layer 16 formed inside the mold 12; and a air permeable interposing layer 22 for forming the design layer 16 on an inner surface of the mold 12. The mold 12 forms a ventilating throughhole 14. The design layer 16 is made of a resin having projections and depressions on the surface, and has a ventilating throughhole 18 formed so as to couple to the ventilating throughhole 14. The air permeable interposing layer 22 is arranged next to the inner surface of the mold 12 so that an inner surface of the design layer 16, the ventilating throughhole 18 of the design layer 16, and the ventilating throughhole 14 of the mold 12 couple to each other.
    Type: Application
    Filed: November 21, 2007
    Publication date: March 25, 2010
    Applicant: TANAZAWA HAKKOSHO CO., LTD.
    Inventors: Sadayuki Yoneshima, Masayuki Sakai, Hisao Aota, Hiroshi Watanabe, Mitsuaki Samejima, Yumiko Omiya