Abstract: An electronic vaporization device for heating and vaporizing an aerosol-forming substrate includes: a vaporization cavity for accommodating the aerosol-forming substrate; a microwave generating circuit for generating a microwave according to a preset microwave frequency; a microwave transmitting antenna connected to the microwave generating circuit for sweeping and transmitting the microwave within a preset microwave frequency range, and transmitting the microwave to the vaporization cavity to heat the aerosol-forming substrate; a feedback acquisition circuit for acquiring a feedback signal corresponding to the microwave of the preset microwave frequency that is transmitted by the microwave transmitting antenna; and a microwave control circuit connected to the microwave generating circuit and the feedback acquisition circuit, respectively, the microwave control circuit determining the preset microwave frequency and control the microwave generating circuit to generate the microwave according to the preset micr

Abstract: A heating assembly applied to an electronic vaporization device includes: a ceramic substrate; and a heating layer including stainless steel and inorganic non-metal. The heating layer heats a substrate to be vaporized to form an aerosol and has a temperature coefficient of resistance (TCR) temperature-sensitive characteristic. The inorganic non-metal adjusts the TCR of the heating layer.

Abstract: A heating element for vaporization includes: a surface provided with a microgroove portion, the microgroove portion being arranged at least on one side of the heating element that is away from a preset liquid absorbing element, the microgroove portion having a microgroove, an opening of the microgroove being connected with the preset liquid absorbing element. The heating element is connectable with the preset liquid absorbing element to heat and vaporize to-be-vaporized liquid.

Abstract: A heating element including a dense substrate and a heating film is disclosed. The dense substrate includes a first surface and a second surface opposite to the first surface. A plurality of micro-pores are arranged in the dense substrate. The micro-pores are through holes, and each of the micro-pores is configured to guide an aerosol-forming medium to the first surface. The heating film is formed on the first surface. A ratio of a thickness of the dense substrate to a pore size of the micro-pore is in a range of 20:1-3:1.