Patents by Inventor Yumiko Shibusawa

Yumiko Shibusawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150084087
    Abstract: According to one embodiment, there is provided a light emitting module including a board, a semiconductor light emitting element, an electronic component, a first pad, and a second pad. The surface of the first pad on the board is covered with a metal film. The semiconductor light emitting element is mounted on the first pad. The surface of the second pad on the board is covered with a metal film. The electric component is mounted on the second pad. The semiconductor light emitting element is wire-bonded on the first pad covered with the metal film. The electric component is joined by solder on the second pad covered with the metal film. The metal film covering the first pad has a film structure lower in density than the metal film covering the second pad.
    Type: Application
    Filed: March 19, 2014
    Publication date: March 26, 2015
    Applicant: TOSHIBA LIGHTING & TECHNOLOGY CORPORATION
    Inventors: Yumiko Shibusawa, Takuya Honma