Patents by Inventor Yumiko Tsurumi

Yumiko Tsurumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device
    Patent number: 6617701
    Abstract: An epoxy resin composition to seal semiconductors constructed of a semiconductor element, a base to support said semiconductor element, and an epoxy resin composition covering only one side opposite to the base, said epoxy resin composition comprising (A) epoxy resin, (B) hardener, and (C) inorganic filler, and giving a cured product which has (a) a flexural modulus of elasticity of 10 to 30 GPa at 23° C. and (b) a coefficient of linear expansion of 4×10−6/K to 10×10−6/K in the temperature range from 23° C. to the glass transition point, with the product of (a) and (b) being smaller than 2×10−4 GPa/K.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: September 9, 2003
    Assignee: Toray Industries, Inc.
    Inventors: Masayuki Tanaka, Yumiko Tsurumi
  • Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device
    Publication number: 20020014706
    Abstract: An epoxy resin composition to seal semiconductors constructed of a semiconductor element, a base to support said semiconductor element, and an epoxy resin composition covering only one side opposite to the base, said epoxy resin composition comprising (A) epoxy resin, (B) hardener, and (C) inorganic filler, and giving a cured product which has (a) a flexural modulus of elasticity of 10 to 30 GPa at 23° C. and (b) a coefficient of linear expansion of 4×10−6/K to 10×10−6/K in the temperature range from 23° C. to the glass transition point, with the product of (a) and (b) being smaller than 2×10−4 GPa/K.
    Type: Application
    Filed: March 13, 2001
    Publication date: February 7, 2002
    Applicant: Toray Industries, Inc.
    Inventors: Masayuki Tanaka, Yumiko Tsurumi
  • Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device
    Patent number: 6214904
    Abstract: An epoxy resin composition to seal semiconductors constructed of a semiconductor element, a base to support said semiconductor element, and an epoxy resin composition covering only one side opposite to the base, said epoxy resin composition comprising (A) epoxy resin, (B) hardener, and (C) inorganic filler, and giving a cured product which has (a) a flexural modulus of elasticity of 10 to 30 GPa at 23° C. and (b) a coefficient of linear expansion of 4×10−6/K to 10×10−6/K in the temperature range from 23° C. to the glass transition point, with the product of (a) and (b) being smaller than 2×10−4 GPa/K.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: April 10, 2001
    Assignee: Toray Industries, Inc.
    Inventors: Masayuki Tanaka, Yumiko Tsurumi