Patents by Inventor Yun Ah KIM
Yun Ah KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240162113Abstract: In one example, an electronic device comprises a substrate comprising a conductive structure and an inner side and an outer side, a first electronic component over the inner side of the substrate and coupled with the conductive structure, a lid over the substrate and the first electronic component and comprising a first hole in the lid, and a thermal interface material between the first electronic component and the lid. The thermal interface material is in the first hole. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: November 11, 2022Publication date: May 16, 2024Applicants: Amkor Technology Singapore Holding Pte. Ltd., Amkor Technology Singapore Holding Pte. Ltd.Inventors: Dong Hyeon Park, Yun Ah Kim, Seok Ho Na, Won Ho Choi, Dong Su Ryu, Jo Hyun Bae, Min Jae Kong, Jin Young Khim, Jae Yeong Bae, Dong Hee Kang
-
Patent number: 11854991Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.Type: GrantFiled: October 26, 2021Date of Patent: December 26, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jin Seong Kim, Yeong Beom Ko, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim, Yong Jae Ko, Ji Chang Lee
-
Patent number: 11715714Abstract: In one example, a semiconductor device structure relates to an electronic device, which includes a device top surface, a device bottom surface opposite to the device top surface, device side surfaces extending between the device top surface and the device bottom surface, and pads disposed over the device top surface. Interconnects are connected to the pads, and the interconnects first regions that each extend from a respective pad in in an upward direction, and second regions each connected to a respective first region, wherein each second region extends from the respective first region in a lateral direction. The interconnects comprise a redistribution pattern on the pads. Other examples and related methods are also disclosed herein.Type: GrantFiled: August 20, 2021Date of Patent: August 1, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Yeong Beom Ko, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim
-
Publication number: 20220181265Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: October 26, 2021Publication date: June 9, 2022Inventors: Jin Seong Kim, Yeong Beom Ko, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim, Yong Jae Ko, Ji Chang Lee
-
Publication number: 20210384151Abstract: In one example, a semiconductor device structure relates to an electronic device, which includes a device top surface, a device bottom surface opposite to the device top surface, device side surfaces extending between the device top surface and the device bottom surface, and pads disposed over the device top surface. Interconnects are connected to the pads, and the interconnects first regions that each extend from a respective pad in in an upward direction, and second regions each connected to a respective first region, wherein each second region extends from the respective first region in a lateral direction. The interconnects comprise a redistribution pattern on the pads. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: August 20, 2021Publication date: December 9, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Yeong Beom KO, Jo Hyun BAE, Sung Woo LIM, Yun Ah KIM
-
Patent number: 11158582Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.Type: GrantFiled: December 4, 2019Date of Patent: October 26, 2021Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jin Seong Kim, Yeong Beom Ko, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim, Yong Jae Ko, Ji Chang Lee
-
Patent number: 11121105Abstract: In one example, a semiconductor device structure relates to an electronic device, which includes a device top surface, a device bottom surface opposite to the device top surface, device side surfaces extending between the device top surface and the device bottom surface, and pads disposed over the device top surface. Interconnects are connected to the pads, and the interconnects first regions that each extend from a respective pad in in an upward direction, and second regions each connected to a respective first region, wherein each second region extends from the respective first region in a lateral direction. The interconnects comprise a redistribution pattern on the pads. Other examples and related methods are also disclosed herein.Type: GrantFiled: July 6, 2019Date of Patent: September 14, 2021Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Yeong Beom Ko, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim
-
Publication number: 20210175177Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: December 4, 2019Publication date: June 10, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jin Seong Kim, Yeong Beom Ko, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim, Yong Jae Ko, Ji Chang Lee
-
Publication number: 20210005563Abstract: In one example, a semiconductor device structure relates to an electronic device, which includes a device top surface, a device bottom surface opposite to the device top surface, device side surfaces extending between the device top surface and the device bottom surface, and pads disposed over the device top surface. Interconnects are connected to the pads, and the interconnects first regions that each extend from a respective pad in in an upward direction, and second regions each connected to a respective first region, wherein each second region extends from the respective first region in a lateral direction. The interconnects comprise a redistribution pattern on the pads. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: July 6, 2019Publication date: January 7, 2021Applicant: Amkor Technology Korea, Inc.Inventors: Yeong Beom KO, Jo Hyun BAE, Sung Woo LIM, Yun Ah KIM
-
Patent number: 9968712Abstract: Provided is an organic/inorganic hybrid-porous biodegradable polymer scaffold, which includes basic ceramic nanoparticles, an animal tissue or cell-derived bioactive first extracellular matrix material, and a biodegradable polymer and in which inner walls of pores are coated with a second extracellular matrix material.Type: GrantFiled: December 13, 2016Date of Patent: May 15, 2018Assignee: Korea Institute of Science and TechnologyInventors: Dong Keun Han, Yoon Ki Joung, Eugene Lih, Yun Ah Kim
-
Publication number: 20180117218Abstract: Provided is an organic/inorganic hybrid-porous biodegradable polymer scaffold, which includes basic ceramic nanoparticles, an animal tissue or cell-derived bioactive first extracellular matrix material, and a biodegradable polymer and in which inner walls of pores are coated with a second extracellular matrix material.Type: ApplicationFiled: December 13, 2016Publication date: May 3, 2018Applicant: Korea Institute of Science and TechnologyInventors: Dong Keun HAN, Yoon Ki JOUNG, Eugene LIH, Yun Ah KIM