Abstract: A mover includes a body, an axle, a drive wheel, a motor, a speed reducer, and a shaft coupling. The wheel is arranged rotatably around the axle. The reducer is attached to the axle to reduce and transmit rotational power of the motor and includes an output shaft aligned with a center axis of the axle. The coupling transmits the rotational power of the reducer to the wheel and includes a cylindrical portion having an annular shape when viewed along the center axis and housing the reducer at least partially inside. The cylindrical portion includes an input portion and an output portion at first and second ends, respectively, along the center axis. The cylindrical portion further includes an absorber between the input and output portions to absorb deviation and an angle of deviation between respective rotational center axes of the output shaft and the drive wheel.

Abstract: A method for manufacturing a solid electrolyte capacitor, the method including: preparing a connection body including a frame and a plurality of capacitor elements, the frame including a plurality of element connection units and a coupling portion that integrally couples the plurality of element connection units with each other, the plurality of element connection units being provided along a first direction and a second direction intersecting with first direction the plurality of capacitor elements being connected to the plurality of element connection units; sealing the plurality of capacitor elements by using a sealing resin having a stripe shape that extends in the first direction; forming a groove in the sealing resin by running a blade along the second direction between the capacitor elements adjacent in the first direction; and segmenting the plurality of capacitor elements by cutting the sealing resin along a bottom surface of the groove by laser and cutting a boundary between each of the plurality of

Abstract: A method for manufacturing a solid electrolyte capacitor, the method including: preparing a connection body including a frame and a plurality of capacitor elements, the frame including a plurality of element connection units and a coupling portion that integrally couples the plurality of element connection units with each other, the plurality of element connection units being provided along a first direction and a second direction intersecting with first direction the plurality of capacitor elements being connected to the plurality of element connection units; sealing the plurality of capacitor elements by using a sealing resin having a stripe shape that extends in the first direction; forming a groove in the sealing resin by running a blade along the second direction between the capacitor elements adjacent in the first direction; and segmenting the plurality of capacitor elements by cutting the sealing resin along a bottom surface of the groove by laser and cutting a boundary between each of the plurality of

Abstract: A semiconductor device includes: a flat plate; a semiconductor chip which is disposed on one main surface of the flat plate and whose surface opposite an element circuit surface is fixedly bonded; a single layer of an insulating material layer formed continuously on the element circuit surface of the semiconductor chip and on the main surface of the flat plate; an opening formed at a position, in the insulating material layer, above an electrode disposed on the element circuit surface of the semiconductor chip; a conductive part formed in the opening so as to be connected to the electrode of the semiconductor chip; a wiring layer formed on the insulating material layer so as to be connected to the conductive part, and partly led out to a peripheral area of the semiconductor chip; and external electrodes formed on the wiring layer.